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370-BCGL Dell 96GB DDR5 6400MT/s PC5-51200 Memory.

370-BCGL
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Brief Overview of 370-BCGL

Dell 370-BCGL 96GB DDR5 6400MT/s PC5-51200 CL52 ECC Ddr5 Sdram 288-pin Rdimm Memory Module. New Sealed in Box (NIB) - Samsung Version

$2,551.50
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SKU/MPN370-BCGLAvailability✅ In StockProcessing TimeUsually ships same day ManufacturerDell Product/Item ConditionNew Sealed in Box (NIB) ServerOrbit Replacement Warranty1 Year Warranty
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Description

Comprehensive Product Summary

Main Specifications

  • Brand Name: Dell
  • Part Number: 370-BCGL
  • Product Type: 96GB DDR5 Memory Module

Technical Information

  • Capacity: 96 Gigabytes
  • Technology Type: DDR5 SDRAM
  • Module Count: Single 96GB Stick
  • Transfer Rate: 6400MT/s (DDR5-6400 / PC5-51200)
  • Error Correction: ECC (Error-Correcting Code)
  • Signal Type: Registered (Buffered)
  • Latency Timing: CL52
  • Rank Configuration: Dual Rank x4

Physical Design Specifications

  • Interface Format: 288-Pin RDIMM
  • Package Dimensions: Height: 1.00", Depth: 6.75"

Advanced Compatibility & Reliability

Optimized for Enterprise Systems

  • Ideal for high-performance server environments
  • Supports advanced data integrity with ECC
  • Registered signal processing ensures stable operation

Enterprise-Level Benefits

  • Massive 96GB capacity for memory-intensive workloads
  • Next-gen DDR5 speed for faster data throughput
  • Reliable dual-rank architecture for improved bandwidth
  • Precision-engineered by Dell for enterprise-grade systems

Dell 370-BCGL 96GB DDR5 Memory Kit

The Dell 370-BCGL 96GB (1x96GB) 6400MT/s PC5-51200 ECC Registered Dual Rank x4 CL52 1.1V DDR5 SDRAM 288-pin RDIMM is a high-density server memory module engineered for modern enterprise workloads that require large addressable memory pools, sustained throughput, and hardware-level error correction. This single-module 96GB RDIMM is built to deliver the combination of capacity, bandwidth and reliability expected in rack, tower, and blade server environments that support DDR5 registered memory. With an effective transfer rate of 6400MT/s (PC5-51200) and a CAS latency rating of CL52, the 370-BCGL module optimizes both peak bandwidth and deterministic latency for memory-intensive applications.

Key Specifications

The 370-BCGL module follows the DDR5 RDIMM form factor with a 288-pin connector and operates at a nominal voltage of 1.1 volts. It is ECC-registered (RDIMM) and implements Dual Rank organization with x4 data lanes per DRAM die. The part is specified to PC5-51200 performance (6400MT/s), CL52 timing, and supports full ECC functionality for single-bit error correction and multi-bit detection as implemented by server memory controllers. The module’s physical and electrical design adheres to JEDEC DDR5 guidelines for registered server memory, delivering compatibility with platforms that accept DDR5 RDIMMs and support the stated speed and rank topology.

Memory Architecture — Dual Rank x4

Dual Rank configuration means the module presents two independently addressable memory ranks to the memory controller, increasing effective parallelism and potentially improving throughput in multi-threaded and multi-socket systems. The x4 die organization denotes the internal data width of each DRAM die, which impacts error-correcting capabilities and spare-bit architecture used by ECC logic. This architecture balances high capacity (96GB per module) with robust error management and predictable performance across a wide range of server workloads.

Performance Characteristics

At 6400MT/s, the Dell 370-BCGL module targets data-streaming and compute scenarios that benefit from wide memory channels and high sustained bandwidth. The PC5-51200 bandwidth envelope enables improved performance in memory-bound operations such as in-memory databases, large-scale virtualization hosts, analytics, and real-time caching layers. CL52 timing reflects DDR5’s tradeoff between increased data-rate and absolute CAS numbers; real-world latency depends on platform command timing and interleaving provided by the host memory controller and number of populated ranks and channels.

Use Cases

The module is suited for servers running dense virtual machine consolidation, large column-store and in-memory databases, high-performance compute nodes that require large working sets, and analytics clusters that aggregate large datasets into RAM for low-latency processing. Because of its high per-module capacity, it enables higher total system memory with fewer modules, which is advantageous for systems with limited DIMM slots and for reducing power and cooling complexity at scale.

Virtualization and Multi-tenant Workloads

Consolidating many VMs or containers benefits strongly from large modules like the 96GB RDIMM. Fewer modules to reach target system memory reduces channel contention and simplifies capacity planning, while ECC registration maintains data integrity across multi-tenant environments. The module’s throughput characteristics help maintain consistent VM performance when multiple guests generate parallel memory traffic.

Reliability, Availability and Serviceability (RAS)

ECC Registered functionality is central to server-grade reliability. The Dell 370-BCGL supports on-module parity and ECC bits that work with the system’s memory controller to detect and correct single-bit errors and flag multi-bit errors, improving long-term data integrity and reducing silent data corruption risk. Registered buffering reduces electrical loading on the memory bus, enabling higher capacity configurations with improved signal integrity. Designed for 24/7 operation, the module undergoes manufacturing-level burn-in and validation testing to meet enterprise reliability expectations.

Wide Compatibility 

Compatibility requires a server platform that explicitly supports DDR5 RDIMM modules at PC5-51200 speeds and accepts 288-pin RDIMM form factor. System firmware (BIOS/UEFI) and platform memory controllers must support the module’s rank and timing characteristics to operate at the advertised 6400MT/s. Where speed negotiation occurs, the module will downshift to the highest mutually supported frequency and timing supported by both the server and the module. It is recommended to consult the server vendor’s hardware compatibility lists to confirm validated configurations and supported memory topologies for single- and multi-socket systems.

Multi-Module Scaling

When deploying multiple 96GB RDIMMs per system, planners should consider total slot count, channel width, and per-socket population limits. The dual-rank nature of the module may affect achievable top-line frequency when every channel is fully populated; the platform’s memory controller governs final operating frequency and may apply compensation when many ranks are active. Capacity planning should balance module count, expected performance targets, and platform limitations to reach desired system memory and bandwidth goals.

Memory Organization and Error Correction

This RDIMM is organized as a Dual Rank x4 module; the "x4" die width and dual-rank configuration maximize density while maintaining compatibility with server ECC logic. ECC functionality corrects single-bit errors and detects multi-bit errors to prevent data corruption, a critical capability for mission-critical storage, virtualization hosts, and real-time transaction processing. Registered buffering reduces electrical loading on the memory controller when high module counts are populated, enabling dense configurations—important for server motherboards with multiple DIMM channels per CPU socket.

Interoperability

When integrating the 370-BCGL into multi-module systems, follow platform population rules for rank mixing, channel mirroring, and capacity matching. Mismatched ranks or mixing buffered/unbuffered modules is not supported; only RDIMMs and registered-compatible modules should be used in the same system to avoid training failures. Where required, consult Dell platform memory compatibility lists to confirm voltage, speed negotiation, and maximum per-channel population for the specific server model and CPU family being used.

Security and Data Integrity Features

DDR5 memory introduces on-die ECC (ODECC) and improved error management over previous generations; the 370-BCGL leverages these advances along with external ECC support. These mechanisms enhance data integrity for workloads that cannot tolerate silent data corruption. In combination with firmware and OS-level checksums or software-based integrity verification, the module contributes to a layered data integrity approach for enterprise storage and compute services.

Comparative Advantages Versus Alternative DIMM Types

Compared to unbuffered or SO-DIMM options, the 370-BCGL’s RDIMM architecture with ECC and registered buffering targets server-class reliability and higher per-module capacity. Compared with lower-speed DDR5 RDIMMs, the 6400 MT/s rating provides improved aggregate throughput for memory-bound tasks, while the 1.1 V operating voltage improves energy efficiency versus legacy higher-voltage modules. Dual-rank x4 topology offers a trade-off of density versus rank count—providing higher capacity per slot when compared to single-rank modules while preserving adequate signal timing characteristics expected by server memory controllers.

Features
Product/Item Condition:
New Sealed in Box (NIB)
ServerOrbit Replacement Warranty:
1 Year Warranty