370-BCHN Dell 256GB DDR5-5600MT/s PC5-44800 2Rx8 Memory Module.
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Product Overview of Dell 370-BCHN 256GB Memory Kit
General Information
- Brand: Dell
- Part Number: 370-BCHN
- Product Type: 256GB DDR5 Memory Module
Technical Specifications
- Total Capacity: 256GB
- Module Count: 8 x 32GB DIMMs
- Memory Format: DDR5 SDRAM
- Data Transfer Rate: 5600MT/s (DDR5-5600 / PC5-44800)
- Latency Timing: CL46
- Rank Configuration: 2Rx8
- Signal Type: Registered (Buffered)
- Error Correction: ECC (Error-Correcting Code)
Physical Specifications
Module Design
- Form Factor: 288-Pin RDIMM
Dimensions
- Height: 1.00 inch
- Depth: 6.75 inches
System Compatibility Matrix
Compatible Dell PowerEdge Servers
- PowerEdge C6620
- PowerEdge HS5610
- PowerEdge HS5620
- PowerEdge MX760c
- PowerEdge R660
- PowerEdge R660xs
- PowerEdge R760
- PowerEdge R760xa
- PowerEdge R760xd2
- PowerEdge R760xs
- PowerEdge T550
Dell 370-BCHN 256GB DDR5 Server Memory Kit
The Dell 370-BCHN represents a high-performance memory solution configured as 256GB organized across eight individual 32GB modules. This 8x32GB configuration provides optimal memory distribution across server memory channels, ensuring balanced performance and maximum throughput. Each module operates independently while functioning as part of a cohesive memory subsystem, allowing for efficient data handling across multiple processor threads and memory controllers.
DDR5 Technological Advancements
Utilizing DDR5 (Double Data Rate 5) technology, this memory kit delivers significant improvements over previous DDR4 generations. The architecture incorporates enhanced data integrity features, improved power management, and superior signal integrity. DDR5 technology enables higher data transfer rates while maintaining stability through advanced signaling techniques and on-die error correction capabilities.
Performance Specifications
Speed and Data Transfer Rates
Operating at 5600MT/s (MegaTransfers per second), the Dell 370-BCHN delivers exceptional data throughput capabilities. This speed rating translates to a peak transfer rate of 5600 million data transfers per second per module. The PC5-44800 designation indicates the module's bandwidth rating of 44800 MB/s per module, providing aggregate system bandwidth that scales linearly with the number of modules installed in the server configuration.
Timing Parameters and Latency
The memory operates with CAS Latency (CL46) timing parameters, optimized for server workloads where consistency and reliability take precedence over ultra-low latency. The CL46 timing represents 46 clock cycles between column address strobe and data availability, carefully balanced against the high operating frequency to deliver optimal performance for enterprise applications and data-intensive computing tasks.
Advanced Memory Features
Featuring Error Correcting Code (ECC) technology, the Dell 370-BCHN provides essential data integrity protection for critical server environments. ECC functionality enables the memory to detect and correct single-bit errors automatically, while also detecting multi-bit errors. This capability prevents data corruption and system crashes that can result from memory errors, ensuring continuous operation and data reliability in 24/7 enterprise environments.
Registered Memory Advantages
As a Registered DIMM (RDIMM), this memory incorporates register chips between the memory controller and DRAM modules. These registers buffer address, command, and control signals, reducing electrical load on the memory controller and enabling support for higher memory capacities per channel. The registered design enhances signal integrity and system stability, particularly important in multi-processor systems with large memory configurations.
Power Management and Efficiency
Voltage Specifications and Power Consumption
Operating at 1.1V, the Dell 370-BCHN demonstrates significant power efficiency improvements compared to previous memory generations. The reduced operating voltage contributes to lower power consumption and reduced heat generation, while maintaining signal integrity through advanced power delivery circuitry. This efficiency translates to reduced total cost of ownership through lower energy consumption and decreased cooling requirements in data center environments.
Power Management Integrated Circuit
DDR5 technology introduces the Power Management Integrated Circuit (PMIC) on each memory module, a significant advancement over previous generations. The PMIC distributes power more efficiently to various components on the DIMM, providing better power delivery and noise reduction. This onboard power management enables more stable operation and improved reliability under varying load conditions.
Physical Specifications
288-Pin DIMM Architecture
The Dell 370-BCHN utilizes the standard 288-pin DIMM form factor specifically designed for DDR5 memory technology. The pin configuration includes additional pins for enhanced power delivery, improved signaling, and new feature support compared to DDR4 modules. The physical layout ensures proper mechanical compatibility with DDR5 memory slots while preventing accidental insertion into incompatible motherboard sockets.
Physical Dimensions
Each module conforms to standard DDR5 RDIMM dimensions of approximately 133.35mm in length and 31.25mm in height. The specific height profile ensures compatibility with various server chassis and cooling solutions. The module features a single notch position located differently from DDR4 modules, providing physical keying to prevent installation in incompatible memory sockets.
Dell Server Compatibility
The 370-BCHN memory kit is engineered specifically for compatibility with Dell PowerEdge server platforms that support DDR5 memory technology. This includes specific generations of Dell PowerEdge servers designed for high-performance computing, data analytics, and enterprise applications. The memory undergoes rigorous testing and validation within Dell's server ecosystem to ensure optimal performance and reliability.
Dual Rank Architecture (2RX8)
The 2RX8 designation indicates a dual-rank configuration with an x8 DRAM device organization. Each module contains two independent ranks that can be accessed separately, improving memory efficiency by allowing overlapping operations between ranks. The x8 organization refers to the internal architecture of the memory chips, providing optimal balance between capacity, performance, and reliability for server applications.
Memory Channel Optimization
When installed in compatible server platforms, the 8-module kit enables optimal memory channel population across multiple processors. This configuration maximizes memory bandwidth by ensuring balanced loading across all available memory channels, reducing bottlenecks and improving overall system performance for memory-intensive applications and virtualized environments.
Signal Integrity and Reliability
On-Die ECC Implementation
Beyond traditional ECC protection, DDR5 memory incorporates On-Die ECC that corrects errors within the DRAM chips themselves before data is transmitted to the memory controller. This additional layer of error correction improves reliability and extends the usable life of the memory by correcting minor errors that occur within the memory cells, providing comprehensive data protection throughout the memory subsystem.
Application and Use Case Scenarios
Enterprise Workload Optimization
The Dell 370-BCHN 256GB kit excels in database management systems and online transaction processing environments where large memory capacities and ECC protection are essential. The high capacity enables larger database caching, reducing disk I/O and improving transaction throughput. The reliability features ensure data integrity for critical business transactions and financial operations.
Virtualization and Cloud Infrastructure
For virtualized environments and cloud infrastructure, this memory configuration provides the density and reliability required to host multiple virtual machines with consistent performance. The large 256GB capacity per kit allows for substantial memory allocation to virtual instances while maintaining ECC protection across all guest operating systems and applications.
High-Performance Computing
In technical computing applications such as computational analysis, scientific simulations, and engineering modeling, the combination of high bandwidth and large capacity enables faster processing of complex datasets. The ECC protection ensures computational accuracy by preventing memory errors that could compromise calculation results in sensitive scientific and engineering applications.
In-Memory Computing Platforms
The memory kit supports in-memory computing platforms and big data analytics applications where large datasets are processed entirely in system memory. The 256GB capacity provides substantial space for in-memory databases and analytics caches, while the high bandwidth enables rapid data processing and real-time analytics capabilities.
Real-World Performance
While theoretical bandwidth provides maximum potential, real-world performance depends on multiple factors including processor architecture, memory controller efficiency, and application memory access patterns. The Dell 370-BCHN is optimized for server workloads that benefit from both high bandwidth and large capacity, delivering consistent performance under sustained operational loads.
