MEM-DR464L-CL03-ER32 Supermicro 64GB DDR4 SDRAM 3200MHz RDIMM
Brief Overview of MEM-DR464L-CL03-ER32
Supermicro MEM-DR464L-CL03-ER32 64GB 3200MHz Pc4-25600 Cas-22 Ecc Registered Dual Rank X4 DDR4 SDRAM 288-Pin Rdimm Memory Module. New (System) Pull with 1 year replacement warranty - Micron Version
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Same product also available in:
| SKU/MPN | Warranty | Price | Condition | You save |
|---|---|---|---|---|
| MEM-DR464L-CL03-ER32 | 1 Year Warranty | $860.00 | New (System) Pull | You save: $301.00 (26%) |
| MEM-DR464L-CL03-ER32 | 1 Year Warranty | $1,152.00 | New Sealed in Box (NIB) | You save: $403.20 (26%) |
Overview of Supermicro MEM-DR464L-CL03-ER32 64GB Memory
The Supermicro MEM-DR464L-CL03-ER32 is a premium-grade 64GB DDR4 ECC Registered RDIMM memory module designed for enterprise servers, data centers, and high-performance workstation environments. Built with reliability, speed, and scalability in mind, this memory solution ensures stable system performance under heavy workloads and mission-critical applications.
General Information
- Manufacturer: Supermicro
- Part Number: MEM-DR464L-CL03-ER32
- Product Type: Memory Module
Technical Specifications
- Capacity: 64GB DDR4
- Type: DDR4 SDRAM
- Configuration: 1 x 64GB RDIMM module
- Speed: 3200MHz (DDR4-25600 / PC4-3200)
- Data Integrity Check: ECC
- Cas Latency Timings: Cl22
- Rank Features: 2Rx4 Dual Rank
Physical Specifications
- Form Factor: 288-pin RDIMM
- Height: 1.00 inch
- Depth: 6.75 inches
- Weight: 0.20 lb (approx.)
The Supermicro MEM-DR464L-CL03-ER32 64GB Memory
The Supermicro MEM-DR464L-CL03-ER32 64GB 3200MHz PC4-25600 CAS-22 ECC Registered Dual Rank X4 DDR4 SDRAM 288-Pin RDIMM Memory Module belongs to a high-performance enterprise memory category engineered specifically for modern data center infrastructures, mission-critical server environments, and scalable cloud computing architectures. This memory module is designed to deliver consistent throughput, enhanced reliability, and optimized electrical stability in systems that demand continuous uptime and extreme computational workloads. Built under strict JEDEC DDR4 standards and validated for compatibility with Supermicro server platforms, this RDIMM module represents a core component in high-density computing environments.
Advanced DDR4 SDRAM
DDR4 SDRAM technology represents a significant evolution over previous DDR generations, introducing improved bandwidth efficiency, reduced power consumption, and enhanced signal integrity. The Supermicro MEM-DR464L-CL03-ER32 module leverages this architecture to deliver stable 3200MHz data transfer rates, ensuring that server processors are consistently supplied with data at high speed. This minimizes bottlenecks in memory-intensive applications and supports multi-threaded workloads across multi-core CPU environments.
High-Speed Data Processing
At 3200MHz operating frequency, this memory module is positioned within the high-performance segment of DDR4 RDIMM solutions. This frequency enables faster communication between the CPU memory controller and installed RAM, which directly contributes to improved system responsiveness. In environments where latency-sensitive operations such as transaction processing or real-time analytics are critical, this speed ensures minimal delay and consistent throughput. The PC4-25600 bandwidth rating corresponds to a theoretical maximum transfer rate of 25.6 GB/s per module, enabling efficient data movement in multi-channel memory configurations. When deployed in dual or quad-channel server architectures, this bandwidth scales significantly, supporting enterprise workloads with heavy parallel processing requirements.
Memory Cell Organization and Dual Rank X4 Structure
The dual rank x4 configuration of this RDIMM module enhances memory access efficiency by allowing the memory controller to switch between ranks for optimized data handling. Each rank acts as an independent set of memory banks, enabling interleaving techniques that improve performance in server-grade applications. The x4 DRAM organization further enhances reliability by reducing the probability of multi-bit errors and increasing error correction effectiveness.
ECC Registered Memory
One of the defining features of the Supermicro MEM-DR464L-CL03-ER32 module is its ECC (Error-Correcting Code) capability combined with registered buffering. ECC memory plays a vital role in detecting and correcting single-bit memory errors in real time, ensuring data integrity across mission-critical applications. In server environments where even minor data corruption can lead to significant system failures or data loss, ECC memory provides a crucial layer of protection.
64GB Capacity Memory
The 64GB capacity per module makes this memory solution ideal for scalable server environments that require large memory pools for virtualization, container orchestration, and in-memory computing. High-density memory modules reduce the total number of DIMM slots required to achieve large memory footprints, allowing servers to maximize memory capacity without increasing physical hardware complexity.
Memory Scalability in Multi-Socket Server Systems
In multi-socket server architectures, memory scalability is a critical factor in achieving balanced system performance. The Supermicro MEM-DR464L-CL03-ER32 module supports configurations where multiple CPUs share large memory pools, ensuring uniform access and reduced latency across processing units. This scalability is essential in hyperscale data centers and enterprise-grade computing clusters.
288-Pin RDIMM
The 288-pin RDIMM form factor is the standard physical interface for DDR4 server memory modules. This configuration ensures compatibility with a wide range of enterprise server motherboards, particularly those manufactured by Supermicro. The precise pin alignment and standardized electrical interface allow seamless integration into existing server infrastructures without requiring hardware modifications.
CAS Latency CL22 and Memory Timing Efficiency
CAS latency (Column Address Strobe latency) is a key parameter in memory performance, representing the delay between a memory request and data availability. The CL22 rating of this module reflects a balanced optimization between speed and stability, making it suitable for enterprise workloads where consistency is more important than raw low-latency performance.In server environments, memory timing consistency is critical for maintaining predictable application behavior. The CL22 configuration ensures that memory operations remain stable even under high load conditions, reducing performance variability in multi-threaded applications and virtualized environments.
Bandwidth Optimization and PC4-25600 Performance
The PC4-25600 classification indicates a peak theoretical memory bandwidth of 25.6 GB/s per module, which is essential for modern server workloads that require rapid data movement. This bandwidth allows CPUs to access large datasets efficiently, minimizing idle cycles and maximizing processing throughput.
Thermal Management and Power Efficiency
DDR4 technology is inherently more power-efficient than previous memory generations, operating at a standard voltage of 1.2V. This reduced power consumption contributes to lower heat generation, which is essential in dense server environments where thermal management is a critical concern.
