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755392-L21 HPE 2.30GHz Intel Xeon E5-2670V3 12 Core Processor.

755392-L21
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Brief Overview of 755392-L21

HPE 755392-L21 2.30GHz 9.60GT/s QPI 30MB L3 Cache Socket FCLGA2011-3 Intel Xeon E5-2670V3 12 Core Processor Kit For ProLiant DL360 Gen9. New System Pull with 1 year replacement warranty

$195.75
$145.00
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SKU/MPN755392-L21Availability✅ In StockProcessing TimeUsually ships same day ManufacturerHPE Manufacturer WarrantyNone Product/Item ConditionNew (System) Pull ServerOrbit Replacement Warranty1 Year Warranty
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Description

Product Overview of HPE Intel Xeon E5-2670V3 Processor

Optimized Performance for Demanding Workloads

  • 12-core (dodeca-core) design ensures superior multi-threaded processing efficiency.
  • Clocked at 2.30GHz base frequency, ideal for data centers and virtualized environments.
  • QPI speed of 9.6GT/s delivers high interconnect bandwidth between CPU and chipset.

General Information

  • Manufacturer: HPE
  • Part Number: 755392-L21
  • Processor Series: Intel Xeon E5-2670 V3
  • Core Count: 12 Cores (Dodeca-core)
  • Base Clock: 2.30 GHz
  • QPI Bandwidth: 9.60GT/s
  • L3 Cache: 30MB Smart Cache
  • Socket Compatibility: FCLGA2011-3
  • Thermal Design Power: 120W
  • Technology Node: 22nm
  • Thermal Ceiling: 84.5°C

Advanced Architecture & Technical Precision

  • 22-nanometer lithography enables energy-efficient operations and higher transistor density.
  • Integrated 30MB L3 cache offers fast data retrieval, reducing latency during execution.
  • Socket FCLGA2011-3 compatible – tailor-made for scalable server infrastructures.

Efficient Thermal Design

  • Rated at 120W TDP (Thermal Design Power) for optimized thermal output control.
  • Thermal threshold set at 84.5°C, supporting robust heat dissipation under heavy loads.
  • Designed to maintain performance stability even in high-temperature server rooms.

Part of the Xeon E5 V3 Product Family

  • Belongs to the second-generation Intel Xeon E5 v3 series for enterprise-grade systems.
  • Manufactured to support advanced virtualization, high-density applications, and cloud platforms.
  • Microarchitecture enhances throughput with multiple instruction execution per cycle.
Eco-Conscious and Ready-to-Assemble
  • Eco-friendly processor kit – designed with sustainability in mind for modern IT infrastructures.
  • Ships as a processor kit requiring installation, offering flexibility for upgrades and replacements.
  • Reduces electronic waste while offering long lifecycle usability for enterprise systems.

Built for HPE ProLiant DL360 Gen9 Servers

  • Specifically engineered for compatibility with HPE DL360 Gen9 server platforms.
  • Enables high availability, scalability, and seamless virtualization in enterprise deployments.
  • Reliable choice for database servers, virtualization hosts, and private cloud infrastructures.

Enterprise-Class Computing Capabilities

  • Ensures reduced bottlenecks with large L3 cache and fast QPI links.
  • Supports high-performance computing (HPC), big data processing, and cloud-native apps.
  • Integrated features built for reliability, availability, and serviceability (RAS).

755392‑L21 Xeon E5‑2670 v3 2.30 GHz Processor Series

Overview of High‑Density Server CPU Solutions

  • Part of the renowned Intel Xeon E5‑2670 v3 line, tailored for robust, enterprise‑grade computing.
  • Offers 12 physical cores (“dodeca‑core”) and 24 threads via hyper‑threading, enabling substantial parallel workloads.
  • Socketed in FCLGA2011‑3, it’s engineered for seamless integration in HPE ProLiant DL360 Gen9 platforms.
  • With a 2.30 GHz base clock and 30 MB L3 Smart Cache, this processor balances frequency and memory access efficiency for versatile workloads.

Key Technical Attributes

Core Architecture & Processing Throughput

  • 12 cores deliver robust compute density—ideal for virtualization, database operations, and analytics tasks.
  • Multi‑threading capabilities let simultaneous threads share each physical core, boosting unpacked task execution.
  • The 22 nm manufacturing process contributes to energy efficiency while maintaining powerful throughput.

Cache Structure & Interconnect**

  • 30 MB of L3 cache ensures rapid data access, lowering latency for workloads that frequently reference shared data.
  • QPI (QuickPath Interconnect) at 9.6 GT/s facilitates high‑speed communication between CPU and chipset, maximizing bandwidth in dual‑socket setups.

Thermal and Power Engineering

  • 120 W TDP (Thermal Design Power) defines a controlled power envelope, facilitating consistent cooling and system planning.
  • 84.5 °C thermal threshold ensures reliable operation under full load within well‑cooled rack environments.

Designed for Compatibility: HPE ProLiant DL360 Gen9 Series

  • Fully compatible with HPE’s DL360 Gen9 rack‑mount server line—especially optimized for small‑form‑factor, high‑density data center deployment.
  • Supports enterprise‑grade RAS (Reliability, Availability, Serviceability) features, maximizing uptime and maintainability.
  • Allows dual‑processor configurations to scale performance in multi‑tenant or heavily virtualized environments.HPE 755392-L21 Intel Xeon E5 2670V3 Processor

Virtualization and Cloud Optimization

  • Robust core count and hyper‑threading make it an excellent foundation for VMs, containers, and clustered services.
  • Allows for balanced virtualization density without sacrificing per‑VM performance.
  • Supports emerging cloud workloads, from micro‑services to legacy monolithic applications.
Benefits in Database and Analytics Contexts
  • Large shared cache accommodates in‑memory datasets, minimizing disk I/O and boosting throughput.
  • High core count enables concurrent transactions and analytics queries—especially useful for SQL, NoSQL, and OLAP workloads.
  • Accelerates analytics pipelines and reporting, supporting real‑time data insights in enterprise contexts.

Energy Efficiency and Server Consolidation

  • 22 nm fabrication and optimized power draw at 120 W facilitate lower electricity overhead per core.
  • Enables consolidation of server workloads on fewer physical hosts, reducing rack space and operational costs.
  • Delivers a favorable performance‑per‑watt tradeoff in energy‑conscious data centers.

Longevity and Upgrade Trajectory

  • As a mature Xeon v3 family member, it benefits from long‑term support, firmware maturity, and established compatibility matrices.
  • Supports incremental upgrades—e.g., scaling from fewer cores to this 12‑core processor to meet evolving compute requirements.
  • Compatible with existing cooling infrastructure and power provisioning in Gen9 chassis, reducing upgrade friction.
Eco‑Sustainability and Modular Upgrade Design
  • Packaged as a component—enabling targeted replacement instead of full system refresh, limiting electronic waste.
  • Supports HPE’s asset recycling programs, promoting reuse of server chassis and parts.
  • Offers a path to extend product lifecycle via modular upgrades rather than entire system replacement.

755392‑L21 Processor Kits

Product‑Specific Advantages

  • Kit SKU 755392‑L21 includes the Xeon E5‑2670 v3 processor and accessory components designed for quick deployment.
  • Quality‑tested for compatibility with HPE ProLiant servers, reducing integration risk.
  • Ideal for service providers maintaining inventory for rapid replacement or scaling.

Inventory and Deployment Agility

  • Streamlined SKU management—one part number for both performance and compatibility assurance.
  • Spares kit simplifies field servicing, reducing mean time to repair (MTTR) in data center environments.
  • Pre‑tested kits ensure consistency in multi‑site rollouts across global server farms.
Use Cases in Tiered Environments
  • Critical for tier‑1 support centers needing rapid CPU swaps—keeping systems online and SLA‑compliant.
  • Supports standardized configuration across production and staging environments for predictable behavior.
  • Serves as an ideal replacement stock for end‑of‑life parts in extended support scenarios.

Related Keyword Phrasing

  • Includes variations like “Intel Xeon E5‑2670 v3 12‑core 2.3 GHz,” “HPE 755392‑L21 processor kit,” and “Socket FCLGA2011‑3 Xeon E5 v3” to capture diverse search intents.
  • Incorporates long‑tail keywords such as “high‑density server CPU for DL360 Gen9” and “energy‑efficient enterprise Xeon CPU.”
  • Emphasizes both technical specs and usage context—appealing to IT architects, procurement teams, and system administrators alike.
Features
Manufacturer Warranty:
None
Product/Item Condition:
New (System) Pull
ServerOrbit Replacement Warranty:
1 Year Warranty