AC055054 Dell 256GB 3200MHz PC4-25600 DDR4 SDRAM 288-pin LRDIMM Memory Module

Dell AC055054 256GB Server Memory Kit

The Dell AC055054 represents a high-capacity, enterprise-grade memory solution engineered specifically for demanding server environments. This 256GB LRDIMM module operates at 3200MT/s with advanced error-correcting code (ECC) and registered technology to ensure maximum data integrity and system stability in mission-critical applications. Designed for compatibility with Dell PowerEdge servers and similar enterprise systems, this memory component delivers the performance and reliability required for data centers, cloud computing infrastructure, and high-performance computing clusters.

Key Specifications

The Dell AC055054 memory module incorporates cutting-edge memory technology to meet the rigorous demands of modern server infrastructure. With its 256GB capacity on a single module, it enables significant memory expansion without consuming excessive physical space within server configurations. The module's advanced memory architecture ensures optimal performance while maintaining power efficiency through its 1.2V operating voltage, contributing to reduced overall power consumption in large-scale deployments.

Memory Capacity

This module features a substantial 256GB capacity achieved through sophisticated memory packaging technology. The "1x256GB" designation indicates this is a single module containing 256 gigabytes of memory storage. This high-density design allows server administrators to maximize memory capacity within limited DIMM slot configurations, enabling more efficient use of server chassis space and supporting memory-intensive applications without requiring additional server nodes.

Octal Rank Architecture

The octal rank (8-rank) configuration represents an advanced memory organization where the 256GB capacity is distributed across eight independent logical ranks. This architecture allows for improved memory access parallelism and enhanced performance characteristics compared to lower-rank modules. The octal rank design enables better utilization of memory bandwidth while maintaining signal integrity across the high-capacity memory array, making it particularly suitable for applications requiring extensive memory resources.

X4 Memory Organization

The x4 data width organization refers to the internal structure of the memory chips, where each chip has a 4-bit data interface. This configuration provides enhanced reliability through additional chip resources for error correction and improved signal integrity. The x4 organization works in conjunction with the module's ECC capabilities to provide robust data protection mechanisms, ensuring data accuracy throughout extended operation periods in 24/7 server environments.

Performance Characteristics

Operating at 3200 million transfers per second (3200MT/s), this memory module delivers high-speed data processing capabilities essential for contemporary server workloads. The PC4-25600 designation indicates the module's peak transfer rate of 25,600 MB/s, providing substantial bandwidth for CPU-to-memory communication. This performance level supports demanding applications including virtualization, database management, scientific computing, and large-scale transactional processing systems.

CAS Latency Timing

The CL22 (CAS Latency 22) timing parameter represents the number of clock cycles between a column address strobe and the availability of data from the memory array. While higher than consumer-grade memory latencies, this timing is optimized for server workloads where stability, capacity, and bandwidth typically take precedence over ultra-low latency. The CL22 specification is carefully balanced with other timing parameters to deliver optimal performance for enterprise applications while maintaining compatibility with server memory controllers.

Data Transfer Technology

The 3200MT/s data rate utilizes double data rate (DDR) technology, where data transfers occur on both the rising and falling edges of the clock signal. This effectively doubles the data throughput compared to single data rate memory. The high transfer rate enables rapid processing of large datasets and supports multiple simultaneous memory accesses, which is crucial for multi-core processors and parallel computing tasks common in modern server environments.

Advanced Memory Technologies

The Dell AC055054 incorporates several sophisticated memory technologies specifically designed for enterprise deployment. These technologies work in concert to deliver the reliability, performance, and data integrity required in mission-critical computing environments where system uptime and data accuracy are paramount considerations.

Error Correcting Code (ECC) Technology

ECC technology represents a critical feature for server memory, providing automatic detection and correction of single-bit memory errors and detection of multi-bit errors. This advanced error correction capability significantly reduces the risk of data corruption and system crashes caused by memory errors. The ECC implementation includes additional memory bits beyond the standard data width to store error correction codes, enabling real-time error correction without impacting system performance or requiring operating system intervention.

Single-Bit Error Correction

The ECC implementation can automatically detect and correct single-bit errors that may occur due to various factors including cosmic radiation, electrical interference, or component aging. This capability prevents these transient errors from causing application crashes or data corruption, thereby enhancing system reliability and reducing the likelihood of unplanned downtime in production environments.

Multi-Bit Error Detection

For more severe multi-bit errors, the ECC technology provides detection capabilities that alert the system to potentially serious memory issues. When multi-bit errors are detected, the system can take appropriate action such as logging the event, alerting administrators, or in some cases, taking the affected memory area offline to prevent data corruption from propagating through the system.

Registered Memory Architecture

The registered (buffered) design incorporates register chips between the memory controller and the DRAM chips themselves. These registers buffer the command, address, and control signals, reducing the electrical load on the memory controller and enabling support for higher memory capacities and more DIMMs per channel. This architecture is essential for maintaining signal integrity in memory-intensive server configurations where multiple high-capacity modules are deployed.

Signal Integrity Enhancement

By buffering the control signals, registered memory reduces electrical loading on the memory controller, which helps maintain clean signal transitions even when driving multiple memory modules. This signal integrity enhancement allows for more stable operation at high speeds and with higher memory densities than would be possible with unbuffered memory designs. The improved signal quality contributes to overall system reliability and enables more aggressive memory timing configurations.

Capacity Scaling Advantages

The registered architecture enables systems to support significantly larger memory capacities by reducing the electrical demands on the memory controller. This allows servers to populate all available DIMM slots with high-capacity modules like the 256GB Dell AC055054, creating terabyte-scale memory configurations that support memory-intensive applications such as in-memory databases, large virtualization deployments, and high-performance computing clusters.

Load Reduced DIMM (LRDIMM) Technology

As a Load Reduced DIMM, the AC055054 incorporates additional buffering on the data signals as well as the command and address signals. This advanced buffering technology further reduces the electrical load on the memory controller compared to standard registered DIMMs, enabling even higher memory capacities and better performance in heavily populated memory configurations.

Data Buffer Implementation

LRDIMMs utilize data buffers (or isolation memory buffers) that electrically isolate the DRAM chips from the data bus. This isolation minimizes the capacitive load presented to the memory controller, allowing for higher operating frequencies and support for more DIMMs per memory channel. The data buffers effectively present a single electrical load to the memory controller regardless of how many DRAM chips are on the module, enabling the high 256GB capacity while maintaining performance.

Performance in Populated Configurations

The LRDIMM design maintains higher performance levels in fully populated memory configurations compared to registered DIMMs. As more modules are added to a memory channel, LRDIMMs experience less performance degradation due to their superior electrical characteristics. This makes them particularly valuable in memory-intensive servers where maximum capacity and performance are simultaneously required.

Physical Design and Compatibility

The physical construction of the Dell AC055054 memory module follows industry standards while incorporating specific design elements to ensure compatibility, reliability, and optimal thermal performance in server environments. The module's mechanical design addresses the challenges of high-density memory packaging while maintaining compatibility with server DIMM slots and cooling systems.

288-Pin DIMM Form Factor

The module utilizes the standard 288-pin DDR4 DIMM interface, ensuring mechanical compatibility with DDR4 server memory slots. The pin arrangement follows JEDEC specifications for DDR4 registered LRDIMMs, with specific pin assignments for data, address, control signals, and power delivery. The 288-pin design provides the necessary signal and power connections to support the module's high capacity and advanced features while maintaining industry-standard physical compatibility.

Mechanical Dimensions

The physical dimensions of the module conform to the standard DDR4 DIMM specification, approximately 133.35mm in length and 31.25mm in height. This standardized form factor ensures compatibility with server memory slots and retention mechanisms across various server platforms. The height consideration is particularly important for clearance in high-density server configurations where multiple components compete for limited space.

Power Management Features

DDR4 memory includes advanced power management features such as programmable fine-grain power down modes and self-refresh capabilities. These features allow the memory controller to optimize power consumption based on workload demands, reducing energy usage during periods of lower memory utilization without compromising performance when full capabilities are required.

Current Requirements

While specific current draw varies based on operational state, the high-capacity nature of the 256GB module necessitates careful power delivery design within the server system. Server power supplies and voltage regulation modules must be capable of delivering stable power to multiple high-capacity memory modules simultaneously, especially during peak utilization periods.

Signal Integrity and Timing Parameters

The electrical signaling of the Dell AC055054 follows strict specifications to ensure reliable operation at the 3200MT/s data rate. The module's timing parameters are carefully calibrated to balance performance with stability in server environments where continuous operation is essential.

Compatibility and System Requirements

The Dell AC055054 memory module is designed for compatibility with specific server platforms that support its advanced features and capacity. Proper system configuration is essential to ensure optimal performance and reliability when deploying this high-capacity memory technology.

Supported Server Platforms

This memory module is engineered for compatibility with Dell PowerEdge servers and similar enterprise server platforms that support DDR4-3200 LRDIMM technology. Compatibility depends on the server's memory controller capabilities, BIOS support, and physical memory slot configuration. Server documentation should be consulted to verify support for this specific memory type and capacity.

Memory Controller Requirements

The server's memory controller must support DDR4 technology at 3200MT/s with LRDIMM modules. Additionally, the memory controller must be capable of addressing the high density of the 256GB module and managing the octal rank configuration. Modern server processors with integrated memory controllers typically include support for such configurations, but specific compatibility should be verified against the server manufacturer's documentation.

Memory Channel Organization

Modern server processors typically feature multiple memory channels (commonly 6 or 8 channels) with one or two DIMM slots per channel. Optimal performance is achieved by populating memory uniformly across channels and within channels according to the server manufacturer's guidelines. The high capacity of the Dell AC055054 enables substantial total memory with fewer modules, potentially allowing single-DIMM-per-channel configurations that often provide the best performance characteristics.

Mixed Configuration Considerations

While possible in some systems, mixing different memory types (LRDIMM with RDIMM or UDIMM) or different capacities within the same channel is generally not recommended and may result in all memory operating at the speed of the slowest module or other configuration limitations. For optimal performance, identical modules should be used within a memory channel, and preferably across all channels in a system.

Application and Use Cases

The high-capacity, high-performance characteristics of the Dell AC055054 memory module make it suitable for various demanding server applications where large memory resources are essential for optimal performance and capability.

Virtualization and Cloud Infrastructure

In virtualized environments, large memory capacity enables higher virtual machine density and improved performance for memory-intensive guest operating systems. The 256GB capacity allows substantial memory allocation to multiple virtual machines while maintaining headroom for the hypervisor and other system functions.

Virtual Machine Density Optimization

With high-capacity modules, server platforms can host more virtual machines per physical server, improving consolidation ratios and reducing total cost of ownership for virtualized infrastructure. The reliable operation ensured by ECC technology is particularly important in multi-tenant environments where stability is critical.

In-Memory Database Systems

Modern database systems increasingly leverage in-memory processing for improved performance. The 256GB capacity of this memory module enables substantial portions of databases to reside entirely in memory, dramatically reducing access times compared to disk-based storage and accelerating transaction processing and analytics workloads.

Real-Time Analytics Performance

In-memory analytics platforms process large datasets entirely in system memory, requiring substantial memory resources. The high capacity and bandwidth of the Dell AC055054 support these memory-intensive workloads, enabling faster insights from large datasets and supporting real-time decision-making applications.

Transaction Processing Acceleration

Online transaction processing (OLTP) systems benefit from large memory buffers that reduce physical disk I/O. The combination of high capacity and reliable operation makes this memory module suitable for demanding transaction processing environments where both performance and data integrity are essential.

Large Dataset Processing

Applications processing large scientific datasets, genomic information, or engineering simulations benefit from the ability to keep entire datasets in memory during computation. The 256GB capacity per module enables work with larger datasets or multiple simultaneous datasets within a single server node.