100-000001289WOF AMD EPYC 7303P 2.4GHz 16-Core Processor

General Information

• Product Type: Server Processor
• Manufacturer: Advanced Micro Devices Inc (AMD)
• Manufacturer Part Number: 100-000001289WOF
• Processor Model: AMD EPYC 7303P

Technical Information

• Total Cores: 16-core design tailored for enterprise workloads
• Base Clock: 2.4 GHz for steady, predictable performance
• Max Boost Clock: Up to 3.4 GHz for burst acceleration
• Instruction Set: 64-bit architecture for modern server applications
• Socket Compatibility: SP3 platform
• Instruction Set Extensions: AVX2, AVX-512, SSE4.2, AES-NI, SHA, AMD-V virtualization
• Fabric Technology: AMD Infinity Fabric with scalable interconnect
• PCI Express Support: PCIe® 4.0 lanes for high-speed storage and GPU connectivity
• Virtualization: AMD-V, Secure Encrypted Virtualization (SEV)
• Thermal Design Power (TDP): 130W for efficient energy usage
• Socket Compatibility: SP3
• Default TDP: 130W for a balanced power envelope

Cache Memory Detail

• L3 Cache: 64 MB to minimize latency and speed up data access
• Cache Optimization: Multi-level hierarchy tuned for multi-threaded throughput

Memory Specifications

• Memory Type: DDR4 server memory (ECC-ready)
• Maximum Capacity: Up to platform limits (data center scale)
• Channels: 8-channel architecture for high bandwidth
• Reliability: ECC support to maintain data integrity

Architecture & Performance

Core Efficiency

• Sixteen high-efficiency cores deliver consistent performance across virtualized and containerized stacks
• Boost technology helps sustain throughput during peak demand

Workload Readiness

• Well-suited for virtualization, web hosting, application servers, and mid-sized databases
• Optimized for cloud instances and on-premises enterprise deployments alike

Power & Platform

Thermal & Power Profile

• 130W TDP enables dense rack deployments with predictable cooling requirements
• Energy-aware performance helps lower total cost of ownership

Server Integration

• SP3 ecosystem compatibility for broad motherboard and chassis support
• High-bandwidth I/O lanes for fast storage and networking expansion

Key Advantages

• Balanced core count for versatile, multi-tenant environments
• Large L3 cache improves responsiveness for data-heavy tasks
• Enterprise-grade memory architecture with ECC for reliability
• Drop-in readiness for SP3 platforms streamlines upgrades and rollouts

Use-Case Highlights

• VM consolidation, VDI pilots, and container orchestration
• Business applications, microservices, and API back-ends
• Analytics starters, ETL pipelines, and operational databases

AMD EPYC 7303P 2.4GHz 16-Core Processor: Enterprise-Class Performance for Single-Socket Servers

The AMD 100-000001289WOF EPYC 7303P 2.4GHz 16-Core Processor is a powerful and efficient server-grade CPU designed for single-socket deployments. As part of AMD’s EPYC 7003 series, this processor is built on the Zen 3 architecture and manufactured using advanced 7nm process technology. With 16 cores and 32 threads, it delivers exceptional performance, scalability, and energy efficiency for a wide range of enterprise workloads, including virtualization, cloud-native applications, and high-performance computing.

Zen 3 Architecture: Performance and Efficiency

Microarchitecture Enhancements

The EPYC 7303P is based on AMD’s Zen 3 microarchitecture, which introduces significant improvements in instructions per cycle (IPC), cache latency, and overall throughput. Zen 3 cores feature enhanced branch prediction, wider execution pipelines, and improved load/store units, making them ideal for complex and data-intensive workloads.

Core and Thread Configuration

With 16 physical cores and support for simultaneous multithreading (SMT), the EPYC 7303P offers 32 threads of parallel processing power. This configuration is optimized for multitasking and parallel execution, enabling efficient performance in virtualized environments, containerized applications, and microservices architectures.

Base and Boost Clock Speeds

Operating at a base frequency of 2.4GHz, the EPYC 7303P can dynamically boost its clock speed under load conditions. This adaptive frequency scaling ensures responsive performance across a wide range of workloads, from transactional databases to real-time analytics and AI inference.

Cache Hierarchy and Data Access

Large L3 Cache for High Throughput

The EPYC 7303P features a substantial 128MB of L3 cache, which significantly reduces memory latency and accelerates data access. This large cache pool is particularly beneficial for workloads with high data locality, such as in-memory databases, analytics engines, and scientific simulations.

Efficient Cache Design

The processor’s cache hierarchy includes dedicated L1 and L2 caches per core, along with a shared L3 cache. This design minimizes bottlenecks and maximizes throughput, ensuring efficient data retrieval and reduced contention across threads.

Memory Support and Bandwidth

DDR4 Memory Compatibility

The EPYC 7303P supports DDR4 memory, offering reliable performance and broad compatibility with existing server infrastructure. With support for up to 8 memory channels, the processor delivers exceptional memory bandwidth, crucial for memory-bound workloads such as virtualization, HPC, and real-time analytics.

Maximum Memory Capacity

This processor supports up to 4TB of DDR4 memory, enabling large-scale deployments of in-memory databases, virtual machines, and AI training models. ECC (Error-Correcting Code) memory support ensures data integrity and system reliability, which are essential in mission-critical environments.

Memory Speed and Latency

With support for DDR4-3200 modules, the EPYC 7303P achieves high memory transfer rates while maintaining low latency. This configuration is ideal for latency-sensitive applications such as financial modeling, high-frequency trading, and real-time data processing.

Single-Socket Optimization

Cost-Effective Server Deployment

The EPYC 7303P is optimized for single-socket systems, offering high core density without the need for dual-socket configurations. This reduces hardware complexity, lowers power consumption, and simplifies system design, making it an ideal choice for cloud service providers, edge computing, and enterprise IT departments.

Simplified Infrastructure

By consolidating compute resources into a single socket, organizations can streamline server deployment and maintenance. This leads to reduced capital expenditure and operational costs, while still delivering robust performance for mission-critical applications.

Energy Efficiency and Thermal Management

7nm Process Technology

Manufactured using TSMC’s 7nm process node, the EPYC 7303P achieves high transistor density and improved power efficiency. This contributes to lower thermal output and reduced energy consumption, aligning with sustainability goals and green data center initiatives.

Thermal Design Power (TDP)

With a TDP of 155W, the EPYC 7303P offers a balanced power profile suitable for dense server environments. Advanced thermal management features ensure stable operation under sustained workloads, supporting both air and liquid cooling solutions.

Power Management Technologies

The processor includes dynamic voltage and frequency scaling (DVFS), enabling it to adjust power usage based on workload demands. This minimizes energy waste during idle periods and maximizes performance during peak usage.

Security and Reliability Features

AMD Infinity Guard

The EPYC 7303P incorporates AMD Infinity Guard, a comprehensive suite of security features designed to protect data, isolate workloads, and ensure system integrity. Key components include Secure Memory Encryption (SME), Secure Encrypted Virtualization (SEV), and Secure Boot.

Secure Memory Encryption (SME)

SME encrypts system memory to prevent unauthorized access, even in the event of physical memory compromise. This is essential for protecting sensitive data in multi-tenant and cloud environments.

Secure Encrypted Virtualization (SEV)

SEV enables encrypted virtual machines, ensuring that guest VMs remain isolated and protected from hypervisor-level threats. This enhances trust and compliance in virtualized infrastructures.

PCIe 4.0 and I/O Expansion

High-Speed Connectivity

The EPYC 7303P supports PCIe 4.0, enabling faster communication with GPUs, NVMe storage devices, and high-speed networking cards. This is essential for modern workloads that require rapid data access and transfer.

Expansion Capabilities

With up to 128 PCIe lanes, the processor offers extensive I/O expansion options. This allows for scalable server configurations with multiple accelerators, storage arrays, and network interfaces, supporting diverse enterprise and HPC applications.

Use Cases and Application Scenarios

Cloud-Native Workloads

The EPYC 7303P is optimized for cloud-native environments, including containerized applications, microservices, and Kubernetes clusters. Its core density and energy efficiency make it ideal for hyperscale deployments and edge computing.

Enterprise Virtualization

With support for large memory capacities and advanced virtualization features, the processor enables high VM density and efficient resource allocation. This reduces operational costs and enhances scalability for enterprise IT infrastructures.

High-Performance Computing (HPC)

Scientific research, engineering simulations, and AI model training benefit from the parallel processing capabilities of the EPYC 7303P. Its architecture supports floating-point operations and large datasets, making it suitable for HPC clusters and research institutions.

Data Analytics and Machine Learning

The processor’s core count and memory bandwidth support real-time data analytics and machine learning workloads. It enables rapid processing of large datasets, accelerating insights and decision-making in data-driven organizations.

Platform Compatibility and Ecosystem

Socket SP3 and Motherboard Support

The EPYC 7303P utilizes the SP3 socket, compatible with a wide range of server motherboards. This ensures flexibility in system design and integration, whether for rack-mounted servers, blade systems, or custom builds.

OEM and ISV Certification

AMD partners with leading OEMs and independent software vendors (ISVs) to certify the EPYC 7303P for enterprise applications. This ensures compatibility with popular software stacks and simplifies deployment in production environments.