MTA72ASS8G72LZ-2G9J2 Micron 64GB DDR4 SDRAM 2933MHz Memory

Micron 64GB DDR4-2933MHz Memory Module

Manufacturer and part details

• Manufacturer: Micron
• Part number: MTA72ASS8G72LZ-2G9J2
• Product name: 64GB memory module

Technical specifications

Performance and technology

• Memory technology: DDR4 SDRAM
• Bus speed: 2933MHz (PC4-23400)
• CAS latency: CL21
• Signal processing: Registered (buffered)
• Data integrity: ECC (Error-Correcting Code)

Module configuration

• Number of modules: 1 × 64GB
• Rank features: 4Rx4

Compatibility and use cases

Ideal environments

• Servers: Virtualization, databases, and analytics
• Workstations: CAD, rendering, and scientific computing
• Enterprise IT: High-availability and mission-critical systems

Platform fit

• Socket type: 288‑pin LR-DIMM compatible motherboards
• ECC support: Requires ECC-enabled platforms
• Registered DIMM: Designed for server-grade memory channels

Physical characteristics

Form factor and dimensions

• Form factor: 288‑pin LR-DIMM
• Shipping dimensions: 1.00 (height) × 6.75 (depth)
• Shipping weight: 0.20 lb

MTA72ASS8G72LZ-2G9J2 DDR4 ECC Server Memory Overview

High-capacity enterprise server memory modules such as the Micron MTA72ASS8G72LZ-2G9J1 64GB 4RX4 PC4-23400 DDR4-2933MHz ECC Memory represent a specialized category within professional computing hardware that is engineered to meet the reliability, scalability, and performance requirements of modern data centers, cloud infrastructures, virtualization platforms, and mission-critical enterprise servers. This category focuses on registered ECC DDR4 memory modules designed for sustained workloads, continuous uptime, and advanced error mitigation, enabling system architects and IT professionals to deploy stable and predictable memory subsystems in demanding environments.

Server-class DDR4 ECC memory differs fundamentally from consumer-grade memory in its internal architecture, signal integrity design, and validation standards. Products within this category are optimized for multi-processor server boards, dense memory configurations, and long operational lifecycles. The Micron MTA72ASS8G72LZ-2G9J1 model exemplifies these characteristics by combining high density, quad-rank organization, and error-correcting technology with a speed grade aligned to contemporary server CPU memory controllers.

DDR4 Registered ECC Memory Architecture

DDR4 registered ECC memory modules are built around a buffered signaling architecture that improves electrical stability when multiple memory modules are installed in parallel. The registered design introduces a register chip that buffers command and address signals before they reach the memory chips, reducing signal load on the memory controller and enabling higher capacity configurations per system. This architectural choice is central to the scalability of enterprise servers and is a defining characteristic of the Micron MTA72ASS8G72LZ-2G9J1 memory category.

Error-Correcting Code functionality adds another critical layer of reliability. ECC memory continuously detects and corrects single-bit memory errors while identifying multi-bit errors that could compromise data integrity. In large memory pools operating at high speeds, transient errors caused by electrical noise, cosmic radiation, or component aging become statistically more likely. ECC support ensures that such errors do not propagate into application crashes, corrupted databases, or silent data loss.

Quad-Rank Memory Organization and Its Benefits

The 4RX4 configuration found in this category refers to quad-rank memory organization using x4-width memory chips. Each rank operates as an independently addressable group of DRAM chips, allowing memory controllers to interleave access across ranks for improved throughput. Quad-rank modules are particularly valuable in high-capacity deployments where maximizing memory density per slot is essential.

Using x4 DRAM components enhances ECC effectiveness because error correction algorithms can isolate and manage errors at a finer granularity. This design approach is favored in enterprise-grade memory because it aligns with server chipset requirements and supports advanced reliability, availability, and serviceability features commonly implemented by CPU vendors.

Registered Load Reduction and Signal Integrity

In densely populated server systems, electrical load becomes a limiting factor for memory stability. Registered memory mitigates this issue by decoupling the memory controller from the full electrical load of each DRAM chip. This load reduction allows servers to operate at higher capacities and frequencies without compromising reliability. The Micron MTA72ASS8G72LZ-2G9J1 category is therefore well-suited for systems that require consistent performance under heavy memory utilization.

DDR4-2933MHz Key Characteristics

The PC4-23400 DDR4-2933MHz speed classification places this memory category within a performance tier that balances bandwidth efficiency and thermal stability. Operating at 2933MT/s, these modules deliver substantial data throughput for multi-threaded server workloads, including virtualization, in-memory databases, analytics engines, and high-performance computing tasks.

Memory frequency directly influences system responsiveness in data-intensive applications. Higher transfer rates reduce latency bottlenecks when multiple virtual machines or containerized services simultaneously access shared memory resources. DDR4-2933MHz memory is particularly effective when paired with modern server processors that support higher memory speeds across multiple channels.

High-Density 64GB Memory Modules

The 64GB capacity class represents a significant milestone in DDR4 memory density. Modules in this category enable servers to scale total system memory into the terabyte range without excessive slot consumption. This density is essential for virtualization hosts, database servers, and in-memory analytics platforms that require large memory footprints to operate efficiently.

High-density memory reduces the need for memory overcommitment strategies that can degrade performance. By deploying sufficient physical memory, system administrators can ensure that workloads operate within optimal parameters, minimizing swap usage and reducing I/O contention.

Lifecycle Support and Platform Compatibility

Server memory modules are often deployed in environments with long refresh cycles. Manufacturers design and support these products with extended lifecycles to ensure availability for maintenance and expansion over multiple years. Compatibility with major server platforms and chipsets is a key aspect of this category.

Compatibility with Modern Server Platforms

This memory category is designed for compatibility with contemporary server processors and chipsets that support DDR4 registered ECC memory. Platform validation ensures that modules operate at their rated speed and capacity when installed according to manufacturer guidelines.

Compatibility extends to a wide range of enterprise server brands and motherboard designs, making this category suitable for both new deployments and system upgrades.

Scalability and Future-Proofing

Investing in high-density DDR4 ECC memory supports future expansion and evolving workload requirements. As applications grow in complexity and data volume, having a scalable memory foundation allows organizations to adapt without frequent hardware replacements.

The Micron MTA72ASS8G72LZ-2G9J1 category supports incremental upgrades, enabling administrators to add capacity as needed while maintaining consistent performance characteristics.