MTA72ASS16G72LZ-2G9B3 Micron 128GB Memory 2933MHz PC4-23400 ECC DDR4 SDRAM Module

Micron 128GB DDR4 ECC Memory 

The Micron MTA72ASS16G72LZ-2G9B3 is a high-capacity 128GB DDR4 SDRAM module engineered for enterprise-grade performance and reliability. Designed with advanced ECC technology, it ensures stability for demanding workloads.

Manufacturer and Identification

• Brand: Micron
• Part Number: MTA72ASS16G72LZ-2G9B3
• Product Name: 128GB DDR4 ECC SDRAM Module

Technical Specifications

Capacity and Type

• Single module with 128GB storage
• Memory technology: DDR4 SDRAM

Speed and Performance

• Rated frequency: 2933 MHz (PC4-23400/PC4-23466)
• Alternative speed: 3200 MHz (PC4-25600)
• Optimized for system compatibility and high throughput

Form Factor and Design

• 288-pin LRDIMM (Load Reduced DIMM)
• Quad Rank configuration (4Rx4)
• Voltage requirement: 1.2V

Reliability and Stability

Error-Correcting Code (ECC)

• ECC functionality ensures data integrity
• Improved system resilience under heavy workloads

Latency Details

CAS Latency Ratings

• CL21 at 2933 MHz
• CL22 at 3200 MHz

MTA72ASS16G72LZ-2G9B3 Memory Modules Overview

High-capacity DDR4 ECC SDRAM modules occupy a critical position within modern enterprise infrastructure, enabling reliable performance for servers, workstations, and mission-critical computing platforms. The Micron MTA72ASS16G72LZ-2G9B3 128GB Memory 2933MHz PC4-23400 ECC DDR4 SDRAM Module represents a specialized category of memory engineered to support data-intensive workloads where stability, scalability, and error mitigation are essential. This category of memory is designed to meet the rigorous demands of virtualization environments, cloud computing architectures, enterprise databases, artificial intelligence training workloads, and large-scale analytics platforms.

DDR4 ECC memory modules such as this Micron 128GB solution are purpose-built for professional computing systems rather than consumer desktops. They integrate advanced error correction capabilities and adhere to strict electrical and thermal specifications mandated by server-class platforms. As organizations process ever-increasing volumes of structured and unstructured data, the role of high-density, high-frequency memory becomes fundamental to maintaining consistent throughput and low-latency access across complex applications.

High-Density Memory Architecture and Scalability

The 128GB capacity of the Micron MTA72ASS16G72LZ-2G9B3 positions it firmly within the high-density memory category, enabling system architects to maximize memory per socket and per server node. High-density modules reduce the total number of DIMM slots required to achieve large memory footprints, which in turn lowers power consumption, improves airflow efficiency, and simplifies server design. This architectural advantage is especially relevant in dense rack-mounted environments and blade servers where space optimization is a key consideration.

Memory scalability is a defining characteristic of this category. Enterprise platforms that support multiple 128GB ECC DDR4 modules can reach several terabytes of system memory, enabling in-memory databases, real-time analytics, and large virtual machine clusters. The ability to scale memory without sacrificing stability or performance allows IT teams to future-proof their infrastructure while maintaining predictable upgrade paths.

Support for Advanced Server Chipsets

This category of Micron DDR4 ECC SDRAM modules is engineered for compatibility with leading server and workstation chipsets from major CPU manufacturers. The memory adheres to JEDEC standards, ensuring reliable interoperability with enterprise motherboards that support PC4-23400 specifications. This compliance reduces integration complexity and ensures consistent performance across certified platforms.

Advanced chipset support allows these modules to operate within multi-channel memory architectures, delivering high aggregate bandwidth and efficient data distribution across CPU cores. This is particularly important for workloads that rely on parallel processing, such as scientific simulations, machine learning model training, and high-frequency transaction processing.

2933MHz and PC4-23400 Bandwidth

Operating at a data rate of 2933MHz, the Micron MTA72ASS16G72LZ-2G9B3 delivers PC4-23400 bandwidth, placing it within a high-performance tier of DDR4 memory modules. This frequency enables faster data transfer between the memory and the processor, reducing latency and improving overall system responsiveness. High memory bandwidth is particularly beneficial for applications that process large datasets or rely on frequent memory access.

The performance characteristics of this category support a wide range of enterprise workloads, including virtualization hosts running dozens of virtual machines, containerized microservices, and high-performance computing tasks. By minimizing memory bottlenecks, 2933MHz DDR4 ECC modules help ensure that CPUs can operate at optimal efficiency without being constrained by data access limitations.

Registered and Load-Reduced Memory Considerations

High-capacity DDR4 ECC memory modules typically fall into registered or load-reduced categories to maintain signal integrity at scale. The Micron MTA72ASS16G72LZ-2G9B3 belongs to a class of enterprise memory designed to reduce electrical load on the memory controller, allowing for higher capacities and improved stability. This architectural approach enables servers to populate more DIMM slots without compromising performance or reliability.

Registered and load-reduced memory designs incorporate buffering mechanisms that isolate the memory controller from the full electrical load of the DRAM chips. This design is essential for achieving high-density configurations such as 128GB per module while maintaining compliance with JEDEC standards and platform specifications.

Benefits for Large Memory Footprints

The category advantages of registered or load-reduced ECC DDR4 memory become especially apparent in systems requiring massive memory footprints. Enterprise databases, in-memory analytics engines, and virtualization platforms benefit from the ability to scale memory capacity without encountering signal degradation or timing issues. This scalability directly translates to improved performance consistency and reduced risk of system instability.

By supporting large memory configurations, the Micron 128GB module enables organizations to consolidate workloads onto fewer physical servers, reducing hardware sprawl and simplifying infrastructure management.

Compatibility and Platform Integration

This category of Micron memory modules is designed with broad platform compatibility in mind. Compliance with industry standards ensures seamless integration into enterprise servers and workstations that support DDR4 ECC memory. System builders and IT professionals can deploy these modules with confidence, knowing they meet the electrical, mechanical, and timing requirements of certified platforms.

Compatibility extends to BIOS and firmware-level support, allowing advanced memory features such as error reporting and performance monitoring to function as intended. This integration is essential for proactive system management and troubleshooting.

Enterprise Validation and Certification

Memory modules in this category undergo extensive validation and certification processes to ensure compatibility with leading server vendors. This rigorous testing minimizes the risk of interoperability issues and supports stable long-term operation. The Micron brand is widely recognized for adherence to these standards, reinforcing trust in the reliability of its enterprise memory solutions.

Certified compatibility simplifies procurement decisions and accelerates deployment timelines, enabling organizations to scale their infrastructure efficiently.