M393A4K40EB3-CWE Samsung 32GB DDR4 3200Mhz Reg Ram

Samsung 32GB DDR4 Memory Module

The Samsung M393A4K40EB3-CWE is a high-performance 32GB DDR4 SDRAM module designed for enterprise servers and workstations. With advanced ECC error correction and registered signal processing, this memory ensures stability, reliability, and speed for demanding computing environments.

General Information

• Brand: Samsung
• Model Number: M393A4K40EB3-CWE
• Product Name: 32GB DDR4 SDRAM Memory Module

Technical Specifications

Core Features

• Capacity: 32GB
• Technology: DDR4 SDRAM
• Module Count: 1 x 32GB

Performance Details

• Speed: 3200Mbps DDR4-3200 / PC4-25600
• Error Correction: ECC (Error-Correcting Code)
• Signal Type: Registered DIMM
• Latency: CL22
• Rank: Dual Rank x4

Physical Characteristics

Design Attributes

• Form Factor: 288-pin RDIMM
• Dimensions: Height 1.00 in x Depth 6.75 in
• Weight: 0.20 lb

Performance

• High-speed 3200Mbps bus for faster data transfer
• Optimized latency (CL22) for efficient workloads

M393A4K40EB3-CWE DDR4 Memory Overview

The Samsung M393A4K40EB3-CWE 32G PC4-25600 DDR4-3200Mbps 2RX4 ECC Memory belongs to a high-performance enterprise server memory category engineered for reliability, scalability, and sustained throughput in professional computing environments. This category focuses on Registered DIMM (RDIMM) DDR4 memory modules designed specifically for servers, data centers, and mission-critical infrastructure. Unlike consumer-grade memory, this class of RAM is manufactured to strict tolerances, validated for continuous operation, and optimized to support demanding workloads across virtualization platforms, cloud computing frameworks, and enterprise databases.

DDR4 server memory in this category operates at higher data rates while maintaining lower voltage requirements compared to earlier generations. Running at 3200Mbps, PC4-25600 memory provides a substantial bandwidth increase, enabling faster data access, reduced latency, and improved overall system responsiveness. The architecture behind this memory type emphasizes signal integrity and electrical stability, ensuring that performance remains consistent even when multiple modules are populated across memory channels.

32GB Capacity for High-Density Workloads

The 32GB module capacity positions this memory category as a preferred choice for modern servers that require large memory pools. High-density memory modules reduce the total number of DIMM slots required to reach system capacity targets, allowing for more efficient use of server hardware. This is particularly beneficial in dual-socket and multi-socket server platforms where memory scalability directly impacts application performance and consolidation ratios.

Workloads such as virtualization, container orchestration, enterprise resource planning systems, and large-scale analytics benefit significantly from higher per-module capacities. By minimizing memory fragmentation and improving data locality, 32GB DDR4 RDIMM modules help maintain predictable performance under heavy load. This category is engineered to support memory-intensive applications that demand both capacity and speed without compromising system stability.

Registered DIMM Technology for Signal Stability

Registered DIMM technology is a defining characteristic of this memory category. RDIMM modules incorporate a register between the memory controller and the DRAM chips, reducing electrical load on the controller and enabling the use of more memory modules per channel. This buffering mechanism enhances signal integrity, allowing servers to operate reliably with larger memory configurations.

The inclusion of a register is essential in enterprise environments where scalability and uptime are critical. By stabilizing command and address signals, RDIMM memory ensures that data is transmitted accurately across the memory bus, even in densely populated systems. This design supports higher memory capacities and contributes to the long-term reliability expected from server-class hardware.

2RX4 Rank and Chip Organization

The 2RX4 configuration indicates a dual-rank module with x4 DRAM chips, a layout commonly used in enterprise memory designs. This organization enhances performance by allowing the memory controller to interleave access across ranks, improving throughput and reducing access latency. The x4 chip configuration also strengthens ECC effectiveness by enabling more robust error detection and correction mechanisms.

Memory modules in this category are optimized for compatibility with server platforms from major OEMs. The 2RX4 design aligns with industry standards for enterprise servers, ensuring broad support across motherboard chipsets and CPU architectures. This compatibility simplifies deployment and reduces validation overhead for IT administrators.

DDR4-3200 Speed and Bandwidth Advantages

Operating at DDR4-3200, this memory category delivers a data transfer rate of 3200 megatransfers per second, translating to a theoretical bandwidth of 25.6GB/s per module. This high bandwidth supports data-intensive applications that rely on rapid memory access, such as real-time analytics, high-performance computing workloads, and in-memory databases.

Compared to lower-speed DDR4 modules, DDR4-3200 memory reduces bottlenecks between the CPU and memory subsystem. This improvement allows processors to operate more efficiently, maximizing core utilization and reducing idle cycles. The result is a balanced system architecture where memory performance complements modern multi-core CPUs.

Compatibility with Modern Server Platforms

The Samsung M393A4K40EB3-CWE memory category is designed for compatibility with contemporary server architectures supporting DDR4 RDIMM ECC memory. This includes platforms based on Intel Xeon and AMD EPYC processors that leverage multi-channel memory configurations for optimal performance.

Adherence to JEDEC standards ensures seamless integration with supported motherboards and chipsets. This standards-based design simplifies system upgrades and expansions, allowing organizations to scale memory capacity without extensive reconfiguration or compatibility concerns.

Industry Compliance and Standards Alignment

Compliance with JEDEC and other industry standards ensures interoperability and predictable behavior across platforms. This alignment simplifies procurement, deployment, and maintenance processes for IT teams managing large fleets of servers.

Standards compliance also supports performance consistency, allowing organizations to design and optimize systems with confidence. The Samsung M393A4K40EB3-CWE memory category embodies these principles, making it a dependable choice for enterprise infrastructure.