370-BCDF Dell Server Module 256GB DDR5-4800MHz Memory

Dell 370-BCDF 256GB DDR5 Server Memory Kit

Memory Capacity

The Dell 370-BCDF memory bundle provides a total capacity of 256GB through 16 individual 16GB memory modules. This configuration is specifically engineered for servers requiring substantial memory resources while maintaining optimal performance across all DIMM slots. Each 16GB module operates as part of a balanced memory subsystem, ensuring efficient data handling and processing capabilities for memory-intensive applications. The 16-module configuration allows for maximum memory channel utilization in compatible server platforms, providing exceptional memory bandwidth for enterprise workloads, virtualization environments, and data-intensive computing tasks.

Memory Technology and Architecture

This memory solution utilizes DDR5 SDRAM technology, representing the fifth generation of double data rate synchronous dynamic random-access memory. DDR5 architecture delivers significant improvements over previous generations, including doubled burst length, increased bank groups, and enhanced command bus efficiency. The 288-pin RDImm (Registered Dual In-line Memory Module) design incorporates registered memory buffers that reduce electrical load on the memory controller, enabling higher module densities and improved signal integrity. The 1RX8 organization indicates single-rank architecture with eight internal memory banks, optimized for balanced performance and compatibility in server environments.

Performance Characteristics

Speed and Timing Parameters

Operating at 4800MHz (MT/s), the Dell 370-BCDF memory delivers substantial data transfer rates with a peak bandwidth of PC5-38400. This translates to a theoretical maximum transfer rate of 38,400 MB/s per module, providing exceptional performance for data-intensive server applications. The CAS Latency (CL40) timing represents the number of clock cycles between a read command and data availability, with lower values generally indicating faster response times. The 1.1V operating voltage represents a significant reduction from previous DDR4 standards, contributing to improved power efficiency and reduced thermal output in densely populated server configurations.

Bandwidth and Data Transfer Capabilities

The DDR5 architecture in the 370-BCDF modules implements a dual 32-bit sub-channel design with independent command/address buses, effectively doubling the available command bandwidth compared to DDR4. This architectural improvement enables more efficient memory access patterns and reduces contention between memory operations. The 4800MHz data rate provides substantial bandwidth for processor-to-memory communication, essential for modern multi-core server processors that require extensive memory resources to maintain optimal performance across all computing cores.

ECC and Registered Features

The ECC (Error Correcting Code) functionality represents a critical reliability feature for server environments. This technology can detect and correct single-bit memory errors automatically, while also detecting multi-bit errors. The implementation includes on-die ECC that corrects errors within the DRAM chips themselves, providing an additional layer of data integrity protection. This comprehensive error correction capability ensures data accuracy and system stability, making it essential for mission-critical applications, financial transactions, scientific computing, and enterprise database operations where data integrity is paramount.

Registered DIMM Architecture

The Registered DIMM (RDIMM) design incorporates memory registers (or buffers) on the memory module itself. These registers buffer the command, address, and clock signals between the memory controller and the DRAM chips, reducing the electrical load on the memory controller. This buffering enables support for higher memory capacities per channel and allows for more DIMMs to be populated per memory channel without signal degradation. The registered architecture significantly improves signal integrity and system stability in memory-intensive server configurations, particularly when operating at high frequencies with multiple modules installed.

Physical Specifications

Power Management Features

Operating at 1.1V, the Dell 370-BCDF memory modules demonstrate significant power efficiency improvements over previous generations. The DDR5 standard incorporates enhanced power management capabilities, including a dedicated power management IC (PMIC) on each module. This distributed power architecture provides more stable voltage regulation and improved power delivery efficiency. The PMIC enables better power distribution across the memory module, reducing voltage droop and improving signal integrity during high-frequency operation. These power efficiency improvements contribute to reduced overall system power consumption and decreased cooling requirements in data center environments.

Physical Dimensions

The 288-pin DIMM form factor follows the standard dimensions for server memory modules, measuring approximately 133.35mm in length and 31.25mm in height. The physical design includes a centrally located keying notch that prevents incorrect installation in incompatible memory slots. The module PCB utilizes high-quality materials with optimized signal routing to maintain signal integrity at 4800MHz operation. The mechanical design ensures proper fit and retention in server memory slots, with secure fastening mechanisms for vibration-resistant installation in rack-mounted server environments.

Dell PowerEdge Server

The Dell 370-BCDF memory bundle is engineered for compatibility with specific Dell PowerEdge server platforms that support DDR5 technology. This includes next-generation PowerEdge servers featuring Intel Xeon Scalable processors or equivalent AMD EPYC platforms with DDR5 memory controllers. The modules are validated and tested for operation in Dell's memory configuration guidelines, ensuring optimal performance and reliability. Compatibility extends to various server form factors including rack servers, tower servers, and modular infrastructure solutions, providing flexible deployment options for different data center requirements.

Reliability

Dell memory modules undergo rigorous testing and validation processes to ensure enterprise-grade reliability. The 370-BCDF modules are manufactured using high-quality components and undergo extensive testing at multiple stages of production. This includes component-level testing, module-level validation, and system-level compatibility testing. The manufacturing process incorporates strict quality control measures and follows Dell's comprehensive reliability standards for server components. Each module is tested for electrical characteristics, timing parameters, and thermal performance to ensure consistent operation in demanding server environments.

Performance Applications and Use Cases

Enterprise Workload Optimization

The 256GB memory capacity provided by the Dell 370-BCDF bundle is ideally suited for server virtualization platforms, enabling support for numerous virtual machines on a single physical host. The high memory bandwidth and capacity support memory-intensive virtualization workloads, including virtual desktop infrastructure (VDI), application virtualization, and cloud computing platforms. The ECC protection ensures data integrity for critical virtualized applications, while the registered architecture maintains system stability with high memory utilization levels. The configuration supports advanced virtualization features including memory overcommitment and dynamic memory allocation.

Database and Transaction Processing

Database management systems benefit significantly from the high memory capacity and bandwidth provided by the Dell 370-BCDF memory configuration. The 256GB capacity enables large database buffer pools and in-memory processing, reducing disk I/O and improving transaction throughput. The ECC functionality ensures data integrity for critical database operations, while the registered architecture maintains stability during high-concurrency transaction processing. The memory characteristics are optimized for both online transaction processing (OLTP) and data warehousing workloads, providing consistent performance for enterprise database applications.

Technical Computing Applications

High-Performance Computing

Technical computing workloads including scientific simulations, engineering analysis, and research computing benefit from the high memory bandwidth and capacity of the Dell 370-BCDF memory bundle. The DDR5 architecture provides improved performance for memory-bound applications, while the ECC protection ensures computational accuracy for scientific and engineering calculations. The 16-module configuration enables optimal memory bandwidth utilization across all processor cores, supporting parallel processing applications and distributed computing workloads common in high-performance computing environments.

Data Analytics

Modern analytics platforms and business intelligence applications require substantial memory resources for in-memory processing and data caching. The 256GB capacity supports large dataset processing in memory, enabling faster analytics processing and improved query performance. The memory bandwidth characteristics optimize data movement between processors and memory, reducing processing latency for complex analytical queries. The reliability features ensure continuous operation for critical business intelligence applications that process organizational data for decision support and operational reporting.