370-BCKK Dell 16GB DDR5 5600mhz Pc5-44800 SDRAM 288-pin Rdimm Memory.

Dell 370-BCKK 16GB DDR5 Server Memory Kit

Core Memory Module Architecture

The Dell 370-BCKK represents a significant advancement in server memory technology, utilizing DDR5 SDRAM architecture to deliver enhanced performance and reliability for enterprise server environments. This 16GB module operates at a base frequency of 5600MHz, providing substantial bandwidth improvements over previous DDR4 generations. The implementation of DDR5 technology brings several architectural enhancements including separate power management integrated circuits (PMICs), which distribute power more efficiently across the memory module, reducing overall system power consumption while maintaining optimal performance levels. The module's 1RX8 single-rank design ensures efficient memory access patterns and compatibility with a wide range of server configurations.

Memory Chip Organization

This memory module features a sophisticated chip organization with 1x16GB capacity utilizing advanced DDR5 memory chips arranged in a single-rank configuration. The 1RX8 designation indicates the module uses x8 DRAM devices, which provides optimal balance between performance, capacity, and signal integrity. This organization allows for efficient memory access patterns and reduces electrical loading on the memory bus, enabling higher operating frequencies. The module incorporates high-quality memory chips that undergo rigorous testing and validation processes to ensure consistent performance and long-term reliability in 24/7 server operation environments.

Detailed Performance Specifications

The Dell 370-BCKK operates at a maximum data rate of 5600 megatransfers per second (MT/s), corresponding to a PC5-44800 classification. This high-speed operation enables peak theoretical bandwidth of approximately 44.8 GB/s per module when operating in dual-channel configurations. The module maintains CAS Latency (CL) timing of 46 cycles at the rated 5600MHz speed, representing an optimized balance between latency and bandwidth for server workloads. The DDR5 architecture introduces burst length of 16, doubling the burst chop length from DDR4's 8, which improves efficiency for sequential memory access patterns common in server applications.

Advanced Timing Parameters

Beyond the primary CAS Latency of CL46, this memory module operates with carefully calibrated secondary and tertiary timings to ensure stable performance across varying server workloads. The tRCD (RAS to CAS Delay) and tRP (RAS Precharge) timings are optimized for server environments where mixed read/write operations are common. The module supports gear 2 operation mode, which is standard for DDR5 memory, allowing the memory controller to operate at half the data rate of the memory bus for improved signal integrity and timing margins. These advanced timing parameters are factory-programmed into the module's SPD (Serial Presence Detect) for automatic configuration in compatible systems.

Voltage and Power Management

The module operates at a nominal voltage of 1.1V, representing a significant reduction from DDR4's 1.2V operating voltage while delivering higher performance. This lower operating voltage contributes to reduced power consumption and heat generation, critical factors in dense server deployments. The integrated PMIC (Power Management Integrated Circuit) efficiently distributes power to the various components on the memory module, providing more stable voltage regulation compared to motherboard-based power delivery systems used in previous memory generations. The PMIC also enables advanced power management features including multiple power states and fine-grained power monitoring capabilities.

Power Efficiency Features

This DDR5 module incorporates several power-saving technologies designed for enterprise environments where energy efficiency directly impacts operational costs. The module supports multiple low-power states including active power-down and self-refresh modes that automatically engage during periods of reduced memory activity. The improved bank grouping architecture allows for more precise power management by enabling individual bank refresh operations, reducing the overall power consumed during refresh cycles. These efficiency improvements make the Dell 370-BCKK particularly suitable for large-scale server deployments where aggregate power savings can be substantial.

Advanced Server Memory Features

Error Correction and Reliability

The Dell 370-BCKK incorporates Error Correcting Code (ECC) technology, a critical feature for server environments where data integrity is paramount. The ECC implementation can detect and correct single-bit errors automatically, while detecting multi-bit errors to prevent data corruption. This module utilizes x4 DRAM devices with built-in ECC, providing chip-level error correction in addition to the standard module-level ECC protection. This dual-layer error correction approach significantly enhances reliability compared to non-ECC memory and provides protection against various types of memory errors including those caused by alpha particles and cosmic rays.

Registered DIMM Architecture

As a Registered DIMM (RDIMM), this memory module includes register chips that buffer the command, address, and control signals between the memory controller and the DRAM chips. This buffering reduces the electrical load on the memory controller, enabling support for higher memory capacities and more DIMMs per channel while maintaining signal integrity at high speeds. The registered design is particularly beneficial in multi-processor server systems where large memory configurations are common. The registers introduce a minimal additional latency of typically one clock cycle, which is largely mitigated by the higher operating frequencies of DDR5 technology.

On-Die ECC and Reliability Features

The DDR5 architecture in the Dell 370-BCKK introduces on-die ECC, which provides additional error correction within each individual DRAM chip. This feature corrects errors that occur within the DRAM array before they can affect the wider memory system, improving overall reliability and extending the usable life of the memory module. The combination of on-die ECC and module-level ECC creates a comprehensive error correction system that is particularly valuable in mission-critical server applications where maximum uptime is required. This advanced error correction capability also allows for the use of higher-density memory chips while maintaining excellent reliability characteristics.

Form Factor

The Dell 370-BCKK utilizes a standard 288-pin DIMM form factor with a length of 133.35mm and height typically around 31.25mm, though exact dimensions may vary slightly based on the heat spreader design. The pin configuration is specifically designed for DDR5 technology and is not compatible with DDR4 slots due to different keying positions. The module features a single notch position that prevents incorrect installation in incompatible memory sockets. The physical design includes reinforced edges and secure fastening points to withstand the mechanical stresses of installation and removal in server environments.

Supported Server Platforms

The Dell 370-BCKK is engineered specifically for compatibility with Dell PowerEdge servers and other enterprise server systems that support DDR5 registered ECC memory. This module is validated for use in single-processor and dual-processor server configurations that require 5600MHz DDR5 RDIMMs. Compatibility extends to various server generations designed for DDR5 memory technology, though specific compatibility should be verified against the server's technical specifications and qualified vendor list. The module operates in memory channels that support DDR5 architecture and requires a memory controller capable of managing DDR5-specific features including the integrated PMIC.