874585-001 HPE Proliant ML350 Gen 10 LGA3647 DDR4 Server Motherboard

HPE 874585-001 ProLiant ML350 Gen10 DDR4 Server Motherboard

HPE 874585-001, ProLiant ML350 Gen10 motherboard, ML350 Gen10 system board, LGA3647 server motherboard, DDR4 server board, Intel Xeon Scalable compatible, 24 DIMM slots, HPE system board spare, server motherboard replacement, HPE ProLiant ML350 Gen10 parts.

Technical at-a-glance

This category centers on the HPE 874585-001 system board (motherboard) engineered for the HPE ProLiant ML350 Gen10 rack/tower server platform. The board implements an LGA3647 (FCLGA3647) dual-socket design, enabling support for Intel’s 1st and 2nd Generation Xeon Scalable processors and the high-memory, high-I/O configuration modern datacenter workloads require. It supports a 24-DIMM memory architecture (12 DIMMs per CPU) using DDR4 modules up to the supported platform speeds, and offers enterprise-grade features such as integrated system management, array controller compatibility, and multiple expansion slots for NICs, HBAs, and GPUs.

Compatibility & part-number details

Primary part number and cross-references

The canonical part number for the ProLiant ML350 Gen10 system board in this category is 874585-001. This part is commonly listed by vendors and as the system board / motherboard for ML350 Gen10 chassis configurations. Related or alternate HPE part numbers found in the ML350 Gen10 ecosystem (for different board revisions or I/O assemblies) may appear in vendor listings; always verify the machine serial/chassis model before ordering to avoid mismatched revisions.

Server models

Designed specifically for the HPE ProLiant ML350 Gen10 family, the 874585-001 board pairs with the ML350 Gen10 chassis, power and cooling assemblies, and compatible drive backplanes. It is a direct-fit component intended for repair, refurbishment, or factory-equivalent rebuilds of ML350 Gen10 systems. When replacing a system board, confirm firmware (iLO and system ROM) compatibility after installation and before returning systems to production.

Processor & socket architecture

Socket and CPU compatibility

The board uses the FCLGA3647 socket (commonly referred to as LGA3647), housing either one or two Intel Xeon Scalable processors from the 1st or 2nd generation families (Bronze, Silver, Gold, Platinum tiers as supported by the platform). Dual-CPU capability allows the server to scale compute threads and memory channels for virtualization, database, and HPC workloads. Processor selection directly affects supported memory speeds, maximum core counts, and platform features such as Intel AVX-512 acceleration and Turbo Boost behavior.

Memory architecture & capacity

DIMM slots, channels, and supported module types

One of the defining characteristics of the 874585-001 board is its high-density memory capability: the board exposes a total of 24 DIMM slots — 12 per processor (six memory channels per CPU with two DIMMs per channel). This topology enables large in-memory datasets, cache-heavy services, and memory-intensive virtualization. The platform accepts DDR4 RDIMM and LRDIMM module types, with maximum achievable capacities depending on DIMM population and CPU generation. Typical documented capacities include support for RDIMMs into the hundreds of gigabytes range and LRDIMMs to multi-terabyte levels when using the correct processor family and HPE Smart Memory modules.

Expansion, storage & I/O

PCIe lanes and expansion slots

The ML350 Gen10 motherboard exposes multiple PCIe slots (bandwidth and exact slot count vary with board revision and chassis I/O configuration) to accommodate NICs, HBAs, NVMe adapters, GPUs, and hardware accelerators. The CPU selection determines the number of direct PCIe lanes available; using full-length, full-height cards is common in tower/rack variants for virtualization and storage offload purposes. For high-performance networking, consider 10GbE or 25GbE adaptors that fit the x8/x16 slots available on the ML350 platform.

NVMe & high-performance storage notes

If using NVMe devices, verify the chassis backplane and I/O riser support for NVMe passthrough and the required cooling profile. NVMe drives produce higher thermal density; HPE ML350 Gen10 designs usually include adequate airflow, but aftermarket or mixed configurations should be validated in a lab before deployment.

Management, firmware & serviceability

iLO and system firmware

The ML350 Gen10 system board integrates HPE iLO (Integrated Lights-Out) management functions for remote control, out-of-band monitoring, and firmware update orchestration. After an 874585-001 board installation, updating iLO and system ROM to supported HPE firmware levels is best practice to enable the latest security fixes, hardware compatibility, and BMC features. HPE’s support site and Quick Specs list the recommended firmware bundles for the ML350 Gen10 platform. 

Physical, power & thermal considerations

Form factor and mounting

While this is a server-grade system board tuned for the ML350 Gen10 tower/rack convertible chassis, physical mounting points, I/O cutouts, and standoff locations are specific to HPE’s design. Replacement boards (874585-001) sold as spare assemblies may include the base pan or I/O bracket depending on the vendor listing—inspect the product pictures and description to confirm whether the assembly includes the base pan and connectors.

Power & cooling

This motherboard requires the ML350 Gen10 power distribution and thermal design to meet TDP and peak power draw of high-core-count processors and populated DIMM banks. If you intend to populate with high-wattage Platinum CPUs, multiple GPU cards, or NVMe arrays, verify that the chassis power supply SKU and fan modules are rated accordingly. Replacing the system board does not change required power capacity; check HPE Quick Specs for recommended power supply configurations based on your targeted CPU and storage mix.

When NOT to choose ML350 Gen10 (874585-001)

If your workload is GPU-dominated (dense multi-GPU servers), ultra-dense NVMe-only storage appliances, or the latest CPU microarchitecture is required (beyond the 1st/2nd Gen Xeon Scalable line), consider newer platform families or GPU-specialized nodes. The ML350 Gen10 sits in a balanced mid-market, not in the hyper scaler ultra-dense segment.

New vs refurbished parts

874585-001 boards are commonly sold both new and refurbished. Refurbished assemblies are a cost-effective route for replacement and upgrades, but always confirm the vendor’s testing procedures, warranty length (typically 30–90 days on refurbished boards, varying by seller), and whether the assembly includes additional components such as the base pan, I/O bracket, or heatsink mounting hardware. Vendors frequently provide images and testing statements—review those closely and ask for a POST/test report if possible.

Firmware & lifecycle

After installing a replacement board, register the server with HPE where applicable and plan for firmware updates. Official HPE and entitlements differ for boards sold as “spare parts” versus full-system purchases. If continuing with a third-party refurbished board, consider purchasing an extended support contract or service pack for critical production systems.

On-page content signals

To improve organic visibility, include spec tables, quick-compare callouts (e.g., how 874585-001 differs from related ML350 system board SKUs), installation photographs, and buyer guidance (new vs refurbished) on the category page. Provide downloadable Quick Specs and links to HPE resources (support & maintenance guides) where permitted. Structured content headings (as used on this page) help search engines parse the product attributes and index key technical terms such as “LGA3647”, “DDR4 24 DIMM”, and “ProLiant ML350 Gen10”.

Authoritative resources & references

For formal product datasheets, installation guides, firmware bundles, and maintenance instructions consult HPE official Quick Specs and support documentation for the ProLiant ML350 Gen10 server family. Vendor listings, tested-refurbished vendors, and specialist parts suppliers also list the 874585-001 board with photos, testing notes, and optional accessories.