P11442-191 HPE 16GB DDR4 3200MHz Cl22 288 Pin PC4-25600 Single Rank X4 ECC Registered Memory Module.
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HPE P11442-191 16GB DDR4 3200MHz CL22 288-Pin PC4-25600 Single Rank x4 ECC Registered Memory Module
The HPE P11442-191 is a server-grade 16GB DDR4-3200 RDIMM engineered for enterprise workloads where performance, stability, and data integrity are non-negotiable. Built around a 288-pin dual in-line memory form factor and tuned to the PC4-25600 bandwidth class, this module pairs JEDEC-compliant DDR4 architecture with Hewlett Packard Enterprise validation to deliver predictable throughput, low latency relative to its class, and robust RAS (Reliability, Availability, Serviceability) features. With ECC and register buffering, it sustains high memory channel utilization while protecting against soft errors, making it a dependable choice for virtualization clusters, database servers, software-defined storage, and cloud-native application hosts.
Core Specifications
- Capacity: 16GB
- Memory Type: DDR4 SDRAM
- Data Rate: 3200 MT/s (3200MHz effective)
- Speed Grade: PC4-25600
- CAS Latency: CL22
- Form Factor: 288-pin RDIMM
- ECC: Yes (Error-Correcting Code)
- Buffering: Registered (with register/buffer for command/address)
- Organization: Single Rank x4
- Voltage: 1.2V nominal (DDR4 standard)
- Thermal Sensor: Often integrated (TSOD) for server thermal management
- Compatibility Focus: HPE ProLiant and HPE systems supporting DDR4 RDIMM
Server-Class RDIMM Matters
Registered DIMMs reduce the electrical load on a server’s memory controller by inserting a register between the DRAM and the controller for command/address signals. This buffering allows more DIMMs per channel and improved signal integrity at high speeds such as 3200 MT/s. When combined with ECC, RDIMMs provide a foundation for round-the-clock reliability in mission-critical environments. The P11442-191 module leverages these characteristics to maintain consistency across variable workloads, helping meet service-level objectives without sacrificing capacity or timing stability.
Memory Architecture and Performance
- Storage Capacity: A single 16GB module provides significant memory allocation for demanding applications.
- Operating Speed: Operates at a swift 3200MHz, corresponding to a PC4-25600 classification for high-throughput data processing.
- Advanced Design: Configured in a 1Rx4 (Single Rank by 4) organization and utilizes Registered (RDIMM) technology to enhance signal integrity and support larger memory capacities.
Enhanced Data Integrity and Reliability
- Error Correction: Incorporates ECC (Error Correcting Code) to automatically detect and correct single-bit memory errors, safeguarding against data corruption and system crashes.
- CAS Latency: Features a CL22 latency timing, optimizing the delay between a command and data availability.
- Form Factor: Designed on a standard 288-pin DIMM printed circuit board, ensuring a secure physical connection.
- Power Efficiency: Functions at a low 1.2V, reducing overall energy consumption and thermal output.
Compatible Server Platforms
This component is a validated and certified upgrade specifically engineered for select HPE ProLiant Gen10 Plus servers, ensuring flawless integration and optimal performance.
Supported Systems and Devices
- HPE ProLiant DL325 Gen10 Plus
- HPE ProLiant DL385 Gen10 Plus
- HPE ProLiant DL385 Gen10 Plus Entry Server Models
Intended Application and Usage
This is a system-specific memory upgrade engineered to expand the capabilities of compatible HPE server infrastructures, from virtualized environments to data-heavy analytics.
Performance Characteristics
PC4-25600 Bandwidth Explained
PC4-25600 denotes an approximate peak theoretical bandwidth of 25.6 GB/s per module when operating at 3200 MT/s across a 64-bit data bus (plus additional bits for ECC). While real-world throughput depends on channel counts, memory interleaving, and workload access patterns, the 3200 data rate ensures high sustained bandwidth for in-memory databases, analytics engines, and virtualization hypervisors that thrive on parallel memory access.
CL22 Latency in Context
CAS latency (CL) describes the number of clock cycles between a read command and the data availability. CL22 at 3200 MT/s aligns with mainstream server-validated DDR4 timing, balancing frequency and stability under multi-DIMM channel populations. In practical terms, CL22 at 3200 outperforms lower-frequency modules with tighter timings due to the higher effective data rate. For latency-sensitive microservices and transaction processing, this balance sustains low tail latency while maximizing throughput.
Single Rank x4 Organization
Single Rank indicates the memory controller addresses one 64-bit data rank per module (plus ECC bits). Fewer ranks can reduce rank-to-rank switching overhead and help achieve rated speeds with multiple DIMMs installed. The x4 device width enhances ECC robustness: x4-based RDIMMs allow advanced error correction schemes to isolate failures at the nibble level in certain server architectures, improving fault containment compared with x8 devices under specific failure modes.
Channel Utilization and Interleaving
Optimal performance emerges from populating memory in pairs or sets aligned to the number of channels on the CPU. Many HPE ProLiant platforms offer 6 or 8 channels per CPU (depending on generation). Deploying identical 16GB RDIMMs across channels enables symmetric interleaving, which improves bandwidth and reduces latency jitter. The P11442-191 module’s 3200 MT/s speed lets channels saturate faster, especially in NUMA-aware applications that localize memory to each socket.
Reliability and Data Integrity
ECC Protection
ECC detects and corrects single-bit errors and detects (but does not always correct) multi-bit errors, preventing silent data corruption caused by cosmic rays, electrical noise, or marginal signal conditions. For workloads such as financial computation, medical imaging, scientific modeling, and distributed caches, ECC reduces crash rates and preserves database integrity during long uptimes.
Registered Buffering
The register on RDIMMs stabilizes command and address signal timing. This reduces the load seen by the memory controller, allowing more modules to populate each channel without dropping speed tiers unnecessarily. Stability at 3200 MT/s is crucial for dense memory configurations under thermal stress and vibration in data center racks.
Thermal Sensor and Throttling Awareness
Many enterprise RDIMMs integrate a Temperature Sensor on DIMM (TSOD) accessible via SMBus. HPE iLO and system firmware can read TSOD values to manage fan curves and protect modules from overheating. When temperatures rise, systems can adjust airflow or reduce memory frequency to maintain reliability. The P11442-191 operates efficiently at 1.2V, lowering thermal output compared with legacy DDR3 while offering higher performance.
RAS Features Across the Stack
- Parity on command/address through the register to avoid mis-decodes.
- ECC on data path to correct single-bit errors transparently.
- Support for patrol scrubbing and demand scrubbing via system firmware.
- Fault isolation enabling predictive failure analysis in HPE platforms.
- Consistent BOM control and component screening aligned with HPE validation.
Compatibility Considerations
HPE Server Platforms
The P11442-191 is intended for HPE systems that support DDR4 3200 RDIMM modules, including many ProLiant rack and tower servers from the DDR4 era. Platform support varies by CPU generation and BIOS/UEFI version. Matching RDIMM type (registered) and speed class (3200/PC4-25600) across all installed modules ensures best results. Mixing RDIMM with LRDIMM within the same system is not supported; RDIMM must be used consistently per platform guidelines.
Population Rules
- Populate memory channels symmetrically: the same capacity and speed per channel whenever possible.
- Follow HPE slot numbering and priority: fill white/primary slots first to enable maximum speed.
- Avoid mixing different ranks and organizations when targeting top speed; single rank x4 modules often achieve rated 3200 MT/s with more DIMMs per channel than multi-rank alternatives.
- Do not mix RDIMM and LRDIMM; choose one type per system configuration.
Operating Frequencies Under Mixed Loads
If combining 16GB DDR4-3200 RDIMMs with lower-speed DDR4 modules, the memory controller typically trains to the lowest common speed and loosest timings detected. For consistent latency and throughput, maintain a uniform set of P11442-191 modules across all channels.
BIOS/UEFI Requirements
Ensure the server runs a firmware version that recognizes DDR4-3200 RDIMMs and supports the installed CPU microcode. Enabling memory interleaving, NUMA optimization, and ECC scrubbing schedules can further improve stability and predictability for long-running workloads.
Use Cases and Workload Fit
Virtualization Hosts
Hypervisors such as VMware ESXi, Microsoft Hyper-V, and KVM prioritize memory stability and predictable latency. A 16GB RDIMM capacity point is ideal for granular scaling of per-host memory pools. Deploying banks of P11442-191 modules lets administrators tune vCPU-to-RAM ratios, reduce swapping, and maintain high consolidation ratios while preserving performance isolation between tenants.
Database and Analytics
Transactional databases (OLTP) and analytical workloads (OLAP) both benefit from high memory bandwidth and ECC reliability. Buffer caches, query planners, and columnar engines leverage fast DDR4-3200 to keep hot data resident. Single rank organization helps sustain 3200 MT/s at higher population counts, a practical advantage for nodes that must scale capacity without stepping down to lower speed bins.
Software-Defined Storage
Storage platforms—whether object, block, or distributed file—rely on RAM for metadata caching, deduplication tables, and write-back buffers. ECC RDIMMs guard against silent data corruption cascading into storage layers. The P11442-191’s bandwidth and latency profile keeps I/O front-end services responsive, reducing tail latency during consistency checks and rebuilds.
Edge and Branch Deployments
At the edge, environmental variability and limited on-site support increase the value of server-grade memory. With ECC and robust timing at 3200 MT/s, the module supports container orchestration, local AI inference caches, and retail POS back-ends where service continuity matters.
Physical and Electrical Details
288-Pin Connector and Keying
DDR4 modules use a single notch keyed differently than DDR3, preventing mis-insertion. The 288-pin edge connector maximizes contact density and signal integrity. Installation should be perpendicular with even pressure on the latches to avoid flexing the PCB.
Voltage and Power Envelope
Running at 1.2V, DDR4 improves power efficiency compared with DDR3’s 1.5V/1.35V variants. Actual power draw depends on activity factor, refresh rates, and temperature. Data center operators can estimate per-DIMM power to fine-tune rack-level power budgets. Lower per-DIMM consumption helps increase memory capacity per rack within power and cooling constraints.
Thermal Practices
- Maintain clear airflow paths across memory banks.
- Use blanking panels to prevent recirculation in unoccupied bays.
- Monitor DIMM temperature via iLO and set alert thresholds.
- Balance population across sockets to avoid localized hot spots.
Architecture Notes and Best Practices
RDIMM vs. LRDIMM
RDIMMs (Registered) and LRDIMMs (Load-Reduced) both buffer command signaling, but LRDIMMs additionally buffer data lines to allow higher module density. RDIMMs typically offer lower latency and cost per GB at moderate capacities, making 16GB P11442-191 modules a strong fit for mainstream servers requiring balanced performance without the overhead of load-reduction on the data bus.
Rank Interleaving
Single rank modules can deliver consistent timing at higher channel populations, but may have fewer parallel banks than dual-rank modules. When multiple 16GB single-rank modules populate all channels, bank-level parallelism remains high thanks to multi-channel interleaving, preserving bandwidth efficiency for multithreaded workloads.
NUMA Awareness
In dual-socket servers, place equal numbers of P11442-191 RDIMMs on each CPU to maintain balanced NUMA nodes. Pin memory-intensive services to local NUMA nodes to minimize remote memory access. Many modern operating systems and orchestrators support NUMA hints and automatic placement to take advantage of this layout.
Error Handling and Scrubbing
Enable background scrubbing to proactively read and correct memory contents. Demand scrubbing corrects errors when detected during normal operation, while patrol scrubbing periodically scans all addresses. Together with ECC, these features reduce uncorrectable error risk over long uptimes.
Deployment Scenarios
Scale-Out Clusters
Homogeneous memory configurations simplify fleet management. Using the same 16GB DDR4-3200 RDIMM across nodes ensures predictable performance and reduces spare-part SKUs. Automation tools can rely on consistent hardware characteristics to provision images and set performance baselines.
Container Platforms
Kubernetes and similar orchestrators benefit from deterministic node memory. With a bank of P11442-191 modules, resource quotas map cleanly to physical capacity, enabling higher pod density without memory ballooning. ECC confines transient errors from affecting containerized microservices sharing the same host.
VDI and Application Streaming
Virtual desktop infrastructures and app streaming platforms thrive on memory capacity and throughput. A 3200 MT/s RDIMM alleviates contention during login storms and profile synchronization. The 16GB increment allows precise scaling to match user concurrency and profile sizes.
Installation Guidance
Handling and ESD Precautions
- Use a grounded wrist strap and antistatic mat.
- Handle modules by the edges; avoid touching contacts or components.
- Store in ESD-safe packaging until installation.
Slot Population Order
Follow the server’s memory slot color coding and numbering. Typically, primary slots per channel populate first to enable dual-channel or hexa-/octa-channel modes at full speed. Consult chassis-specific labels or maintenance guides to map channels A–H correctly for symmetric interleaving.
Firmware and Diagnostics
After installation, update system ROM and iLO firmware. Run built-in memory diagnostics or burn-in tests to validate stability at 3200 MT/s. Monitor ECC event logs; correctable errors should remain rare and evenly distributed. A spike in correctable errors on a single module may warrant reseating or replacement.
Security and Supply Chain Confidence
Platform Integration
HPE-validated modules are tested for compatibility with HPE firmware, thermal envelopes, and mechanical tolerances. Tight BOM control reduces variance between production lots, aiding predictable long-term behavior. Combined with platform security features and signed firmware, the memory stack becomes a dependable foundation for regulated industries.
Data at Rest and In Flight
While DIMMs themselves do not encrypt data, their reliability supports higher-level encryption solutions (such as OS disk encryption, database TDE, and application-layer crypto) by keeping key material and buffers error-free under load. ECC reduces the chance that cryptographic operations will fail or, worse, silently corrupt, safeguarding sensitive workloads.
Capacity Planning
Right-Sizing with 16GB Increments
Choosing 16GB steps offers flexibility for growth. Organizations can start with a balanced set across channels and scale to higher total capacity while maintaining 3200 MT/s. Single rank x4 modules often preserve top speed with more DIMMs per channel compared with heavier dual-rank parts, letting administrators expand without a speed drop.
Latency-Sensitive vs. Throughput-Bound Workloads
Latency-sensitive services (e.g., trading gateways, real-time control) benefit from fewer, faster ranks across many channels, making 16GB single rank RDIMMs attractive. Throughput-bound analytics can also profit from higher rank counts for interleaving; however, with many channels populated by P11442-191, the aggregate bank parallelism remains substantial, maintaining a strong throughput profile.
Technical Glossary
ECC
Error-Correcting Code: A method for detecting and correcting single-bit memory errors and detecting certain multi-bit errors, critical for server reliability.
RDIMM
Registered DIMM: A buffered memory module that places a register (buffer) on the address/command lines to reduce load and improve scalability.
PC4-25600
Bandwidth rating signifying approximately 25.6 GB/s theoretical bandwidth for DDR4-3200 modules.
CAS Latency (CL)
The number of memory clock cycles between a read command and data availability; lower values mean fewer cycles, but higher clock speeds can offset higher CL numerically.
Environmental and Efficiency Advantages
Power Efficiency at 1.2V
Operating at the DDR4 standard voltage lowers per-DIMM power draw, allowing a higher memory footprint per system within the same power envelope. For large clusters, this translates into meaningful OPEX reductions without compromising performance.
Thermal Stability for Dense Racks
Predictable heat output simplifies cooling design. With adequate front-to-back airflow and proactive temperature monitoring, high-density nodes can maintain top speed bins even during sustained memory-intensive workloads.
Optimization Tips
Uniformity Across Channels
Keep module type, speed, and capacity identical per channel set. Uniform populations enable the memory controller to use optimal interleaving and maintain 3200 MT/s with minimal training retries during boot.
BIOS Tuning
- Enable node interleaving only when a single memory pool is desired; otherwise maintain NUMA locality.
- Activate ECC scrubbing at an interval appropriate to workload criticality.
- Keep memory frequency on “Auto” for best validated performance; manual down-clock only when thermal or population limits require.
Monitoring
Use iLO telemetry and OS tools to monitor correctable error counts, TSOD temperatures, and memory bandwidth utilization. Early visibility helps schedule maintenance before user-visible impact occurs.
Procurement and Fleet Standardization
Benefits of a Single Part Number
Standardizing on a single 16GB DDR4-3200 RDIMM SKU simplifies spares management, accelerates replacement workflows, and reduces risk during emergency maintenance. With consistent specifications—CL22, single rank x4, ECC registered—performance baselines remain stable across nodes and time.
Interoperability with Existing DDR4 Infrastructure
As long as the platform supports 3200-class RDIMM at 1.2V, integration is straightforward. In mixed environments, ensure that BIOS policies prevent speed regressions due to a small subset of slower DIMMs. Phased upgrades using P11442-191 modules can gradually lift cluster performance while keeping capital spending predictable.
Detailed Feature Breakdown
Data Path Integrity
The module’s x4 organization enhances fault isolation capability at the DRAM device level. With ECC and parity on control signals, the memory subsystem maintains integrity even under adverse environmental conditions.
Manufacturing Quality and Screening
Enterprise-class RDIMMs undergo tighter screening for signal integrity, thermal performance, and long-term reliability. This discipline ensures consistent frequency margins at 3200 MT/s, reducing the risk of intermittent timing fallout over years of service.
Serviceability
Tool-less latch mechanisms on HPE servers enable fast replacement. Clear labeling and slot maps reduce servicing time, and iLO logs help pinpoint the affected slot and module before physical access.
Planning Examples
Balanced 8-Channel Population
With 8 memory channels per CPU, deploying eight 16GB P11442-191 modules yields 128GB per socket while maintaining 3200 MT/s and uniform rank distribution. This configuration supports mid-sized virtualization clusters and medium OLTP instances.
Dual-Socket Symmetry
Mirroring the population on both sockets preserves NUMA balance: 256GB total with low cross-node latency. Memory-intensive containers can be pinned to the local node, improving cache locality and reducing scheduler overhead.
Gradual Expansion Path
Starting with four modules per CPU (64GB per socket) provides the baseline. Later, adding four more identical modules per CPU doubles capacity without changing speed or timing, avoiding disruptive requalification cycles.
Workload-Specific Notes
In-Memory Caches
Key-value stores like Redis or Memcached rely on low latency and consistent bandwidth. Uniform 3200 MT/s across all channels reduces request jitter, improving p99 and p999 latencies during traffic spikes.
CI/CD and Build Servers
Parallel compilers and container builds benefit from broad memory bandwidth. The P11442-191’s single rank design helps maintain full speed as channels fill, sustaining throughput for multi-core compile pipelines.
AI Inference Gateways
CPU-bound inference services and feature-store lookups profit from fast RDIMM bandwidth. ECC ensures model weights and feature vectors remain intact across long uptimes, minimizing silent degradation.
Cost and Efficiency Alignment
Cost-Per-GB Considerations
At the 16GB capacity point, RDIMMs typically align to favorable cost-per-GB curves while delivering top bin speeds. This balance makes it practical to standardize across fleets without over-provisioning.
Performance Density
Combining 3200 MT/s speed with single rank stability yields strong performance per watt and per RU (rack unit). For facilities optimizing for density, these characteristics translate to more application capacity in the same footprint.
Interoperability and Standards
JEDEC Compliance
JEDEC-aligned timings and speeds improve cross-platform predictability. When paired with HPE platform validation, JEDEC compliance reduces integration surprises and firmware rework.
SMBus and SPD
The DIMM’s SPD (Serial Presence Detect) stores timing profiles and operational parameters that system firmware reads during boot. Accurate SPD data enables proper training at 3200 MT/s and assists diagnostics when investigating interoperability issues.
Advanced Tuning Insights
Interleave Granularity
Fine-grained interleaving across channels distributes memory addresses to parallelize access, smoothing bandwidth and minimizing hot-spotting. For most enterprise applications, default interleaving balances well between locality and parallelism.
Huge Pages and Memory Allocators
Enabling huge pages can cut TLB misses and improve memory-bound compute efficiency. Combined with 3200 MT/s bandwidth, this setting benefits JVMs, databases, and HPC codes that repeatedly access large contiguous memory regions.
Virtualization Overcommit Policies
Avoid aggressive memory overcommit when targeting consistent latency. The throughput reserves provided by P11442-191 support steady performance, but ballooning and swapping can negate these gains. Right-size VM memory to the physical capacity provided by the RDIMM set.
Comparison Pointers
Versus Lower Speed DDR4
Compared to DDR4-2666 or DDR4-2933, DDR4-3200 offers improved bandwidth that can materially reduce wait states in memory-bound applications. In multi-tenant environments, higher bandwidth lowers contention and enhances quality of service.
Versus Consumer UDIMM
Unbuffered DIMMs lack ECC and registered buffering, limiting scalability and increasing error exposure under data center conditions. The P11442-191 RDIMM is purpose-built for enterprise reliability and multi-channel density.
Administrative Notes
Asset Management
Tag each module with rack, chassis, and slot metadata. Align procurement SKUs and warranty records to the P11442-191 identifier for streamlined RMA and lifecycle tracking.
Documentation Hygiene
Retain installation logs, firmware versions, and diagnostic outputs after each memory expansion event. Consistent documentation accelerates root-cause analysis should anomalies arise months later.
Operational Readiness Indicators
Validation Metrics
- Successful POST at DDR4-3200 CL22 with full population.
- Zero or negligible correctable ECC during burn-in.
- Stable TSOD readings within thermal envelope under stress.
- Application performance baselines matching capacity plans.
Long-Term Value
Consistency Across Generations
Standardizing on DDR4-3200 RDIMM like the HPE P11442-191 provides a reliable foundation through multiple OS and software revisions. Predictable behavior eases upgrades to newer CPU microarchitectures within the same memory generation.
Scalable Growth Path
16GB increments offer granular control over capacity planning, enabling cost-effective scaling while retaining top speed. With careful channel population and firmware stewardship, the memory subsystem remains a quiet, dependable backbone for enterprise services.
