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P11870-L21 HPE BL460c Gen10 Intel Xeon-Gold 6226 2.7GHz 12Core 125W Processor Kit.

P11870-L21
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Brief Overview of P11870-L21

HPE P11870-L21 BL460c Gen10 Intel Xeon-Gold 6226 2.7GHz 12Core 125W Processor Kit. New (System) Pull with 1 year replacement warranty

$878.85
$651.00
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SKU/MPNP11870-L21Availability✅ In StockProcessing TimeUsually ships same day ManufacturerHPE Manufacturer WarrantyNone Product/Item ConditionNew (System) Pull ServerOrbit Replacement Warranty1 Year Warranty
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Description

Product Overview of HPE P11870-L21 Processor Kit

The HPE P11870-L21 BL460c Gen10 Intel Xeon-Gold 6226 2.7GHz 12Core 125W Processor Kit is an advanced server-grade solution engineered for exceptional reliability, speed, and scalability. Designed to meet the growing demands of modern enterprise workloads, this processor kit ensures maximum performance in data-intensive environments. Built with Intel’s Xeon-Gold 6226 architecture, it enhances compute density and efficiency for cloud, virtualization, storage, and high-performance computing.

Main Specifications of HPE P11870-L21

  • Manufacturer: HPE
  • Part Number / SKU: P11870-L21
  • Product Type: Processor Kit
  • Subtype: BL460c Gen10 Intel Xeon-Gold 6226
  • Clock Speed: 2.7GHz
  • Cores: 12
  • Thermal Design Power (TDP): 125W

Key Highlights of Intel Xeon-Gold 6226 Processor

Integrated into the HPE BL460c Gen10 servers, the Intel Xeon-Gold 6226 provides balanced performance and advanced features. It is specifically designed for mid-range enterprise workloads, supporting both efficiency and scalability.

Core Features

  • 12 cores with 24 threads for superior parallel processing
  • Base frequency of 2.7GHz with turbo boost technology
  • Supports virtualization and multi-tenant environments
  • Enhanced memory bandwidth and latency reduction
  • Optimized for multi-socket server platforms

Advantages of Choosing HPE P11870-L21 Kit

By incorporating this processor kit into your HPE BL460c Gen10 servers, organizations benefit from enhanced reliability, higher performance per watt, and scalable architecture for future growth.

Performance Benefits

  • Boosts compute power for data-driven applications
  • Improved throughput for virtualized environments
  • Supports cloud and hybrid infrastructures
  • Delivers enterprise-grade workload efficiency

Energy and Thermal Efficiency

  • 125W power consumption optimized for balanced workloads
  • Advanced thermal management for consistent uptime
  • Energy-efficient design reduces operational costs

Compatibility with BL460c Gen10 Servers

The P11870-L21 processor kit is specifically designed for seamless integration with the HPE BL460c Gen10 blade servers, ensuring maximum compatibility and system stability.

Server Environment Optimization

  • Reliable fit for enterprise-class blade systems
  • Ensures consistent system performance
  • Optimized for mixed workload deployments
  • Supports large-scale datacenter infrastructures
Business Value Highlights
  • Future-proof technology for scalable infrastructure
  • Enhanced processing efficiency for mission-critical workloads
  • High reliability with reduced downtime risk
  • Optimized cost-to-performance ratio

HPE P11870-L21 BL460c Gen10 — Product category overview

The HPE P11870-L21 BL460c Gen10 Intel Xeon-Gold 6226 2.7GHz 12-Core 125W Processor Kit category focuses on high-density, enterprise-grade compute modules built for modern data center workloads. This category covers the processor kit used specifically with the HPE ProLiant BL460c Gen10 blade server chassis and emphasizes performance, reliability, and manageability. Engineers, IT managers, and procurement teams exploring this category should expect in-depth technical guidance, compatibility notes, and deployment pointers tailored to virtualization, database, analytics, HPC bursts, and cloud-native infrastructures.

Category scope and subcategories

Items in this category include CPU kits, compatible heatsinks, firmware bundles, and associated system ROM updates required to integrate the Intel Xeon-Gold 6226 CPU into BL460c Gen10 blades. Subcategories commonly found under this listing are:

  • Processor kits and upgrade modules for BL460c Gen10
  • HPE-supported cooling solutions and thermal interface materials
  • Firmware & BIOS update packages for Gen10 blades
  • Memory kits and validated DIMM configurations optimized for Xeon-Gold CPUs
  • Management and IO mezzanine cards compatible with Gen10 architecture

Technical characteristics of the Intel Xeon-Gold 6226 kit

The Intel Xeon-Gold 6226 processor that forms the core of the P11870-L21 kit is a 12-core, 24-thread CPU based on Intel’s scalable processor family. It provides a balance between core count, clock frequency, and thermal design power, making it suitable for mixed workloads. Key technical highlights include:

  • Base clock speed: approximately 2.7 GHz — responsive single-thread performance for latency-sensitive tasks.
  • Core count: 12 physical cores (24 logical threads via Hyper-Threading) — efficient parallel processing for multi-tenant and multi-process workloads.
  • TDP: 125 W — requires attention to chassis cooling and airflow planning in dense blade environments.
  • Cache hierarchy: multi-level caches supporting low memory latency and high instruction throughput.
  • Intel advanced features: built-in Turbo Boost, AES-NI, and virtualization extensions (VT-x/VT-d) for secure and accelerated workloads.

The P11870-L21 kit is optimized for the BL460c Gen10 platform delivering improved per-blade throughput without sacrificing reliability. Choosing this kit makes sense when:

  • You require a mid-to-high compute density per blade while preserving power efficiency across the enclosure.
  • Your workload mix includes virtualization, database processing, or web tier services that benefit from balanced single-thread and multi-thread performance.
  • Operational continuity demands firmware compatibility and HPE-validated component support to simplify lifecycle maintenance.

Integration with HPE system architecture

Integration into the BL460c Gen10 architecture is seamless when the processor kit is paired with properly validated memory kits, power and cooling policies, and firmware revisions. The BL460c Gen10 chassis leverages centralized power supplies and shared cooling infrastructure; thus, the 125 W TDP of the Xeon-Gold 6226 is provisioned and monitored by HPE iLO and system ROM for safe operation at scale.

Performance profiles and real-world use cases

The Xeon-Gold 6226 is often selected for environments that require a blend of throughput and responsiveness. Typical deployments include:

  • Virtualized servers: Host multiple VMs with balanced CPU and memory demands.
  • Database servers: Mid-sized OLTP or OLAP workloads where transactional latency and moderate concurrency matter.
  • Application servers: Java or .NET application tiers handling a mix of compute and I/O.
  • CI/CD and build nodes: Parallel compilation and test runners benefit from multiple cores and threads.
  • Edge compute nodes: Where space is limited and per-blade performance must be optimized.

Benchmark considerations

When assessing performance for procurement or capacity planning, benchmark comparison must include:

  • Single-thread and multi-thread metrics (SPEC CPU, application-level benchmarks).
  • Memory bandwidth and latency tests (important for database and in-memory caching layers).
  • VM density and consolidation ratios under target hypervisors (VMware ESXi, Microsoft Hyper-V, KVM).
  • Thermal throttling behavior under sustained loads to verify cooling sufficiency in a BL460c enclosure.

Optimizing for virtualization

To extract maximum VM density and predictable performance:

  • Match memory capacity per blade to expected VM footprints and leave headroom for ballooning.
  • Use HPE validated DIMM configurations to maintain memory interleaving and channel balance.
  • Enable processor features (NUMA-aware scheduling, large pages) in hypervisor settings.
  • Monitor iLO telemetry and configure power/thermal policies to avoid dynamic frequency throttling.

Compatibility, firmware, and validation

Compatibility is critical in blade environments. The P11870-L21 kit is supported by HPE on BL460c Gen10 with specific firmware stacks and system ROM versions. Successful integration normally requires:

  • System ROM and UEFI updates to the versions stated in HPE compatibility matrices.
  • Validated memory and IO mezzanine cards — check HPE QuickSpecs for recommended SKUs.
  • iLO management firmware updates for accurate power and thermal reporting.

Firmware and BIOS guidance

Before deploying the kit broadly, ensure the following actions:

  • Apply the latest HPE ProLiant Gen10 system ROM recommended for the BL460c family.
  • Update iLO and management agents so power capping and alerting operate correctly.
  • Validate thermal profiles by running the server with representative workloads in a test enclosure.

Common compatibility pitfalls

Avoid these frequent mistakes:

  • Installing the processor kit without verifying the BL460c blade's motherboard revision compatibility.
  • Ignoring the need for specific heatsink assemblies or airflow-directing shrouds recommended by HPE.
  • Mixing processor families in the same enclosure without confirming enclosure-wide firmware support.

Power, cooling, and data center planning

The 125 W TDP rating for the Intel Xeon-Gold 6226 requires explicit inclusion in rack- and chassis-level power and cooling models. Planning considerations:

  • Calculate peak and average power per blade and multiply by blade density per enclosure.
  • Factor in PSU efficiency, redundant power supplies, and power distribution losses.
  • Design for worst-case thermal output to prevent fan speed surges and noise spikes in adjacent racks.

Best practices for thermal management

Implement these measures to ensure consistent performance:

  • Install HPE-recommended heat sinks and airflow baffles in the blade enclosure.
  • Maintain hot/cold aisle separation and adequate return air paths in the rack design.
  • Monitor inlet and outlet temperatures with environmental sensors integrated with the DCIM platform.
  • Use iLO’s thermal monitoring and automated fan control where available to preempt overheating.

Power capping and performance tradeoffs

HPE platforms allow power capping per blade or enclosure; while useful for budgetary or capacity control, capping can reduce peak turbo frequencies and impact latency. For latency-sensitive tiers, prefer headroom over aggressive capping settings.

Security and manageability features

Security and manageability are central to enterprise deployments. The processor and kit support multiple hardware-enabled security features and integrate with HPE management tools:

  • Intel platform security features such as Trusted Execution and AES-NI for cryptographic acceleration.
  • HPE iLO for out-of-band management — remote firmware updates, power control, and remote console access.
  • Secure Boot and UEFI management to ensure trusted boot chains for virtualized and container workloads.

Manageability with HPE tools

Commonly used tools and integrations include:

  • HPE OneView — for infrastructure lifecycle automation, firmware baselines, and inventory.
  • HPE Insight Control — for OS-level management and deployment orchestration.
  • iLO RESTful API — for custom telemetry, scripting, and integration with monitoring systems.

Security hardening checklist

For production readiness, implement:

  • Firmware attestation and regular patch cycles for BIOS/iLO.
  • Role-based access control and MFA for management interfaces.
  • Encryption for data at rest and secure key management when using accelerated crypto instructions.

Upgrade paths and lifecycle management

When evaluating upgrades or life extension for BL460c Gen10 deployments, this processor kit is often part of a staged roadmap. Considerations:

  • Compatibility with newer Xeon families if a future upgrade is planned — confirm socket and firmware support.
  • Populating validated memory and storage to leverage additional I/O and caching capabilities.
  • Refreshing management software to handle larger inventories and lifecycle automation at scale.

When to upgrade versus when to replace

Upgrade scenarios:

  • Replacing older CPU kits to add cores or boost single-thread performance while retaining existing blades and mezzanine cards.
  • Incremental refresh where budget constraints favor CPU/memory upgrades over full chassis replacement.

Replacement scenarios:

  • When the platform needs PCIe Gen4/Gen5 I/O, newer integrated accelerators, or support for next-gen memory types that Gen10 does not provide.
  • When firmware or security requirements mandate a later generation with long-term vendor support.

Purchasing considerations and SKU details

When procuring the P11870-L21 kit or compatible parts, pay attention to:

  • Exact HPE part numbers and OEM packaging versus aftermarket equivalents.
  • Whether the purchase includes sled-level testing and HPE validation certs.
  • Warranty terms and whether parts are covered under existing HPE support contracts.

Evaluating third-party alternatives

If considering third-party or refurbished kits:

  • Confirm functional testing and return policies.
  • Validate firmware compatibility and ensure no locked or altered microcode that could affect cluster behavior.
  • Ensure physical and electrical compatibility with BL460c Gen10 board revisions.

Accessories, complementary products, and ecosystem

To create a complete blade solution, consider these complementary items:

  • HPE validated DDR4 memory kits tuned for Gen10 latency and throughput.
  • High performance NVMe or SAS storage blades for backend persistence.
  • Network mezzanine cards (Ethernet and InfiniBand) to match workload communication patterns.
  • Redundant power supplies and monitoring appliances to centralize health telemetry.

Recommended accessory checklist

For most deployments:

  • One spare P11870-L21 kit per X blades depending on MTTR targets.
  • Validated HPE heat sinks and airflow modules.
  • Firmware update bundles and offline update media for maintenance windows.

Third-party tool integration

Many customers tie HPE blade telemetry into third-party monitoring and orchestration platforms. Confirm API compatibility with iLO RESTful interfaces and OneView connectors to ensure seamless integration.

Migration strategies and workload mobility

When migrating workloads onto blades fitted with the Xeon-Gold 6226 kit, plan for:

  • NUMA topology-aware placement to reduce cross-socket memory penalties.
  • Testing of database indices and caches after migration to confirm latency SLAs.
  • Live migration readiness—ensure hypervisor and iLO versions support the necessary features and that network storage performance is sufficient for VM movement.

Cold vs hot migration considerations

Cold migrations are straightforward but require downtime, whereas hot migrations demand:

  • Robust network throughput and storage IO to avoid VM freeze points.
  • Compatibility of CPU feature flags between source and destination hosts.

Scaling patterns

Blade scaling with this kit is typically horizontal at the enclosure level: add more BL460c blades with identical kits to preserve uniform performance characteristics across clusters. For vertical scaling, consider faster CPU SKUs or an architecture refresh.

Features
Manufacturer Warranty:
None
Product/Item Condition:
New (System) Pull
ServerOrbit Replacement Warranty:
1 Year Warranty