P73446-H21 HPE 256GB DDR5-6400MT/s PC5-51200 Cl60 Memory.
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HPE P73446-H21 256GB DDR5 Smart Memory – High-Performance Server RAM
Key Features & Specifications
- Advanced Memory Technology: Built with cutting-edge DDR5 SDRAM for superior speed and efficiency.
- Massive Storage Capacity: A single 256GB module delivers high-density performance for demanding workloads.
- Blazing-Fast Data Transfer: Operates at 6400MT/s (PC5-51200) for rapid processing and reduced latency.
- Enhanced Reliability: Features Error-Correcting Code (ECC) for improved data integrity.
Technical Specifications
Performance & Speed
- Module Configuration: Quad Rank X4 design optimizes data handling.
- High Bandwidth Support: DDR5-6400/PC5-51200 ensures smooth multitasking.
- Low Latency: CL60 timing enhances responsiveness in critical applications.
Power & Efficiency
- Energy-Efficient Operation: Runs at just 1.1V, reducing power consumption.
- Registered Signal Processing: 3DS Registered design stabilizes data signals.
Compatibility & Design
Form Factor & Integration
- Standard 288-Pin Layout: Ensures seamless compatibility with enterprise servers.
- HPE Smart Memory: Optimized for HPE systems for peak performance.
Manufacturing & Support
- Trusted Brand: Manufactured by Hewlett Packard Enterprise (HPE).
- Part Number: P73446-H21 for easy identification and replacement.
HPE P73446-H21 256GB DDR5-6400MT/s PC5-51200 CL60 Memory Overview
The HPE P73446-H21 is a high-capacity, high-performance memory module designed for modern enterprise and data center environments. This 256GB DDR5 memory stick delivers an impressive 6400MT/s speed, classified under the PC5-51200 standard with a CAS latency of CL60. Ideal for server applications requiring immense bandwidth and energy efficiency, this memory module is part of Hewlett Packard Enterprise’s (HPE) next-generation server memory portfolio. With enhanced data transfer rates and improved power efficiency, it sets a new benchmark for professional-grade memory solutions.
Compatible Systems and Server Applications
HPE P73446-H21 is engineered specifically for compatibility with HPE ProLiant Gen11 servers and other HPE platforms that support DDR5 memory. It plays a critical role in workload optimization for demanding enterprise applications such as:
- Virtualization and virtual machine hosting
- High-performance computing (HPC)
- In-memory databases like SAP HANA
- AI/ML model training and inference workloads
- Big data analytics and real-time data processing
- Enterprise resource planning (ERP) systems
Certified Compatibility with HPE Platforms
Only HPE-certified memory modules, like the P73446-H21, ensure seamless performance, maximum uptime, and full integration with HPE Insight Diagnostics, Integrated Lights-Out (iLO), and HPE Systems Insight Manager. Compatibility with HPE BIOS and server firmware prevents system instability and supports predictive failure alerts.
Key Benefits of DDR5 Technology
As a DDR5 memory module, the HPE P73446-H21 offers substantial improvements over DDR4 technologies in the following areas:
Faster Data Speeds
With a maximum speed of 6400MT/s, DDR5 delivers significantly higher data throughput, allowing server CPUs to access more data at faster rates—ideal for memory-bound applications.
Improved Power Efficiency
DDR5 modules operate at lower voltages compared to DDR4. This reduces overall power consumption and heat output, making them better suited for scalable server environments.
Greater Module Density
DDR5 supports higher capacity per DIMM slot—up to 256GB or more—allowing servers to handle more RAM using fewer DIMM slots, which is critical for dense computing infrastructures.
Enhanced Reliability and Data Integrity
Features such as on-die ECC and additional chip-level fault correction improve reliability and minimize the risk of data corruption in mission-critical environments.
Use Cases for High-Density Memory Modules
The 256GB HPE P73446-H21 is perfect for the following server and data center use cases:
Virtualized Workloads
Servers running hypervisors like VMware ESXi or Microsoft Hyper-V benefit significantly from high-density RAM modules. They enable more virtual machines to run concurrently without memory bottlenecks.
Data-Intensive Applications
Big data platforms such as Hadoop, Apache Spark, and NoSQL databases rely on large in-memory datasets to optimize performance. This module provides the memory footprint required for complex data analytics operations.
Cloud Computing
Public and private cloud providers use such high-capacity modules to maximize compute density and support multitenant workloads efficiently and securely.
AI and Machine Learning
AI training requires fast memory access and massive amounts of data. This DDR5 module's high speed and capacity make it suitable for GPUs and CPUs handling AI workloads.
Reliability and Security Standards
The HPE P73446-H21 conforms to enterprise-grade reliability standards. As a registered DIMM with ECC (Error-Correcting Code), it ensures maximum system uptime and data integrity. The new sealed-in-box (NIB) condition guarantees untouched, manufacturer-sealed packaging with zero prior usage, ideal for critical infrastructure deployments.
Advanced ECC Capabilities
This module includes advanced ECC functions beyond standard parity error detection. It supports real-time data correction, chipkill technology, and HPE-specific diagnostics for proactive failure analysis.
Trusted Supply Chain
HPE’s secure supply chain and serialization ensure each P73446-H21 DIMM is authentic, traceable, and tamper-proof—ensuring compliance with cybersecurity and procurement regulations.
Packaging, Handling, and Installation
All HPE P73446-H21 memory modules are shipped in original HPE packaging, sealed and static-shielded. Proper handling is crucial during installation. IT staff should use ESD-protective equipment and follow server documentation to ensure correct slot population and BIOS configuration.
Advantages of HPE Memory over Generic Brands
- Guaranteed BIOS-level integration and firmware compatibility
- Access to firmware updates and technical support from HPE
- Lifetime technical support and limited warranty
- Certified to operate at advertised speeds without overclocking
- Enhanced heat management with tested heatsinks and thermal profiles
Energy Efficiency and Sustainability
HPE’s DDR5 modules are designed with sustainability in mind. Operating at reduced voltages and higher efficiency levels contributes to lower total cost of ownership (TCO) and supports corporate green initiatives.
Lower Cooling Requirements
The power efficiency of DDR5 reduces the heat output per server, allowing for less aggressive cooling and more effective airflow in dense rack environments. This translates into reduced HVAC demands in data centers.
Extended Server Lifespan
By running cooler and more efficiently, DDR5 modules contribute to overall server health and longevity, reducing the need for premature hardware replacements and lowering electronic waste (e-waste).
Inventory, Availability, and Fulfillment
This category page includes inventory listings of brand new, factory-sealed HPE P73446-H21 memory modules. Availability may vary based on global supply chain conditions, so orders should be placed promptly for time-sensitive projects. All products are warehoused in climate-controlled facilities and are available for same-day or next-day shipping based on stock location.
New Sealed in Box (NIB) Condition
All memory modules listed in this category are guaranteed NIB (New in Box). Each module is shipped in tamper-evident, static-safe packaging with unbroken factory seals. This condition ensures product authenticity, freshness, and zero operational hours prior to customer installation.
HPE Server Memory Ecosystem
The P73446-H21 is just one of many high-capacity memory modules in HPE’s extensive DDR5 lineup. HPE offers DDR5 modules in capacities ranging from 32GB to 512GB, making it easy to scale server memory to meet workload demands. This ecosystem supports:
- Mixed DIMM configurations across multi-socket systems
- Automatic memory profile optimization
- Adaptive error monitoring across nodes
- Enhanced cooling mechanisms for high-TDP modules
