HMCG84AHBRA477N Hynix 32GB PC5-51200 DDR5-6400MTs 1Rx4 ECC Memory
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Discover the Hynix HMCG84AHBRA477N: a high-performance 32GB DDR5 memory module designed for servers and workstations. This single-stick RDIMM (1x32GB) operates at 6400 MT/s (PC5-51200), features ECC for data integrity, and uses a 288-pin form factor with a low 1.2V operating voltage.
Module Identification
- Manufacturer: SK hynix
- Part Number: HMCG84AHBRA477N
- Model Name: 32GB DDR5 SDRAM Memory Module
Core Specifications
- Capacity: 32GB (single module — 1 x 32GB)
- Memory Type: DDR5 SDRAM (next-gen volatile memory)
- Speed / Throughput: 6400 MT/s (DDR5-6400 / PC5-51200)
- Form Factor: 288-pin RDIMM (Registered DIMM)
- Voltage: 1.2V
- Error Checking: ECC (Error-Correcting Code)
- Rank & Organization: 1Rx4 — Dual Rank, Registered
- CAS Latency: CL42
Performance Highlights
- High frequency (6400 MT/s) for fast memory throughput and reduced bottlenecks.
- ECC support prevents silent data corruption — crucial for enterprise reliability.
- Registered buffering enhances signal integrity in multi-DIMM configurations.
- CL42 timing tuned for DDR5-6400 workload balance between latency and bandwidth.
Key Benefits & Use Cases
- Enhanced stability for mission-critical servers and enterprise systems.
- Improved multitasking and database performance with high-speed DDR5 bandwidth.
- Ideal for virtualization, cloud hosts, and compute-intensive applications.
- Lower power draw thanks to efficient 1.2V operation — better thermals and energy savings.
Compatibility
- Designed for systems that explicitly support DDR5 RDIMM modules and ECC functionality.
- Confirm motherboard/BIOS compatibility with SK Hynix RDIMM and 6400 MT/s profiles before installation.
- Optimal for server platforms and enterprise motherboards — not compatible with standard notebook or desktop SO-DIMM slots.
Technical Breakdown
Memory Architecture
- Ranks: Dual Rank (1Rx4) — provides more addressable banks for heavier workloads.
- Organization: x4 data width per chip — common in server memory modules.
- Registered ECC: On-module register reduces electrical load on the memory controller, allowing larger memory capacities.
Electrical & Timing Details
- Operating Voltage: 1.2V — standard for DDR5 power efficiency.
- CAS Latency (CL): 42 — latency metric at DDR5-6400 speed grade.
- Throughput: PC5-51200 theoretical bandwidth per module.
Hynix HMCG84AHBRA477N 32GB DDR5 RDIMM
The Hynix HMCG84AHBRA477N represents the pinnacle of DDR5 server memory technology, engineered specifically for demanding data center, workstation, and enterprise computing environments. This 32GB module isn't just memory; it's a critical infrastructure component designed to deliver unparalleled reliability, performance, and data integrity where system uptime and accuracy are non-negotiable.
Understanding the Core Specifications
At its heart, this module operates at a swift 6400 MT/s (MegaTransfers per second), formally classified under the PC5-51200 standard. This translates to a peak theoretical bandwidth of 51.2 GB/s per module, a significant leap over previous DDR4 generations. Operating at a low 1.2V, it achieves this high performance with improved power efficiency, a crucial factor in densely populated servers where power and thermal budgets are constrained.
Decoding the Part Number: HMCG84AHBRA477N
Hynix's part numbering system reveals key attributes of the module. Breaking it down: HMC identifies it as a Hynix Memory Module. G84 often relates to the specific component and technology generation (DDR5). AH can indicate a registered DIMM (RDIMM). BRA typically specifies the density, organization, and speed bin. 477N often refers to the specific revision and timing profile. Understanding this nomenclature helps IT professionals quickly identify compatibility and key features.
The DDR5 Revolution: Key Advancements Over DDR4
DDR5 memory architecture is not merely an incremental speed boost; it's a fundamental redesign that addresses the bottlenecks of its predecessor, DDR4.
Architectural Superiority
DDR5 introduces a paradigm shift with its decision to move the voltage regulator from the motherboard directly onto the memory module itself. This On-Module PMIC (Power Management Integrated Circuit) allows for more granular and efficient power delivery, reducing noise and improving signal integrity, which is essential for achieving and maintaining high data rates like 6400 MT/s.
Burst Length and Bank Group Doubling
While DDR4 operated with a Burst Length of 8, DDR5 doubles this to 16 (BL16). This means that for every column access command, 64 bytes of data are transferred—a perfect match for modern CPU cache line sizes. Furthermore, DDR5 doubles the number of bank groups compared to DDR4. This architectural enhancement allows for a greater number of concurrent operations, drastically reducing latency by minimizing conflicts and keeping the data bus saturated.
Higher Densities and Scalability
DDR5 is architected from the ground up to support much higher module densities. The Hynix 32GB module is a testament to this, utilizing advanced semiconductor processes to pack more memory cells into a compact form factor. This scalability is vital for modern servers that may need to support terabytes of RAM in a single system, enabling larger in-memory databases and more extensive virtualized environments.
ECC and Registered Architecture
For any mission-critical application, raw speed is meaningless without unwavering reliability. The Hynix HMCG84AHBRA477N incorporates two foundational technologies to ensure this: Error Correcting Code (ECC) and a Registered (Buffered) design.
Error Correcting Code (ECC): Your Data's Guardian
ECC is a non-negotiable feature for servers and workstations. It works by adding extra bits (check bits) to the data stored in memory. When data is read, the memory controller recalculates these check bits and compares them to the stored values.
How ECC Corrects Errors
Single-bit errors, which are the most common type of memory error caused by cosmic rays, electrical interference, or minor cell degradation, are detected and corrected instantly and transparently without any operating system or application involvement. This prevents silent data corruption, a scenario where corrupted data is processed and leads to incorrect results, crashed applications, or corrupted databases, all without any obvious warning. Multi-bit errors, while rarer, are detected and reported to the system, which can then trigger an alert for preventative maintenance.
The Critical Importance of ECC in Enterprise
In financial trading, a single flipped bit could represent a million-dollar error. In scientific computing, it could invalidate weeks of simulation. In database servers, it could corrupt customer records. ECC is the first and most critical line of defense against these catastrophic scenarios, making the Hynix HMCG84AHBRA477N an essential component for data integrity.
Registered DIMMs (RDIMMs): Stabilizing Large Memory Configurations
As memory speeds increase and densities grow, the electrical load placed on the memory controller becomes immense. An unbuffered DIMM (UDIMM) presents a direct electrical connection, which limits the number of modules that can be reliably installed on a single channel, especially at high speeds.
The Role of the Register
An RDIMM, like this Hynix module, incorporates a register (or buffer) between the memory controller and the DRAM chips. This register handles all command and address signals, presenting a single, stable electrical load to the memory controller regardless of how many DRAM chips are on the module.
Benefits of the RDIMM Design
This architecture provides two major benefits: 1. Superior Signal Integrity: By buffering the signals, RDIMMs can achieve higher operating frequencies and support more modules per channel without signal degradation. This is why the 6400 MT/s speed is achievable in multi-DIMM server configurations. 2. Increased Maximum Capacity: Servers can support a much larger total memory capacity with RDIMMs, as the memory controller is no longer the limiting factor. This makes 32GB modules ideal for populating systems with 512GB, 1TB, or even more memory.
The trade-off is a slight increase in latency (typically one clock cycle) due to the buffering process, but this is overwhelmingly offset by the gains in stability, capacity, and overall system performance in a server context.
x4 Device Organization
The "x4" refers to the data width of the individual DRAM chips used on the module. Each chip has a 4-bit wide data interface. To form a 64-bit data bus, the module uses 16 chips (16 chips * 4 bits = 64 bits). An additional 4 chips (4 chips * 4 bits = 16 bits) are used for the ECC, making a total of 20 chips for the full 72-bit width. x4 organization is preferred in servers as it provides stronger Chipkill or SDDC (Single Device Data Correction) capabilities, a more advanced form of error correction that can survive the complete failure of a single DRAM chip.
Form Factor: The 288-Pin RDIMM
The physical interface for DDR5 is a 288-pin edge connector. It is mechanically keyed differently from DDR4's 288-pin design to prevent accidental insertion into an incompatible motherboard. The RDIMM form factor is standardized to ensure interoperability with server platforms from major OEMs like Dell, HPE, Cisco, and Supermicro, as well as motherboard manufacturers like Asus, Gigabyte, and ASRock for their server/workstation lines.
Target Applications and Ideal Use Cases
The combination of high bandwidth, large capacity, and robust reliability makes the Hynix HMCG84AHBRA477N suitable for a wide array of demanding computational tasks.
Data Center and Cloud Infrastructure
In virtualized environments and cloud platforms, memory is a shared resource. High-density, high-speed RDIMMs allow for greater virtual machine density and improved performance for each VM. This is crucial for Infrastructure-as-a-Service (IaaS) providers and large-scale private cloud deployments.
In-Memory Databases (IMDB)
Systems like SAP HANA, Oracle TimesTen, and Redis thrive on fast, abundant memory. Storing the entire database in RAM eliminates disk I/O bottlenecks, enabling real-time analytics and transaction processing. The 32GB capacity and 6400 MT/s speed of this Hynix module directly contribute to faster query times and higher transaction throughput.
High-Performance Computing (HPC) and Scientific Simulation
CFD (Computational Fluid Dynamics), finite element analysis, weather modeling, and genomic sequencing workloads involve manipulating massive datasets in RAM. The bandwidth provided by DDR5-6400 accelerates the movement of data to and from the CPU cores, significantly reducing computation time and enabling more complex models to be solved.
Professional Content Creation and Rendering
Workstations used for 4K/8K video editing, 3D animation, and CAD/CAM design require large memory capacities to hold complex scenes, high-resolution textures, and lengthy timelines. The ECC feature ensures that a single memory error doesn't crash a render that has been running for days, protecting valuable creative work and deadlines.
Machine Learning Data Preprocessing
While GPUs handle the core model training, the CPU and system memory are critical for data preprocessing, transformation, and feeding the data pipelines at high speed. Faster memory like the Hynix DDR5-6400 module helps prevent the CPU from becoming a bottleneck, keeping the GPUs fully utilized and accelerating the overall AI workflow.
