HMCG88MEBRA111N Hynix 32GB 2RX8 PC5-38400 4800MT/s ECC DDR5 Memory.

Highlights of Hynix HMCG88MEBRA111N 32GB DDR5 RDIMM Ram

The Hynix HMCG88MEBRA111N is a high-performance 32GB DDR5 4800MT/s ECC Registered memory module, engineered for modern enterprise servers. It delivers exceptional speed, stability, and reliability, ensuring smooth operations for data-intensive applications. The module's advanced internal management enables improved reliability and data integrity, especially important for servers running high-density virtual machines and large-scale databases.

General Information

• Manufacturer: Sk Hynix
• Part Number: HMCG88MEBRA111N
• Product Category: Server Memory Module
• Sub Type: DDR5 4800MT/s RDIMM

Technical Specifications

• Module Capacity: 32GB
• Memory Type: DDR5 SDRAM
• Number of Modules: 1 x 32GB
• Operating Speed: 4800MT/s (PC5-38400)
• Error Checking: ECC (Error-Correcting Code)
• Signal Processing: Registered (RDIMM)
• Rank: Dual Rank (2Rx8)
• CAS Latency: CL40
• Form Factor: 288-Pin RDIMM
• Voltage: Standard 1.1V DDR5

Shipping Information

• Package Dimensions: 1.00" (Height) × 6.75" (Depth)
• Weight: 0.20 lb

Compatibility

Compatible Dell PowerEdge Servers

• PowerEdge R650
• PowerEdge R650xs
• PowerEdge R750
• PowerEdge R750xa
• PowerEdge R750xd2
• PowerEdge R760
• PowerEdge R760xs
• PowerEdge R760xa
• PowerEdge R760xd2
• PowerEdge R770
• PowerEdge T550
• PowerEdge C6620
• PowerEdge HS5610
• PowerEdge HS5620
• PowerEdge MX760c

Overview of Hynix HMCG88MEBRA111N 32GB DDR5 4800MT/s

The Hynix HMCG88MEBRA111N 32GB DDR5 4800MT/s PC5-38400 2Rx8 RDIMM ECC memory module is engineered to deliver advanced performance for next-generation server infrastructures. As organizations demand higher throughput, lower latency, and robust reliability in high-density environments, DDR5 memory offers a substantial leap over DDR4. This memory module provides enterprise-grade features, including ECC error correction, dual-rank architecture, and advanced power management, making it an ideal choice for servers running virtualization, cloud services, artificial intelligence, data analytics, and mission-critical workloads.

DDR5 Architecture and Performance Enhancements

DDR5 memory architecture introduces numerous improvements over DDR4, including higher transfer rates, enhanced channel structure, and improved energy efficiency. The Hynix HMCG88MEBRA111N operates at 4800MT/s, providing faster data movement between the CPU and memory, which is crucial for high-demand enterprise applications. DDR5 modules feature a dual-channel DIMM design, effectively doubling the number of channels per module, allowing for more simultaneous memory operations, reduced latency, and optimized performance under heavy workloads.

Dual-Channel DIMM Configuration

The 2Rx8 dual-rank configuration divides the memory into two independent ranks, enabling simultaneous access and reducing wait times for memory requests. This improves overall throughput and allows servers to handle parallel processing efficiently. Each rank operates as a separate memory array, providing additional bandwidth and reducing bottlenecks in high-core-count CPU architectures. Applications such as high-performance computing, AI training, and large-scale simulations benefit from the reduced latency and improved concurrency offered by dual-rank memory modules like the HMCG88MEBRA111N.

Memory Density and Scalability

With 32GB per module, this Hynix RDIMM provides high-density memory that supports large server deployments without consuming excessive DIMM slots. DDR5's increased memory cell density allows more data to be stored and accessed efficiently, making it suitable for data-intensive tasks. Enterprises can scale their server memory across multiple sockets, achieving terabyte-level memory capacity while maintaining high data throughput and low access latency. The module's design is particularly beneficial for multi-tenant cloud environments, virtualized infrastructures, and high-performance workloads that demand consistent memory availability.

ECC Error Correction for Data Reliability

ECC (Error-Correcting Code) functionality is a critical feature of the HMCG88MEBRA111N module. ECC memory detects and corrects single-bit errors and can identify multi-bit errors, preventing data corruption and maintaining system stability. In server environments, where data integrity is essential, ECC ensures that mission-critical applications run without interruption, reducing the risk of system crashes, data loss, and service downtime. The combination of ECC at the module level and on-die ECC within DDR5 chips provides comprehensive protection against internal and external memory errors.

On-Die ECC Technology

DDR5 modules integrate on-die ECC within each DRAM chip, allowing internal error correction to occur without CPU intervention. This reduces the chance of silent data corruption and enhances overall reliability. The HMCG88MEBRA111N leverages this on-die ECC feature to ensure continuous, error-free operation, making it suitable for environments with demanding workloads and long operational hours, such as financial systems, cloud computing platforms, and scientific research clusters.

Module-Level ECC for Enterprise Servers

In addition to on-die ECC, the module implements ECC across the entire DIMM, providing an additional layer of error correction. This feature is critical for servers running enterprise applications where uptime and data consistency are non-negotiable. By correcting errors before they propagate to the CPU or storage, ECC memory enhances system reliability, reduces maintenance requirements, and ensures the integrity of mission-critical operations.

2Rx8 Dual-Rank Configuration Server Performance

The 2Rx8 dual-rank architecture of the HMCG88MEBRA111N provides several advantages for high-performance servers. Multi-rank modules support memory interleaving, which improves throughput by alternating memory accesses between ranks. This design minimizes access conflicts, reduces latency, and increases overall system efficiency, particularly in workloads that require frequent and simultaneous memory access, such as virtualization and AI inference.

Interleaving and Parallel Access

Memory interleaving allows multiple ranks to be accessed alternately, reducing idle cycles and enhancing data transfer efficiency. Dual-rank modules like the HMCG88MEBRA111N are particularly effective in multi-core and multi-threaded environments, where multiple processes compete for memory resources. By distributing memory operations across ranks, the module helps maintain consistent performance, even under peak loads.

Signal Integrity and Stability

The dual-rank design also contributes to improved signal integrity, ensuring reliable data transmission between the memory module and the CPU. In servers with high DIMM counts and multi-socket configurations, maintaining clean signal pathways is essential to prevent data errors and performance degradation. The HMCG88MEBRA111N is engineered to provide stable electrical characteristics, reducing the likelihood of data corruption and supporting long-term operational stability.

High-Density Server Architectures

With its dual-rank configuration and 32GB capacity, this memory module supports high-density server architectures. Enterprises can populate multiple DIMM slots without compromising signal quality or performance, enabling larger memory pools for demanding applications. This makes the module ideal for hyper-converged infrastructures, large-scale virtualization, and AI-driven computing environments.

Operating Voltage

Operating at 1.1V instead of the 1.2V typical of DDR4, the HMCG88MEBRA111N offers significant energy savings across large-scale data centers. When deployed in servers with multiple DIMMs, the cumulative power reduction translates into lower electricity costs and reduced cooling requirements. This energy efficiency is increasingly important for organizations seeking to meet sustainability goals and lower total cost of ownership.

Onboard PMIC for Regulation

The inclusion of a PMIC on the memory module allows the DIMM to manage its own power regulation, reducing stress on the motherboard and improving stability. This feature ensures consistent voltage delivery under variable loads, enhancing reliability during prolonged operation and high-memory-demand scenarios. The combination of low voltage and PMIC regulation makes the HMCG88MEBRA111N suitable for dense server deployments where power efficiency and thermal control are critical.

Modern Server Platforms

The HMCG88MEBRA111N 32GB DDR5 RDIMM is fully compatible with next-generation server platforms from leading manufacturers. It supports multi-core and multi-socket CPUs, ensuring that memory bandwidth scales with processor capabilities. This makes it an ideal choice for servers designed for virtualization, cloud computing, AI workloads, and high-performance data analytics. Enterprises can deploy these modules in large quantities without compatibility issues, supporting scalable and future-proof memory configurations.

Multi-Core Processors

Modern server CPUs feature dozens of cores, making memory bandwidth a critical factor in overall system performance. The HMCG88MEBRA111N provides high-speed access to data, ensuring that each core receives sufficient memory bandwidth to operate efficiently. This reduces bottlenecks and enhances performance for applications that require simultaneous access to large datasets.

Cloud Readiness

Virtualized environments require substantial memory resources to support multiple virtual machines and containers. The Hynix HMCG88MEBRA111N module supports high-density virtualization by providing large memory capacity and fast access speeds, enabling higher VM density per host. This makes it ideal for cloud service providers, enterprise private clouds, and containerized infrastructure, ensuring responsive and reliable performance across multiple tenants and applications.

Reduced Latency for Scalable Applications

Low-latency memory access is crucial for cloud-native applications, databases, and high-frequency trading systems. The 4800MT/s data rate of this module reduces response times, enabling applications to process transactions and queries faster. This improved responsiveness translates into better user experiences and more efficient resource utilization in large-scale computing environments.

Increased Burst Length for Faster Data Access

DDR5 increases burst length from 8 to 16, allowing the memory module to transfer twice as much data per operation. The HMCG88MEBRA111N leverages this feature to improve the efficiency of data-intensive tasks, reducing processing cycles and improving throughput. Applications that require frequent memory accesses benefit from faster data movement, resulting in more efficient execution of complex workloads.

Accelerated Workload Execution

High-speed memory access allows servers to execute compute-intensive tasks more efficiently. Workloads such as real-time analytics, AI model training, scientific simulations, and enterprise business intelligence applications experience measurable performance improvements when paired with DDR5 modules like the HMCG88MEBRA111N. Faster data access reduces processing bottlenecks, enabling shorter execution times and higher overall productivity.

Reliability and Longevity for Continuous Operations

Servers in enterprise environments often operate 24/7, making memory reliability and longevity critical. The Hynix HMCG88MEBRA111N is designed for continuous operation, with robust ECC capabilities, dual-rank architecture, and efficient thermal management. These features ensure consistent performance over extended periods, reducing the likelihood of memory-related failures and minimizing maintenance requirements.

Extended Workloads

Efficient heat dissipation and low voltage operation contribute to thermal stability, allowing the memory module to operate safely under prolonged heavy workloads. Servers hosting high-density virtual machines, AI workloads, and real-time analytics benefit from consistent performance and reduced risk of thermal-related errors. The module's thermal stability supports long-term reliability in mission-critical environments.

Failure Rates

The combination of ECC, dual-rank configuration, and DDR5 internal error correction reduces the likelihood of memory failures. This results in lower maintenance costs, fewer system interruptions, and increased uptime for critical applications. Organizations deploying these modules experience improved business continuity and operational efficiency, ensuring that infrastructure investments deliver maximum value.

Scalability and Future-Proofing

With its 32GB capacity, dual-rank design, and high-speed DDR5 performance, the HMCG88MEBRA111N module supports scalable server deployments. Enterprises can populate multiple DIMM slots to achieve terabyte-scale memory configurations, enabling support for growing workloads and future applications. The module's design ensures compatibility with next-generation server platforms, providing a future-proof memory solution for high-performance computing, cloud services, virtualization, and AI-driven environments.

High-Density Memory Configurations

By supporting large memory arrays, the Hynix module allows enterprises to build high-density server nodes capable of handling extensive datasets. This is essential for big data analytics, in-memory databases, and memory-intensive workloads, ensuring that servers maintain optimal performance even as memory demands increase.