HMCGM4MGBRB241N Hynix 96GB DDR5 5600mt/s Pc5-44800 Cl46 Ecc Registered 1.1v Dual Rank 288-pin Dimm Server RAM Module

Overview of the HYNIX 96GB DDR5 Server Memory

The HYNIX HMCGM4MGBRB241N is a high-performance DDR5 ECC Registered memory module engineered to meet the demands of enterprise servers, data centers, and mission-critical applications. Offering advanced reliability, power efficiency, and rapid data throughput, it ensures optimal functionality in modern server environments.

General Specifications

• Brand: HYNIX 
• Part Number: HMCGM4MGBRB241N
• Product Category: DDR5 ECC Registered Server Memory

Technical specifications

• Capacity: 96 GB
• Memory Type: DDR5 SDRAM, ECC Registered (RDIMM)
• Speed/Standard: DDR5-5600 (PC5-44800) — 5600 MT/s.
• CAS Latency: CL46
• Rank Configuration: Dual-Rank, 2Rx4
• Voltage: 1.10 V
• Form Factor / Pins: 288-pin DIMM (server RDIMM)
• Error Checking: ECC (on-module parity and system ECC support)

Form Factor & Layout

• Type: DIMM Module
• Connector: 288-pin layout for server compatibility
• Designed for enterprise-grade motherboards

Reliable Data Processing

With ECC technology, this server memory module reduces downtime and prevents data corruption, making it ideal for critical infrastructures where precision and stability are essential.

Boosted Performance in Demanding Workloads

Engineered with 5600 MT/s transfer speed and CL46 latency, this DIMM ensures quick response times and improved multitasking for cloud computing, virtualization, and database servers.

Power Efficiency for Data Centers

Operating at just 1.10V, the HYNIX HMCGM4MGBRB241N minimizes energy consumption, helping organizations reduce operational costs while maintaining top-tier performance.

Hynix HMCGM4MGBRB241N product family

The Hynix HMCGM4MGBRB241N is a high-capacity server memory module in the DDR5 RDIMM category engineered for modern data center, cloud, virtualization and HPC environments. Marketed as a 96GB DDR5 Registered DIMM (RDIMM), this module belongs to the PC5-44800 performance tier and is optimized for 5600 MT/s operation, offering a balance of bandwidth, capacity and power efficiency that server and enterprise buyers require. Key technical attributes for this SKU include ECC (Error-Correcting Code) support, registered/buffered signaling for increased stability in multi-module server configurations, a dual-rank layout (2Rx4) and a low operating voltage of 1.1V — enabling dense memory pools without excessive power draw. 

These specs are representative of Hynix's 96GB DDR5 lineup and are corroborated by multiple major memory resellers and marketplace listings for the HMCGM4MGBRB241N family.

Performance characteristics and architecture

Bandwidth and throughput

Operating at DDR5-5600 (PC5-44800), the Hynix 96GB module supplies a theoretical peak bandwidth in line with the PC5-44800 class. In multi-socket and multi-channel server configurations this translates to notably higher sustained throughput versus DDR4 modules, especially in memory-heavy workloads such as in-memory databases, large-scale virtualization, analytics pipelines and AI inference where memory throughput matters as much as raw CPU cycles.

CAS latency and memory timings

With a CAS latency of CL46, the module sits within expected timing ranges for high-frequency DDR5 server devices. DDR5's architecture and internal improvements — including per-module power management and improved refresh schemes — make absolute timing comparisons versus DDR4 nuanced; the higher transfer rates typically offset the larger cycle counts so latency-sensitive applications still see net gains when paired with CPUs and platforms designed for DDR5. When optimizing for latency-sensitive workloads, system integrators should test real-world performance because effective latency depends on CPU memory controller, channel configuration and interleaving.

Dual-rank (2Rx4) topology advantages

The 2Rx4 (dual-rank, x4 device configuration) layout enables each module to present more ranks to the memory controller, which in many server platforms can increase parallelism and effective throughput under heavy multi-threaded load. Dual-rank modules are a common choice for dense servers because they provide a good tradeoff between maximum single-module capacity and achievable memory channel utilization. Note that some platforms may have subtle differences in how they populate slots for optimal performance when using 2Rx4 modules; consult the server vendor’s memory population guide.

Compatibility

The Hynix HMCGM4MGBRB241N is designed for DDR5-capable server platforms that accept 288-pin RDIMM modules and support ECC Registered memory. Typical targets include second- and later-generation server CPUs and platforms from major vendors (Intel Xeon Scalable generations that add DDR5 support, AMD EPYC families that explicitly support DDR5 RDIMM/ LRDIMM configurations, and compatible OEM servers from Dell, HPE, Lenovo, Supermicro, Inspur, and others). Because memory signalling and ECC/registered behavior is platform-sensitive, always cross-check your server vendor’s validated memory lists or QVL (Qualified Vendor List) to confirm full compatibility and supported speeds.

Mixing memory types and population rules

The safest practice is to populate a server with identical modules (same part number, speed, voltage, rank and timing). Mixing RDIMMs with LRDIMMs or mixing different densities and ranks can cause the memory controller to operate at reduced speeds or fail to boot. When mixing capacities, the system may default to a lower speed or alter interleaving, potentially reducing performance. For maximum reliability and support, select multiple modules of the exact Hynix part for homogeneous builds.

Voltage, power and thermal considerations

This Hynix module uses a low 1.1V DDR5 power profile — a standard value for DDR5 server DIMMs — which yields energy savings compared with earlier high-frequency DDR4 parts running at higher voltages. Still, at 5600 MT/s and high capacities, thermal dissipation from high-density racks can become significant; make sure chassis airflow and server cooling solutions are adequate for sustained heavy loads. Manufacturers sometimes pair heat spreaders or recommend chassis-level thermal profiles for heavy memory configurations.

Use cases and workload suitability

Virtualization and multi-tenant cloud

The 96GB capacity per module is tailored to virtualized environments where many VMs or containers run concurrently on single physical hosts. Equalizing memory across guests and enabling generous memory allocation per VM without ballooning host count reduces licensing costs and improves consolidation ratios.

In-memory databases and caching

High-capacity, high-bandwidth modules like the HMCGM4MGBRB241N are ideal for in-memory databases, large distributed caches and analytics applications that keep large working sets resident in RAM. ECC Registered RDIMMs provide both the capacity and the data integrity required for critical datasets.

Procurement guidance and sourcing

Buying new vs. surplus / used modules

When procuring high-density modules, buyers can choose between brand-new OEM modules and surplus/used alternatives. New modules from authorized distributors typically carry full manufacturer or reseller warranties and are safer for production systems. Surplus or refurbished modules may offer cost savings but often come with shorter warranties and less assurance around lifecycle pedigree. For mission-critical deployments, prefer new, verified Hynix modules; for test benches or low-risk workloads, certified refurbished units can be economical.

RAM pricing fluctuates with supply cycles, foundry capacity, and enterprise demand. When planning a deployment, include margin for price variability and consider medium-term contracts with reliable suppliers to lock in needed quantities. For large scale rollouts, request volume quotes and lead time commitments; memory supply can be constrained during industry transitions or new platform ramp-ups.

Comparisons: Hynix 96GB DDR5 vs alternatives

Hynix vs other OEM DDR5 96GB RDIMMs

Hynix is one of the leading DRAM foundries and competes directly with other major suppliers such as Samsung and Micron. Differences among vendors often come down to validation, warranty, supply relationships, and subtle timing/overclocking headroom. For enterprise procurement, the choice often depends on vendor QVLs and availability rather than raw on-chip performance since enterprise systems prioritize validated reliability.

96GB RDIMM vs 128GB LRDIMM tradeoffs

LRDIMMs (Load-Reduced DIMMs) enable higher capacity per channel at the cost of additional complexity and potential latency tradeoffs. RDIMMs like the HMCGM4MGBRB241N are a strong middle ground — they support high capacity while preserving simpler signal integrity behavior. If absolute maximum capacity per socket is the goal, LRDIMMs may be preferable; if a balance of performance and capacity with broad platform compatibility is required, RDIMMs are often selected.

Module construction and PCB layout

Server RDIMMs for DDR5 are engineered with multi-layer PCBs, careful trace routing, and register chips that help buffer addresses and commands to the DRAM devices. The dual-rank arrangement spreads memory chips across the front/back and across the module to achieve 96GB density while maintaining signal integrity at 5600 MT/s. These mechanical and electrical design choices are critical for stability when populating dense server boards.

Error correction and reliability features

ECC is a cornerstone requirement for server memory. The module implements ECC logic to correct single-bit errors and detect multi-bit errors, reducing the likelihood of silent data corruption. Registered addressing further increases reliability when many modules are present by buffering command/address lines and reducing the electrical load on the memory controller.

ECC Registered matters for enterprise

In large memory arrays, soft errors, transient bit flips and rare multi-bit upsets become statistically more likely. ECC Registered memory minimizes risk and supports in-field correction of single errors, enabling higher uptime and data integrity for critical workloads.

Testing, validation and burn-in recommendations

Prior to deploying large batches of new memory modules into production, run a validation and burn-in regimen: memtest variants that stress DDR5, vendor-recommended memory stress tools, and workload-level validation using representative VMs or applications. Track ECC event counters and thermal telemetry during burn-in to detect early failures. For vendor-certified deployments, adhere to both Hynix’s and the server OEM’s validation procedures.

Multiple reseller listings and marketplace pages list Hynix part numbers and match the technical attributes summarized above: 96GB capacity, DDR5-5600 (PC5-44800), ECC Registered RDIMM, CL46 timing, 2Rx4 rank, 1.10V operating voltage and 288-pin form factor. These details are aligned across listings on major server memory resellers and retail marketplaces, which helps validate the SKU and its expected behavior in compatible servers. For procurement and technical validation, refer to the part number HMCGM4MGBRB241N and vendor datasheets or product pages. 

Related SKUs and packaging notes

Hynix and other memory makers often ship similar-spec SKUs with minor part number suffix changes to denote binning, revision, or distribution channel. When specifying orders, record the full manufacturer part number and any applicable lot or revision information to avoid receiving a different internal binning (which may differ in validated JEDEC timing or SPD programming). Cross-reference any substitute SKUs with the OEM’s QVL prior to deployment.

Slight differences in part revisions can affect SPD/UEFI timing profiles and vendor support. For warranty and support, many server OEMs require using QVL-listed modules; inserting unlisted or differently-binned parts can complicate troubleshooting and may affect RMA coverage.

Conversion and upgrade planning

Upgrading legacy servers to DDR5

Upgrading from DDR4 to DDR5 is a platform-level move: CPUs, motherboards and chipsets must explicitly support DDR5. When planning upgrades, consider the total system cost (CPUs, boards, firmware updates) and validate application performance improvements with pilot tests before rolling out across production clusters.

Capacity planning for multi-socket systems

Calculate capacity per socket and per rack: a 96GB module multiplied across several slots delivers high per-socket capacity for consolidation targets. However, more modules increase the number of ranks and can influence achievable speeds; factor in memory channel counts, recommended population rules and the platform’s maximum supported DIMM capacity per channel.

Content and copy templates for product listings

Hynix HMCGM4MGBRB241N — 96GB DDR5-5600 (PC5-44800) ECC Registered RDIMM, CL46, 2Rx4, 1.10V, 288-pin. High-density, server-grade memory for virtualization, databases and HPC.

Extended product description (for product detail pages)

The Hynix 96GB DDR5 RDIMM (HMCGM4MGBRB241N) delivers enterprise reliability and high bandwidth for modern servers. Built with ECC and registered buffering, this module supports DDR5-5600 speeds (PC5-44800) with CL46 timings and a 1.10V power profile. The dual-rank 2Rx4 architecture enables dense configurations with robust platform compatibility. Ideal for data center consolidation, virtualization and in-memory workloads, this module balances performance, capacity and power efficiency.

Final Technical Note

Before finalizing purchases for production systems, confirm the exact Hynix part number, review the server OEM’s compatibility documentation, and perform validation tests on representative hardware. Verified listings in the reseller ecosystem confirm the summarized specifications — 96GB, DDR5-5600 (PC5-44800), ECC Registered, CL46, 2Rx4, 1.1V, 288-pin — but platform validation remains the single most important step for a successful deployment.