M393B1K70CH0-YH9 Samsung 8GB DDR3 SDRAM PC3-10600 ECC RAM

Samsung M393B1K70CH0-YH9 8GB DDR3 RAM

The Samsung M393B1K70CH0-YH9 8GB PC3-10600 DDR3-1333MT/s 2RX4 ECC Memory module is engineered for reliability and high-speed performance, making it ideal for enterprise servers and advanced computing systems.

Main Information

• Brand: Samsung
• Model Number: M393B1K70CH0-YH9
• Product Type: 8GB DDR3 SDRAM Memory Module

Technical Specifications

• Capacity: 8GB
• Technology: DDR3 SDRAM
• Configuration: 1 x 8GB module

Performance Attributes

• Bus Speed: 1333MT/s DDR3-1333 / PC3-10600
• Data Integrity: ECC (Error-Correcting Code)
• Signal Processing: Registered
• CAS Latency: CL9
• Rank Type: Dual Rank x4

Physical Characteristics

Design & Build

• Form Factor: 288-pin RDIMM

Dimensions & Weight

Measurements

• Height: 1.00 in
• Depth: 6.75 in

Weight

• Shipping Weight: 0.20 lb

Samsung M393B1K70CH0-YH9 8GB RDIMM ECC RAM Overview

The Samsung M393B1K70CH0-YH9 8GB DDR3 RDIMM memory module belongs to a specialized category of enterprise-grade server memory designed for stability, compatibility, and long-term reliability in professional computing environments. This category focuses on DDR3 Registered DIMM solutions that are widely used in legacy enterprise servers, data centers, and mission-critical systems where consistent performance and error correction remain essential. DDR3 RDIMM memory continues to play an important role in extending the lifespan of established server infrastructures while maintaining dependable operation under sustained workloads.

Enterprise DDR3 memory modules are engineered to meet stringent requirements that go far beyond consumer-grade RAM. This category emphasizes registered architecture, error-correcting code support, and dual-rank configurations to ensure signal integrity and data accuracy. Products such as the Samsung M393B1K70CH0-YH9 are designed for server motherboards that require registered DIMMs, making them suitable for rack servers, blade systems, and tower servers deployed in corporate IT, virtualization clusters, and backend processing environments.

DDR3 SDRAM Technology in Server Memory Categories

DDR3 SDRAM represents a mature and proven memory technology that remains widely deployed across enterprise platforms. Within this category, DDR3 modules operating at 1333MT/s deliver a balanced combination of bandwidth efficiency and power optimization. The Samsung M393B1K70CH0-YH9 module operates at PC3-10600 speeds, aligning with industry standards for DDR3-1333 registered memory used in many Intel Xeon and AMD Opteron-based systems.

The DDR3 architecture improves upon previous generations by offering higher data transfer rates and lower operating voltages. At 1.35 volts, this memory module fits into the low-voltage DDR3L category, which helps reduce overall power consumption and heat generation in densely populated server environments. This aspect is particularly important in data centers where energy efficiency and thermal management directly impact operational costs.

PC3-10600 Performance Classification

The PC3-10600 classification identifies the theoretical bandwidth of approximately 10.6GB per second, making this category suitable for applications that require steady and predictable memory throughput. While newer memory generations exist, PC3-10600 DDR3 RDIMM modules remain relevant for workloads such as file serving, database hosting, virtualization on legacy hypervisors, and enterprise applications optimized for DDR3 platforms.

This performance tier ensures compatibility with a wide range of server chipsets that are designed around DDR3-1333 memory frequencies. The category focuses on stability rather than peak performance, ensuring that systems can run continuously with minimal memory-related errors or performance fluctuations.

Registered DIMM Architecture and Signal Integrity

Registered DIMM memory modules form a critical subcategory within enterprise server memory. The Samsung M393B1K70CH0-YH9 utilizes RDIMM architecture, which incorporates a register between the memory controller and the DRAM chips. This register buffers command and address signals, reducing electrical load on the memory controller and enabling the use of higher-capacity configurations.

This architectural approach is essential for servers that support large memory footprints and multiple DIMM slots per channel. Registered DIMMs enhance signal integrity, especially in systems populated with multiple memory modules. As a result, this category is preferred for enterprise servers that demand scalability and long-term operational reliability.

ECC Support for Data Accuracy

Error Correcting Code functionality is a defining feature of this category. ECC memory is designed to detect and correct single-bit memory errors and identify multi-bit errors before they can affect system stability. The Samsung M393B1K70CH0-YH9 integrates ECC support, making it suitable for environments where data integrity is non-negotiable.

In enterprise workloads such as virtualization, financial processing, scientific computing, and enterprise databases, even minor memory errors can lead to data corruption or system crashes. ECC registered memory modules mitigate these risks by maintaining data accuracy throughout extended operation cycles.

Importance of ECC in Server Environments

ECC memory plays a critical role in ensuring uptime and reliability. This category is specifically targeted toward professional systems that operate continuously under heavy load. ECC support helps reduce system crashes, prevent silent data corruption, and improve overall system trustworthiness. These benefits make ECC RDIMM memory modules a standard requirement in enterprise-grade hardware deployments.

Dual Rank X4 Configuration and Memory Density

The dual rank x4 configuration of the Samsung M393B1K70CH0-YH9 places it firmly within a category optimized for balanced performance and reliability. Dual rank memory modules present two sets of memory banks to the memory controller, allowing improved interleaving and more efficient utilization of available bandwidth.

An x4 organization means that the memory chips are arranged to provide enhanced fault tolerance when combined with ECC. This configuration is commonly used in enterprise memory because it allows more robust error detection and correction compared to x8 configurations. As a result, this category is especially suitable for mission-critical systems.

8GB Capacity for Scalable Server Builds

An 8GB capacity per module represents a flexible building block for server memory configurations. This category supports incremental scaling, allowing administrators to populate servers with multiple modules to reach higher total capacities without sacrificing compatibility. The Samsung M393B1K70CH0-YH9 fits well into systems that require moderate to high memory density while maintaining compatibility with older platforms.

In many enterprise environments, 8GB DDR3 RDIMM modules are used to balance cost, performance, and capacity. They enable system designers to configure servers with sufficient memory for virtualization hosts, application servers, and database instances without exceeding platform limitations.

Memory Interleaving Benefits

Dual rank memory modules can improve memory interleaving, which enhances effective throughput by allowing the memory controller to alternate access between ranks. This contributes to smoother performance under concurrent workloads and helps reduce latency in multi-threaded applications commonly found in enterprise environments.

Latency Characteristics and CL9 Timing

Latency is a key parameter in server memory categories, and the CL9 timing of this module reflects a balance between speed and stability. CAS latency 9 at DDR3-1333 speeds is a widely supported and stable configuration for enterprise platforms. This timing ensures predictable memory response times while maintaining compatibility with a broad range of server motherboards.

In enterprise applications, consistency is often more important than achieving the lowest possible latency. CL9 memory modules such as the Samsung M393B1K70CH0-YH9 are designed to operate reliably under continuous workloads, making them suitable for servers that prioritize uptime and data integrity.

Impact of Latency on Enterprise Workloads

Memory latency affects application responsiveness, particularly in database operations, virtualization environments, and transaction-heavy workloads. This category is optimized to deliver stable latency characteristics rather than aggressive overclocked timings. By adhering to JEDEC standards, these memory modules ensure broad compatibility and predictable behavior.

Low Voltage 1.35V DDR3L Efficiency

The 1.35V operating voltage places this memory module within the DDR3L category, which is designed to reduce power consumption compared to standard 1.5V DDR3 memory. This feature is particularly valuable in data center environments where hundreds or thousands of memory modules may be deployed across multiple servers.

Lower voltage operation contributes to reduced heat output, which in turn can improve system stability and extend the lifespan of server components. This category is well-suited for organizations seeking to optimize energy efficiency while maintaining compatibility with DDR3-based platforms.

Thermal and Power Management Advantages

DDR3L memory modules help reduce overall system power draw, making them an attractive option for enterprises aiming to lower operational costs. The Samsung M393B1K70CH0-YH9 supports efficient thermal management, enabling servers to operate within optimal temperature ranges even under sustained workloads.

240-Pin RDIMM Form Factor Compatibility

The 240-pin RDIMM form factor is a defining characteristic of DDR3 registered memory modules. This category is designed specifically for server motherboards that support DDR3 RDIMM slots. The physical design ensures proper alignment, electrical compatibility, and secure installation within enterprise systems.

This form factor distinguishes RDIMM modules from unbuffered DIMMs and load-reduced DIMMs, ensuring that they are used only in compatible platforms. The Samsung M393B1K70CH0-YH9 adheres strictly to JEDEC specifications, reinforcing its role within the enterprise memory category.

Server Platform Compatibility

DDR3 RDIMM memory modules are compatible with a wide range of legacy server platforms from major manufacturers. This category supports systems built around enterprise chipsets that rely on registered memory for stability and scalability. Proper compatibility ensures reliable booting, accurate memory recognition, and long-term operational stability.

Use Cases for DDR3 RDIMM Enterprise Memory

This category of memory modules is commonly used in enterprise servers supporting virtualization, database hosting, file services, and application delivery. The Samsung M393B1K70CH0-YH9 is suitable for organizations maintaining DDR3-based infrastructure while requiring dependable and standards-compliant memory upgrades or replacements.

DDR3 RDIMM memory remains relevant in scenarios where legacy systems continue to deliver value and performance aligned with organizational needs. This category supports cost-effective maintenance and expansion without requiring complete platform replacement.