M393B2G70QH0YK0 Samsung 16GB RAM DDR3 SDRAM 240-Pin 1600Mhz PC3-12800 Cl11 Ecc Registered

Samsung 16GB DDR3 ECC Memory

Main Information

• Brand: Samsung
• Model Number: M393B2G70QH0YK0
• Product Title: 16GB DDR3 SDRAM Memory Module

Technical Specifications

Core Features

• Capacity: 16GB
• Technology: DDR3 SDRAM
• Module Count: 1 x 16GB

Performance Details

• Bus Speed: 1600MT/s (PC3-12800)
• Error Correction: ECC (Error-Correcting Code)
• Signal Type: Registered
• Latency: CL11
• Rank: Dual Rank x4

Physical Characteristics

Design & Build

• Form Factor: 288-pin RDIMM

Dimensions & Weight

• Height: 1.00 inch
• Depth: 6.75 inches
• Weight: 0.20 lb

Performance

• High-speed 1600MT/s bus for faster data transfer.
• Optimized latency (CL11) for efficient processing.

M393B2G70QH0YK0 DDR3 ECC Memory Overview 

The Samsung M393B2G70QH0YK0 16GB PC3-12800 DDR3-1600MT/s 2Rx4 ECC Memory belongs to a specialized category of enterprise-grade server memory modules engineered to deliver dependable performance, long-term stability, and data integrity in professional computing environments. This category encompasses registered and unbuffered ECC DDR3 memory solutions designed to support mission-critical workloads where accuracy, uptime, and predictable behavior are essential. The focus of this category is not consumer-level computing, but infrastructure platforms such as rack servers, blade systems, storage appliances, and workstation-class machines that operate continuously under sustained load.

This category description reflects how such memory modules are selected, deployed, and maintained within enterprise IT ecosystems. The Samsung M393B2G70QH0YK0 model exemplifies the balance between capacity, speed, and error correction that defines this category, offering 16GB of memory capacity combined with DDR3-1600 data transfer rates and ECC functionality. These attributes align with the requirements of data centers, virtualization platforms, database servers, and other environments where memory reliability directly affects system stability and service availability.

DDR3 Architecture and PC3-12800 Classification

The PC3-12800 designation places this memory module within the DDR3-1600 performance tier, indicating a theoretical maximum bandwidth of 12.8 GB/s per module. This classification is derived from the DDR3 architecture’s double data rate signaling and effective clock speed, allowing data to be transferred on both the rising and falling edges of the clock signal. Within this category, PC3-12800 modules represent a widely adopted standard that balances performance and power consumption for server platforms released during the DDR3 era.

DDR3 memory architecture introduced significant improvements over earlier DDR2 designs, including lower operating voltage, higher densities, and improved signal integrity. For enterprise memory categories such as the Samsung M393B2G70QH0YK0, these architectural enhancements translate into reduced power draw per gigabyte and improved thermal behavior within densely populated server chassis. The DDR3-1600 specification remains relevant in many deployed systems where platform stability and validated configurations take precedence over adopting newer memory generations.

16GB Capacity and Enterprise Memory Scaling

A capacity of 16GB per module positions this memory firmly within the enterprise scalability category. This capacity allows system administrators to populate servers with sufficient memory to support multiple virtual machines, in-memory caching, and large datasets without excessive module counts. In multi-slot server motherboards, 16GB modules provide a balance between maximizing total memory capacity and maintaining manageable power and thermal profiles.

The category of 16GB DDR3 ECC modules remains relevant for infrastructure systems that require moderate to high memory density while operating on legacy or long-term support platforms. By using fewer high-capacity modules rather than many lower-capacity ones, system designers can reduce memory channel congestion and simplify maintenance procedures. The Samsung M393B2G70QH0YK0 exemplifies this approach by delivering substantial capacity in a single DIMM.

Impact on Virtualization and Consolidation

In virtualized environments, memory capacity directly influences the number of virtual machines that can be hosted on a single physical server. Modules in this category enable higher consolidation ratios by providing ample memory resources without compromising reliability. The 16GB capacity supports memory reservation strategies and reduces the need for aggressive memory overcommitment, which can negatively affect performance.

For virtualization platforms relying on DDR3 memory, such modules allow administrators to allocate memory more predictably across workloads. This contributes to stable performance profiles and simplifies capacity planning. The Samsung M393B2G70QH0YK0 is well-suited for these scenarios, aligning with the category’s emphasis on balanced resource provisioning.

ECC Technology and Data Integrity

Error Correcting Code, commonly referred to as ECC, is a defining feature of this memory category. ECC memory is engineered to detect and correct single-bit memory errors and detect multi-bit errors, significantly reducing the risk of data corruption. In enterprise and server environments, even minor memory errors can propagate through applications and result in system crashes, corrupted databases, or incorrect computational results.

The Samsung M393B2G70QH0YK0 integrates ECC functionality as part of its design, reinforcing the category’s commitment to data integrity and system reliability. ECC memory modules are particularly important in systems that operate continuously, where prolonged uptime increases the likelihood of transient errors caused by electrical interference or cosmic radiation.

Reliability in Mission-Critical Applications

Memory categories that include ECC functionality are commonly specified for mission-critical applications such as financial systems, healthcare platforms, and industrial control systems. In these contexts, accuracy and consistency are paramount. ECC memory contributes to overall system resilience by minimizing silent data corruption, which can otherwise go undetected until significant damage has occurred.

The presence of ECC in the Samsung M393B2G70QH0YK0 aligns with enterprise procurement standards that prioritize long-term stability over consumer-oriented performance metrics. This category emphasizes error prevention and correction as a foundational requirement rather than an optional enhancement.

2Rx4 Rank and Organization Characteristics

The 2Rx4 designation describes the internal organization of the memory module, indicating two ranks with x4 DRAM devices. This configuration is common in registered server memory categories, where rank structure influences compatibility and performance. The use of x4 devices is particularly relevant for ECC memory, as it supports more granular error detection and correction.

Within this category, 2Rx4 modules are favored for their balance of capacity and compatibility across a wide range of server platforms. The rank structure affects how memory controllers access the module, and enterprise-grade controllers are typically optimized to work efficiently with such configurations. The Samsung M393B2G70QH0YK0 adheres to these expectations, ensuring broad platform support.

Compatibility with Server Memory Controllers

Server processors and chipsets designed for DDR3 memory often specify supported rank and device configurations. Modules in this category are validated against these specifications to ensure stable operation. The 2Rx4 organization is widely supported and commonly listed in server qualified vendor lists, making it a reliable choice for system upgrades and replacements.

By conforming to standard rank configurations, the Samsung M393B2G70QH0YK0 reduces the risk of incompatibility issues that can arise from unconventional memory layouts. This compatibility focus is central to the category, where predictability and adherence to standards are valued.

Registered and Buffered Memory Design 

Although not always explicitly highlighted, many modules in this category are designed to operate as registered or buffered memory, which improves signal integrity in systems with multiple DIMMs per channel. Registered memory introduces a register between the memory controller and the DRAM chips, reducing electrical load and enabling higher memory capacities in server configurations.

This design characteristic is particularly important in enterprise systems where memory slots are fully populated. The category emphasizes stable signaling and reduced timing issues, contributing to overall system reliability. The Samsung M393B2G70QH0YK0 is designed to align with these principles, supporting dense memory configurations without compromising performance.

Thermal and Power Efficiency

Thermal management is a critical consideration in server memory categories. DDR3 memory operates at a lower voltage compared to earlier generations, typically around 1.5V, which helps reduce power consumption and heat output. For data centers managing hundreds or thousands of servers, incremental improvements in power efficiency translate into significant operational savings.

The Samsung M393B2G70QH0YK0 benefits from Samsung’s manufacturing processes that emphasize consistent electrical characteristics and thermal stability. Modules in this category are designed to operate reliably within the thermal envelopes of server chassis, even under sustained workloads and elevated ambient temperatures.

Airflow and System Design Integration

Enterprise memory modules are typically installed in systems with controlled airflow patterns and active cooling solutions. The physical design of the module supports efficient heat dissipation, ensuring that DRAM components remain within specified operating ranges. This category assumes integration into professionally managed environments where airflow and cooling are optimized.

By adhering to standard DIMM form factors and thermal characteristics, the Samsung M393B2G70QH0YK0 integrates seamlessly into existing server designs. This compatibility reduces the need for custom cooling solutions and simplifies system maintenance.