Comprehensive Product Overview
The Samsung M393A8G40AB2-CWEQB represents the pinnacle of reliable, high-density memory for modern data centers and enterprise servers. As a 64GB DDR4-3200 module, it is engineered to deliver exceptional bandwidth, unwavering data integrity, and robust performance for mission-critical applications, from large-scale virtualization and in-memory databases to high-performance computing (HPC) and cloud infrastructure.
Main Information
- Brand Name: Samsung
- Part Number: M393A8G40AB2-CWEQB
- Product Type: 64GB DDR4 SDRAM Memory Module
Technical Specifications
- Capacity: 64GB module
- Technology Type: DDR4 SDRAM
- Module Count: Single 64GB unit
- Speed Rating: 3200Mbps (DDR4-3200 / PC4-25600)
- Error Correction: ECC support for data accuracy
- Signal Handling: Registered design for stability
- Latency: CL22 timings
- Rank Structure: Dual Rank x4 configuration
Physical Characteristics
- Pin Layout: 288-pin RDIMM
- Voltage Requirement: Operates at 1.2V
Highlighted Features
- Engineered for enterprise-grade servers and workstations
- Supports high-bandwidth applications and intensive workloads
Advanced Efficiency
- Low power consumption with 1.2V operation
- Enhanced thermal management for consistent performance
Enterprise-Level Benefits
- Reliable ECC protection ensures data integrity
- Registered architecture improves signal quality
- High-density 64GB capacity maximizes scalability
- DDR4-3200 speed delivers faster response times
Understanding of 64GB Server Memory Module
In the realm of enterprise computing and data center operations, memory is not merely a component; it is the critical substrate upon which computational tasks are executed. The category of DDR4 Server Memory, specifically Registered Dual In-Line Memory Modules (RDIMMs), represents the pinnacle of reliability, capacity, and error-resilient performance for mission-critical systems. Modules like the Samsung M393A8G40AB2-CWEQB are engineered to meet the relentless demands of servers, high-performance workstations, and storage area networks, where system stability and data integrity are non-negotiable.
Core Product Specifications
Understanding the product's nomenclature provides immediate insight into its capabilities. The part number M393A8G40AB2-CWEQB is a detailed blueprint of the module's characteristics.
Memory Type and Architecture
This module is a DDR4 SDRAM (Synchronous Dynamic Random-Access Memory) device. The "288-pin" designation specifies the physical interface, which is the standard for DDR4 DIMMs, ensuring it fits into contemporary server motherboards. Its form factor is an RDIMM (Registered DIMM), which incorporates a register (or buffer) between the memory controller and the DRAM chips. This register reduces the electrical load on the controller, enabling higher module densities and more stable operation in multi-channel, multi-DIMM configurations typical of servers.
Capacity: 64GB (1x64GB)
The module offers a substantial 64GB of capacity in a single stick. The "(1x64GB)" denotes a single module of 64 gigabytes, allowing for flexible system population. Servers can be equipped with multiple of these modules to reach terabytes of total system memory, catering to memory-intensive workloads without sacrificing physical slot availability.
Speed and Data Rate: 3200Mbps & PC4-25600
The module operates at a data rate of 3200 Megatransfers per second (MT/s), commonly referred to as 3200Mbps. This translates to a peak theoretical bandwidth of 25,600 MB/s per module, as indicated by the PC4-25600 classification (PC4 for DDR4, 25600 for 25600 MB/s bandwidth). This high-speed interface accelerates data movement between the CPU and memory, reducing bottlenecks in compute-intensive tasks.
Critical Performance and Reliability Features
Beyond raw capacity and speed, this module incorporates several technologies that are non-negotiable for enterprise environments where uptime and data accuracy are paramount.
ECC and Registered (ECC Registered)
The module features Error-Correcting Code (ECC) and is of the Registered (buffered) type. ECC is a fundamental reliability feature that detects and corrects the most common types of data corruption in real-time. It can fix single-bit errors and detect (though not always correct) multi-bit errors on-the-fly, preventing silent data corruption that could lead to application crashes, calculation errors, or system instability. The combination of ECC with the Registered design makes this an ECC Registered RDIMM, the de facto standard for servers requiring both high capacity and maximum data integrity.
Latency Timing: CL22
The CAS Latency (CL) is specified as 22. This timing indicates the number of clock cycles between a read command and the moment data is available. At 3200 MT/s, a CL22 timing represents a balanced profile optimized for server workloads that prioritize consistent throughput and stability over ultra-tight latencies, which are more critical in desktop gaming scenarios.
Rank and DRAM Density: Dual Rank, x4 Organization
The "Dual Rank" and "x4" specifications describe the internal organization of memory chips. A dual-rank module essentially presents two logical banks of memory to the memory controller on the same physical stick. This architecture improves performance by allowing for interleaving—the controller can access one rank while the other is preparing data, leading to better bus utilization and efficiency. The "x4" refers to the data width of the individual DRAM chips (4 bits). x4 organization is crucial for supporting advanced error correction like SDDC (Single Device Data Correction), which can correct errors within a single DRAM chip, a feature often required in high-end servers from vendors like Dell, HPE, and Lenovo.
Power Efficiency
The module operates at the standard DDR4 voltage of 1.2 volts. This lower voltage (compared to DDR3's 1.5V) contributes to reduced power consumption and heat generation at the system level, a critical consideration for dense server racks where energy efficiency and thermal management directly impact operational costs.
Target Applications and Server Compatibility
The Samsung M393A8G40AB2-CWEQB is not designed for consumer PCs. Its purpose is to serve as the high-performance, reliable backbone in enterprise hardware.
Ideal Server Workloads
This memory excels in environments that demand high throughput, large capacity, and flawless operation. Key applications include enterprise virtualization platforms (VMware vSphere, Microsoft Hyper-V, Citrix Hypervisor) where consolidating numerous virtual machines requires massive, pooled memory resources. It is equally critical for database servers (SQL Server, Oracle DB) and in-memory data platforms (SAP HANA), where vast datasets are loaded into RAM for instantaneous processing. High-Performance Computing (HPC) clusters, rendering farms, and advanced analytics engines also benefit from the module's density and bandwidth.
Platform and System Compatibility
This specific module is engineered for compatibility with a wide range of modern server platforms. It is designed to work with Intel Xeon Scalable Processors (from the "Purley" platform onwards, including Cascade Lake, Ice Lake, and newer generations) and compatible AMD EPYC processors that support DDR4-3200 RDIMMs. It is crucial to verify compatibility with your specific server model's Qualified Vendor List (QVL) or memory compatibility guide from manufacturers such as Dell EMC (PowerEdge), HPE (ProLiant, Apollo), Lenovo (ThinkSystem), and Cisco (UCS). Always ensure the system BIOS is updated to the latest version for optimal compatibility and performance.
Technical Deep Dive: Understanding the Specifications
For IT professionals and system integrators, a deeper understanding of the module's technical aspects informs procurement and deployment decisions.
Memory Module Ranking and Its Impact
The dual-rank design of this module is a key performance differentiator. In a server motherboard, the memory controller has a limited electrical drive strength. Using single-rank (SR) modules, a system might be limited to populating only a certain number of slots before encountering signal integrity issues. Dual-rank (DR) modules, like this one, place two sets of chips on the module but use the same electrical load as a single-rank module from the controller's perspective. This allows a system to be fully populated with high-density modules (e.g., 64GB or 128GB per slot) without overloading the memory controller, maximizing total system memory capacity.
The Significance of x4 Data Organization
The "x4" organization (where each DRAM chip provides a 4-bit data path) is essential for achieving higher reliability through Chipkill and SDDC (Single Device Data Correction) technologies. These advanced ECC schemes, supported by modern server platforms, can survive the complete failure of an entire DRAM chip without data loss or system crash. This is possible because with x4 chips, the ECC code word is spread across more chips. Modules with x8 organization typically do not support this level of protection. Therefore, the M393A8G40AB2-CWEQB's x4 design is a critical feature for Tier-1 mission-critical applications.
Interoperability in Multi-Channel Architectures
Modern server CPUs feature multi-channel memory architectures (e.g., 6-channel for Intel Xeon Scalable, 8-channel for AMD EPYC). To achieve the full memory bandwidth potential, channels must be populated symmetrically. A single 64GB RDIMM like this one would occupy one channel. Optimal performance is achieved by installing modules in multiples that match the channel count (e.g., 6 or 12 modules for a 6-channel CPU). It is vital to follow the server manufacturer's population guidelines to ensure proper channel interleaving and performance.
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