HMCG94AEBRA123N Hynix 64GB DDR5 SDRAM Memory Module PC5-38400 CL40 288-Pin RDIMM

Overview of Hynix HMCG94AEBRA123N 64GB DDR5 RDIMM CL40

The Hynix HMCG94AEBRA123N 64GB DDR5 PC5-38400 SDRAM CL40 288-Pin RDIMM 2rx4 ECC memory module represents a state-of-the-art server memory solution designed to meet the demands of modern high-performance computing, cloud data centers, artificial intelligence workloads, and enterprise-level virtualization. As a DDR5 RDIMM module, it offers substantial improvements over DDR4, including higher bandwidth, lower power consumption, and advanced error correction capabilities, making it ideal for mission-critical environments where performance, reliability, and scalability are paramount.

DDR5 Architecture and Advanced Engineering

DDR5 technology introduces fundamental architectural improvements compared to its predecessor, which directly impact the performance, efficiency, and scalability of server memory. The Hynix HMCG94AEBRA123N module is built to leverage the full potential of DDR5 by incorporating dual 32-bit subchannels per module, enabling increased memory parallelism and optimized command handling. This subchannel architecture allows the module to execute multiple memory access requests concurrently, reducing latency and improving the overall system throughput. Furthermore, DDR5 introduces on-die ECC for each DRAM chip, enhancing data integrity before data even reaches the system-level ECC.

Data Transfer Rates

Operating at PC5-38400 specifications, the HMCG94AEBRA123N module achieves a peak data rate of 4800MT/s, providing higher throughput than typical DDR4 modules. This high-speed data transfer is particularly beneficial for workloads requiring sustained high memory bandwidth, such as AI training, GPU acceleration, scientific simulations, and large-scale virtualization. The improved burst length and prefetch capabilities of DDR5 further enhance the effective bandwidth, ensuring that modern multi-core processors can fully utilize memory resources without bottlenecks. By reducing memory contention and optimizing data flow, servers equipped with these modules can achieve superior performance and responsiveness across a wide range of applications.

Dual-Rank (2Rx4) Configuration and Latency Considerations

The dual-rank 2Rx4 organization of this module allows multiple banks within each rank to be accessed simultaneously, effectively improving memory concurrency. Each rank operates independently, which enables the memory controller to alternate between ranks, reducing idle cycles and improving effective throughput. While DDR5 modules have slightly higher base latency (CL40) compared to some DDR4 modules, the increased parallelism, higher bandwidth, and architectural efficiencies more than compensate for the nominal latency increase. In memory-intensive operations such as in-memory databases or HPC tasks, the dual-rank configuration ensures that performance scales efficiently with higher memory population levels.

ECC Functionality and Enterprise-Class Reliability

Error-Correcting Code (ECC) is a core feature of the HMCG94AEBRA123N module, providing single-bit error correction and multi-bit error detection at the module level. In conjunction with the on-die ECC embedded in DDR5 DRAM chips, this module ensures that both soft errors and system-level data integrity issues are addressed proactively. ECC functionality is critical in data centers, cloud environments, and mission-critical computing scenarios where even a single memory error can lead to significant operational disruptions. By correcting memory errors automatically, ECC-enabled modules help maintain system stability, uptime, and data integrity across enterprise workloads.

Module Construction and Heat Dissipation

The physical design of the module ensures reliable heat dissipation and long-term operational stability. High-quality PCB materials, optimized IC placement, and thermal-aware routing minimize hotspots, preventing thermal-induced performance degradation. Dual-rank architecture also contributes to better heat distribution across the module, ensuring consistent operating conditions even in fully populated server memory channels. These design elements enable sustained high-speed operation and reduce the likelihood of memory-related throttling or system instability during intensive workloads.

Use Cases in Enterprise and High-Performance Environments

The Hynix HMCG94AEBRA123N module is purpose-built for environments where large memory capacities, high reliability, and superior performance are required. Common applications include virtualization-heavy servers, AI and machine learning clusters, in-memory database platforms, high-performance computing simulations, and large-scale analytics workloads. Its combination of DDR5 speed, ECC reliability, and dual-rank capacity makes it an ideal choice for modern data center deployments seeking to maximize computing performance without sacrificing stability.

Cloud Computing

Virtualization environments demand significant memory bandwidth and reliability to efficiently host multiple virtual machines (VMs). The high capacity and dual-rank architecture of the HMCG94AEBRA123N module allow servers to support dense VM deployment without experiencing memory bottlenecks. This ensures smooth operation of hypervisors such as VMware ESXi, Microsoft Hyper-V, and KVM, providing improved consolidation ratios, reduced latency, and higher overall system efficiency in cloud and on-premises data center environments.

Machine Learning Workloads

AI and ML workloads require fast, reliable access to large datasets. The 64GB capacity per module and high DDR5 bandwidth enable rapid training and inferencing in deep learning applications, supporting high-performance GPU-accelerated clusters. Dual-rank architecture allows multiple memory banks to be accessed in parallel, ensuring that AI workloads receive consistent throughput. These features make the module suitable for training complex neural networks, real-time data analytics, and GPU-centric compute operations.

In-Memory Databases Analytics

In-memory databases and real-time analytics platforms benefit from large memory pools to hold entire datasets in RAM for ultra-fast access. The HMCG94AEBRA123N module’s capacity and ECC reliability provide the stability required to maintain database integrity during high-frequency read/write operations. Applications such as SAP HANA, Redis, and Apache Ignite can leverage these memory modules to deliver high-speed analytics and low-latency query response times, supporting large-scale enterprise business intelligence and transactional processing systems.

Server Integration

Modern server architectures are optimized for DDR5 modules like the Hynix HMCG94AEBRA123N. Its compatibility with 288-pin RDIMM slots ensures straightforward integration into next-generation server motherboards supporting DDR5 memory. The dual-rank 2Rx4 design, along with ECC support, allows servers to achieve high memory density and reliability simultaneously. By taking advantage of DDR5 architectural improvements such as increased bank groups, enhanced prefetch operations, and improved refresh management, this module ensures that system memory resources are efficiently utilized to maximize CPU performance across diverse workloads.

Multitasking and Concurrent Workload Handling

With dual subchannels and multiple ranks, the module enhances multitasking performance, allowing servers to handle several memory-intensive operations simultaneously. This is particularly important in microservices architectures, containerized workloads, or multi-tenant cloud environments. The architecture reduces memory contention and improves the efficiency of parallel processing, ensuring smooth performance even under peak load conditions.

Scalability and Enterprise Adaptability

Deploying HMCG94AEBRA123N modules prepares data centers and enterprise infrastructures for future workloads. DDR5 memory is designed to scale with increasing CPU core counts, AI processing demands, and high-bandwidth data pipelines. This module’s 64GB capacity, dual-rank design, and ECC protection make it suitable for scaling up memory configurations in multi-socket servers while maintaining reliability and thermal stability. It ensures that memory performance remains consistent as applications and datasets grow in size and complexity.

Data Integrity

Data integrity is critical in regulated industries such as finance, healthcare, and government. ECC memory, combined with DDR5 on-die error correction, provides a dual layer of protection, reducing the risk of data corruption during operation. Organizations relying on these modules can ensure compliance with data retention, audit, and regulatory requirements while maintaining high-performance computing capabilities.

Memory Deployments

The HMCG94AEBRA123N module supports high-capacity memory installations across multiple channels, enabling servers to achieve terabyte-scale RAM configurations. High-density memory deployment allows for larger virtualized environments, expanded AI training datasets, and in-memory database storage, significantly enhancing overall data center efficiency and computational power.

Operational Longevity and Reliability

Hynix engineers its DDR5 RDIMMs with high-quality components, rigorous testing protocols, and advanced PCB design. This ensures long-term operational stability, low failure rates, and resistance to thermal and electrical stresses. The combination of ECC, dual-rank design, and robust construction ensures that these modules deliver dependable performance over extended service life, reducing maintenance costs and minimizing system downtime.