HMCG88MEBRA112N Hynix 32GB PC5-38400 DDR5 Dual Rank Memory

Highlights of Hynix HMCG88MEBRA112N 32GB DDR5 RDIMM Ram

The Hynix HMCG88MEBRA112N is a cutting-edge 32GB DDR5 memory module engineered for enterprise servers. Featuring ECC support and dual-rank design, this RDIMM module ensures robust data integrity and high-performance reliability for critical server applications.

General Information

• Manufacturer: Sk Hynix
• Part Number: HMCG88MEBRA112N
• Product Type: Server Memory Module
• Sub Type: 32GB DDR5-4800MT/s

Technical Specifications

• Memory Capacity: 32GB
• Memory Type: DDR5 SDRAM
• Module Count: 1 X 32GB
• Memory Speed: 4800MT/s (DDR5-4800 / PC5-38400)
• Error Correction: ECC (Error-Correcting Code)
• Rank: Dual Rank 2RX8
• Registered: Yes (RDIMM)
• CAS Latency: CL40

Physical Attributes

• Form Factor: 288-pin RDIMM
• Dimensions: 1.00" (H) X 6.75" (D)
• Shipping Weight: 0.20 lb

Compatibility

• PowerEdge R750
• PowerEdge R750xa
• PowerEdge R760
• PowerEdge R760xd2
• PowerEdge R770
• PowerEdge R660
• PowerEdge R660xs
• PowerEdge C6620
• PowerEdge Hs5610
• PowerEdge Hs5620
• PowerEdge Mx760c
• PowerEdge T550

Overview of Hynix HMCG88MEBRA112N 32GB DDR5-4800MT/s

The Hynix HMCG88MEBRA112N 32GB DDR5-4800MT/s PC5-38400 ECC Registered CL40 288-Pin RDIMM Dual Rank Memory Module is a high-performance enterprise-grade memory solution designed for modern server and data center environments. Engineered with DDR5 technology, this module delivers significant improvements in memory bandwidth, power efficiency, and operational reliability. The 288-pin RDIMM form factor provides compatibility with contemporary server motherboards, enabling scalable, high-density memory configurations across single- or multi-socket systems.

DDR5 Technology and Enhanced Performance

DDR5 memory introduces advanced architectural improvements over DDR4, including higher data transfer rates, increased channel efficiency, and improved power management. Operating at 4800MT/s, the HMCG88MEBRA112N provides fast and consistent data access, supporting the high-throughput requirements of modern server applications. DDR5 modules feature on-die ECC for internal memory error detection and correction, as well as optimized burst lengths, which enable larger amounts of data to be transferred per memory operation. These enhancements are crucial for performance-sensitive environments that demand reliable and uninterrupted memory access.

Dual-Rank 2Rx8 Architecture

The 2Rx8 dual-rank design allows for simultaneous access to two separate memory ranks on the module. This interleaving capability increases overall memory throughput and reduces access latency, providing improved performance for multi-threaded and memory-intensive workloads. Dual-rank modules are particularly advantageous in server applications where multiple virtual machines or data-intensive processes are run concurrently, as they allow balanced memory access and efficient utilization of available bandwidth.

Increased Data Access

By enabling rank interleaving, the dual-rank 2Rx8 design of the HMCG88MEBRA112N minimizes memory bottlenecks and improves overall system responsiveness. This feature is critical for workloads such as AI model training, big data analytics, and virtualization, where multiple simultaneous memory requests must be handled efficiently. Interleaved rank access ensures that memory operations are distributed evenly across ranks, reducing latency and enhancing sustained performance under high-demand conditions.

High-Density Memory for Scalable Servers

The 32GB per DIMM capacity allows servers to achieve high-density configurations without consuming excessive physical space. By populating multiple DIMM slots across one or more CPU sockets, data centers can scale memory capacity to several terabytes, supporting large datasets, complex simulations, and multiple virtualized environments. This high-density capability provides flexibility for enterprise IT teams, enabling them to tailor memory capacity to specific workloads while maintaining efficiency and performance.

ECC Registered Technology for Enterprise Reliability

The HMCG88MEBRA112N features ECC (Error-Correcting Code) registered technology, which provides advanced error detection and correction capabilities. ECC ensures that single-bit errors are corrected in real-time, preventing potential system crashes or data corruption. Multi-bit errors can also be detected and reported, further enhancing system reliability. ECC Registered memory is essential in mission-critical environments such as financial systems, cloud infrastructure, healthcare applications, and data analytics platforms, where data integrity is paramount.

On-Die ECC and Module-Level Protection

DDR5 modules integrate on-die ECC within each DRAM chip, which allows internal correction of memory errors independently of the CPU. Combined with module-level ECC, this architecture provides a multi-layered approach to memory protection. The HMCG88MEBRA112N ensures reliable operation even under high workloads, safeguarding critical enterprise applications against memory-related faults and data integrity issues.

Continuous Operation in Enterprise Environments

Servers running 24/7 require memory solutions that can maintain consistent performance under continuous load. The HMCG88MEBRA112N’s ECC Registered technology, dual-rank architecture, and advanced thermal and power management ensure operational stability for mission-critical workloads. Enterprises benefit from reduced downtime, minimized maintenance interventions, and enhanced system reliability, which is vital for cloud computing, AI processing, virtualization, and database operations.

Voltage Regulation

The PMIC embedded in the HMCG88MEBRA112N allows for independent power management on the DIMM itself, reducing the load on the motherboard and improving overall server efficiency. Accurate voltage control minimizes power fluctuations and enhances system reliability, ensuring consistent performance even under demanding workloads or heavy server utilization.

Thermal Stability for High-Density Servers

Reduced power consumption and efficient heat management contribute to improved thermal stability, allowing the module to operate safely under sustained workloads. This is critical for high-density servers, cloud environments, and HPC clusters where memory modules operate at high utilization for extended periods. Thermal stability minimizes the risk of memory-related errors and prolongs module lifespan.

Modern Server Platforms

The HMCG88MEBRA112N is compatible with a wide range of server platforms, supporting both single- and multi-socket configurations. Its 4800MT/s speed, dual-rank architecture, and ECC Registered functionality ensure it meets the requirements of enterprise servers, cloud infrastructures, AI workloads, and virtualization hosts. System administrators can deploy these modules to create flexible, high-performance server configurations capable of handling growing and evolving workloads.

Multi-Core CPU

Modern server CPUs feature many cores and threads, requiring high memory bandwidth to avoid bottlenecks. The HMCG88MEBRA112N provides fast, reliable access to memory for all CPU cores, improving multi-threaded performance. Applications such as database management, virtualization, AI inference, and real-time analytics benefit from reduced latency, higher throughput, and optimized memory utilization.

Cloud Workload Readiness

High-capacity ECC Registered modules like the HMCG88MEBRA112N are ideal for virtualization and cloud computing. They enable multiple virtual machines to run simultaneously without risk of memory-related failures. Dual-rank architecture ensures high VM density and consistent memory access, which is essential for enterprise cloud deployments, hosting platforms, and multi-tenant infrastructures.

Low Latency for Mission-Critical Applications

With DDR5-4800MT/s performance and CL40 timing, the HMCG88MEBRA112N offers low latency memory access for performance-sensitive workloads. This feature is particularly beneficial for high-frequency transaction processing, AI inferencing, real-time analytics, and large-scale simulations, where quick memory access directly impacts application responsiveness and system efficiency.

Data Throughput

The HMCG88MEBRA112N module provides a high data rate of PC5-38400, ensuring fast and reliable memory access for data-intensive workloads. DDR5’s increased burst length, improved prefetch mechanisms, and dual-rank design allow for larger amounts of data to be transferred per cycle, enhancing throughput and system responsiveness. High bandwidth and efficient data transfer are essential for AI model training, big data analytics, virtualization, and scientific simulations.

Improved Burst Length Data Transfers

DDR5 memory doubles the burst length compared to DDR4, enabling more data to be read or written per memory cycle. The HMCG88MEBRA112N takes advantage of this feature to improve memory transfer efficiency, reduce wait times, and enhance overall system performance. Applications handling large datasets, high-resolution graphics, or intensive computational simulations see improved speed and responsiveness.

Data-Intensive Workloads

The combination of high speed, dual-rank architecture, and ECC Registered functionality makes the HMCG88MEBRA112N ideal for workloads requiring large memory capacity and consistent reliability. Data-intensive environments such as AI processing, cloud computing, virtualization, and enterprise databases benefit from increased throughput, reduced latency, and improved operational stability.

Reliability and Longevity for Enterprise Servers

Continuous server operation requires memory modules that are highly reliable and durable. The HMCG88MEBRA112N’s ECC Registered design, combined with advanced DDR5 error correction and dual-rank architecture, ensures long-term operational stability. Its thermal and power efficiency features further enhance reliability, minimizing the risk of memory-related failures and maintenance interventions.

Extended Operational Stability

Reduced power consumption, onboard PMIC, and thermal management capabilities allow the module to maintain stable performance under prolonged workloads. This reliability is critical in data centers, cloud infrastructures, and HPC clusters where uptime and consistent memory performance are essential.

Scalability and Future-Proofing

The Hynix HMCG88MEBRA112N supports scalable memory configurations in modern server platforms. Its 32GB capacity, dual-rank design, and 4800MT/s DDR5 speed provide ample room for growth in memory-intensive applications. Organizations can populate multiple DIMM slots across one or more CPU sockets to build high-capacity servers capable of supporting large datasets, virtualization, AI workloads, and cloud computing environments. By deploying DDR5 ECC Registered modules, enterprises future-proof their infrastructure while ensuring long-term reliability, performance, and scalability.

High-Density Memory Configurations

With its dual-rank design and 32GB per module, the HMCG88MEBRA112N allows for high-density memory setups, ideal for virtualized servers, database hosts, and HPC clusters. Large memory pools enable efficient handling of concurrent workloads, AI model training, and real-time analytics without performance degradation.