HMCG88MEBRA173N Hynix 32GB Pc5-38400 4800Mt/s ECC Cl40 1.1v DDR5 SDram 288-Pin Memory Module.

Highlights of Hynix HMCG88MEBRA173N 32GB DDR5 RDIMM Ram

The Hynix HMCG88MEBRA173N is a High-Performance 32GB DDR5 RDIMM designed for modern servers and enterprise-grade computing. Featuring ECC (Error-Correcting Code) and a dual-rank configuration, this memory module provides reliable data integrity and superior performance for demanding applications.

General Information

• Manufacturer: Sk Hynix
• Part Number: HMCG88MEBRA173N
• Product Type: Server Memory Module
• Sub Type: 32GB DDR5 PC5-38400

Technical Specifications

• Storage Capacity: 32GB
• Memory Technology: DDR5 SDRAM
• Number of Modules: 1 x 32GB
• Memory Speed: DDR5 4800MT/s PC5-38400
• Error Correction: ECC
• Rank Configuration: Dual Rank (2Rx8)
• Registered: Yes
• CAS Latency: CL40
• Voltage: 1.1V

Physical Characteristics

• Form Factor: 288-Pin RDIMM
• Product Dimensions: 1.00" (height) x 6.75" (depth)
• Shipping Weight: 0.20 lb

Compatibility

• PowerEdge R650
• PowerEdge R650xs
• PowerEdge R750
• PowerEdge R750xa
• PowerEdge R750xd2
• PowerEdge R760
• PowerEdge R760xs
• PowerEdge R760xd2
• PowerEdge R770
• PowerEdge MX760c
• PowerEdge C6620
• PowerEdge HS5610
• PowerEdge HS5620
• PowerEdge T550

Overview of Hynix HMCG88MEBRA173N 32GB DDR5 4800MT/s

The Hynix HMCG88MEBRA173N 32GB DDR5 PC5-38400 4800MT/s ECC Cl40 1.1V SDRAM 288-Pin RDIMM Memory Module is a cutting-edge enterprise-grade memory solution designed for high-performance servers, data centers, and computing-intensive environments. Leveraging the advanced DDR5 architecture, this module offers high bandwidth, improved energy efficiency, and robust data integrity features. With a 32GB capacity, ECC capabilities, and RDIMM design, it ensures stable, reliable, and scalable performance for modern server workloads such as virtualization, AI computing, big data analytics, cloud services, and real-time transaction processing.

DDR5 Memory Architecture and Key Advantages

DDR5 memory represents the next generation of high-speed DRAM technology, providing significant enhancements over DDR4. With a peak data rate of PC5-38400 and operational speed of 4800MT/s, the HMCG88MEBRA173N delivers rapid data transfer, low latency, and higher memory throughput. DDR5 modules also integrate on-die ECC and optimized channel architectures, which collectively enhance reliability, stability, and efficiency. These features make DDR5 memory the ideal choice for enterprise servers and HPC platforms that require sustained high performance under demanding workloads.

Single-DIMM Performance with Dual-Rank Architecture

The dual-rank 2Rx8 configuration allows simultaneous access to two memory ranks, facilitating interleaved memory operations and improved overall system throughput. By efficiently distributing memory requests across the ranks, latency is minimized, and bandwidth utilization is maximized. Dual-rank modules like the HMCG88MEBRA173N are particularly advantageous in servers running multiple virtual machines or large-scale databases, where rapid and consistent memory access is crucial.

Data Access and Latency Reduction

Dual-rank architecture enhances memory access efficiency by interleaving requests between ranks, enabling faster response times and reduced bottlenecks. This design is essential for high-demand enterprise workloads, including virtualization clusters, AI model training, and analytics processing, where rapid memory access directly influences overall system performance. The combination of high frequency, low latency, and dual-rank efficiency ensures optimal data flow for both transactional and analytical workloads.

Enterprise and HPC Applications

Each HMCG88MEBRA173N module provides 32GB of high-speed memory, enabling deployment in high-density server configurations. Populating multiple DIMM slots across one or more CPU sockets allows data centers to achieve multi-terabyte memory capacities, crucial for virtualization clusters, HPC simulations, AI inferencing, and large database applications. High-capacity modules ensure that complex computations and large datasets can be handled efficiently without performance degradation.

ECC and RDIMM Features for Enhanced Reliability

Error-Correcting Code (ECC) technology is critical in enterprise memory modules, and the HMCG88MEBRA173N integrates both on-die and module-level ECC for superior error detection and correction. Single-bit errors are automatically corrected in real-time, while multi-bit errors are detected and reported, ensuring data integrity and system stability. Registered DIMM (RDIMM) architecture further enhances memory reliability by buffering control signals, minimizing electrical loading, and supporting larger memory configurations without compromising performance.

On-Die ECC and Module-Level Protection

DDR5 modules include on-die ECC at the chip level, providing an additional layer of internal error correction. This feature, combined with the module-level ECC Registered design, offers multi-tiered protection that ensures critical workloads remain stable even under sustained high processing loads. HMCG88MEBRA173N’s design mitigates risks associated with memory errors, making it ideal for mission-critical applications, such as financial systems, healthcare analytics, and large-scale cloud deployments.

Continuous Server Operation and Data Integrity

For servers running 24/7, reliable memory is essential. The HMCG88MEBRA173N supports continuous operation with minimal risk of memory-related system failures. Its ECC Registered design and high-speed DDR5 capabilities provide a dependable solution for enterprise servers, virtualization infrastructure, AI inference nodes, and cloud computing environments, ensuring data integrity and consistent performance.

Advanced Voltage Regulation and Stability

The integrated PMIC on the HMCG88MEBRA173N provides accurate voltage control, reducing motherboard power load and improving memory stability. Stable voltage delivery is essential for enterprise workloads where uninterrupted, high-speed memory access is critical. This feature ensures optimal performance even in multi-DIMM, high-density server configurations.

Thermal Stability for Continuous Operation

DDR5’s low-voltage design and efficient thermal management allow the HMCG88MEBRA173N to maintain stable performance during sustained heavy workloads. Reduced heat generation is especially important in dense server racks and HPC clusters, prolonging memory lifespan, reducing errors, and ensuring consistent reliability in high-performance environments.

Modern Enterprise Servers

The HMCG88MEBRA173N module is compatible with a wide range of server platforms, supporting both single- and multi-socket configurations. Its 32GB capacity, DDR5-4800 speed, ECC Registered architecture, and 288-pin RDIMM design make it ideal for high-performance servers, virtualization environments, AI workloads, cloud computing, and large-scale database systems. This compatibility ensures flexibility for IT administrators in designing optimized server configurations.

Multi-Core CPU

Modern enterprise CPUs feature multiple cores requiring high memory bandwidth to achieve optimal performance. The HMCG88MEBRA173N provides fast and consistent memory access to all cores, supporting multi-threaded workloads effectively. Applications including virtualization, AI inference, data analytics, and real-time transaction processing benefit from the module’s low latency and high throughput, ensuring smooth operations.

Low Latency for Performance-Sensitive Applications

With DDR5-4800MT/s speed and CAS latency of 40, the module offers rapid memory access suitable for high-frequency transactions, AI inference, real-time analytics, and scientific simulations. Low latency memory ensures critical enterprise applications remain responsive, enhancing overall system performance.

Data Throughput

The HMCG88MEBRA173N module delivers PC5-38400 bandwidth, ensuring high-speed data transfer and low-latency access for demanding applications. DDR5 enhancements such as longer burst lengths and efficient prefetch mechanisms allow more data to be transmitted per memory cycle, increasing effective bandwidth. This high throughput benefits AI, big data analytics, virtualization, and HPC workloads.

Burst Length and Data Handling

DDR5 modules double the burst length relative to DDR4, enabling HMCG88MEBRA173N to transfer larger amounts of data per memory cycle. This improvement reduces memory access overhead, resulting in faster and more efficient memory operations. High-throughput memory is crucial for enterprise workloads such as AI training, high-performance database operations, and large-scale simulations.

Enterprise and HPC Applications

Combining high-speed DDR5 performance, dual-rank architecture, and ECC Registered reliability, this module is perfectly suited for enterprise-grade and HPC workloads requiring large memory capacity, bandwidth, and operational stability. Virtualized environments, AI computing, big data analytics, and real-time database processing gain significant performance improvements from these features.

Reliability and Longevity

Enterprise memory demands consistent reliability under high-load conditions. HMCG88MEBRA173N provides multi-tiered ECC protection, dual-rank architecture, and DDR5 efficiency, enhancing memory stability and lifespan. Advanced thermal management and low-voltage operation further ensure long-term reliability and reduce maintenance requirements, making it suitable for 24/7 enterprise workloads.

Extended Stability for 24/7 Operations

This module maintains stable operation even during continuous high-demand workloads. ECC protection and dual-rank design prevent memory errors, minimize downtime, and ensure operational consistency for cloud providers, virtualized environments, and mission-critical enterprise servers.

Lower Failure Rates and Reduced

Advanced ECC and dual-rank design reduce the likelihood of memory failures, minimizing system disruptions and maintenance interventions. Reduced failure rates translate to lower operational costs while ensuring high server uptime and data integrity.

Scalability and Future-Ready Deployment

The HMCG88MEBRA173N supports scalable memory configurations, making it suitable for future-proof enterprise deployments. Its 32GB capacity, 4800MT/s speed, and RDIMM ECC design allow seamless scaling to meet virtualization, AI, cloud computing, and HPC requirements. Enterprises can expand memory capacity without compromising performance, ensuring long-term value and infrastructure reliability.

High-Density Server Configurations

Dual-rank 32GB modules enable high-density configurations in servers and data centers. This supports large-scale simulations, virtualized infrastructure, AI model training, and multi-tenant cloud operations while maintaining consistent performance and reliability.