HPE 704660-001 4-Ports Moonshot Uplink Module Kit.

HPE 704660-001 4-Ports Moonshot Quad SFP+ / QSFP+ Uplink Module Kit — category overview

The HPE 704660-001 4-Ports Moonshot Quad Small Form-factor Pluggable Plus Uplink Module Kit is a purpose-built network uplink module designed for HPE Moonshot systems. This category page description focuses on the product family, compatible subcomponents, deployment scenarios, and key technical and operational considerations for network architects, data center engineers, resellers, and IT managers. The content below breaks the module category into digestible subsections—architecture, performance, compatibility, cabling, management, installation, maintenance, troubleshooting, procurement guidance, and frequently asked questions—so you can quickly assess whether this uplink module kit meets your infrastructure requirements.

Product family and intended use

The HPE 704660-001 uplink module kit is part of the broader Moonshot ecosystem that targets high-density, energy-efficient server deployments. These uplink modules provide the essential high-speed interface between Moonshot cartridge chassis and upstream network fabrics—enabling high-throughput aggregation and low-latency connectivity for distributed compute workloads. Typical use cases include cloud edge nodes, web-scale hosting racks, virtualized infrastructure, high-performance computing (HPC) clusters, and telecommunications edge sites where compact size and optimized power consumption are crucial.

Core capabilities

• Four high-speed uplink ports supporting QSFP+/SFP+ form factors (vendor and SKU dependent).
• High aggregate throughput for multi-tenant and clustered workloads.
• Integration with HPE Moonshot chassis management and fabric blades.
• Hot-pluggable form factor for rapid serviceability and minimal downtime.
• Options for passive and active cabling, copper DACs, and fiber transceivers.

Technical specifications (what to expect)

While exact electrical and mechanical specifications can vary by sub-SKU or firmware revision, the HPE 704660-001 family generally provides:

• Port count: 4 uplink ports capable of quad-rate operation.
• Port type: QSFP+ (Quad SFP+) or SFP+ capable with breakout adapters where applicable.
• Throughput: Per-port rates up to 40 Gbps (QSFP+) aggregated to 160 Gbps theoretical maximum across all ports; SFP+ modes typically support 10 Gbps per link.
• Form factor: Hot-pluggable uplink module designed to fit Moonshot chassis slot layout with secure latch mechanism.
• Management: Integrates with chassis management controllers (e.g., HPE Onboard Administrator or Moonshot system management) for monitoring and firmware updates.
• Environmental: Designed to meet data center thermal profiles; operating temperature and shock/vibration specs align with HPE chassis ratings.

Compatibility and interoperability

Choosing the correct uplink module requires careful compatibility checking. The 704660-001 was engineered to work with specific HPE Moonshot chassis and cartridge types. Compatibility highlights:

• Certified for use in HPE Moonshot enclosures and fabric modules—ensure chassis firmware is updated to the recommended revision for full feature support.
• Compatible with a range of Moonshot compute cartridges (including x86, ARM, and accelerator cartridges) that rely on upstream QSFP+/SFP+ aggregation.
• Interoperates with mainstream Ethernet switches and fabrics when paired with appropriate transceivers and breakout cables—verify link negotiation settings and supported speeds.
• Third-party transceiver support may vary; for guaranteed interoperability and warranty compliance, prefer HPE-branded transceivers and cables where available.

Deployment scenarios and recommended architectures

The uplink module category supports several common deployment architectures. Below are recommended topologies and practical scenarios:

Leaf–spine data center topology

Use the HPE 704660-001 uplink ports to connect Moonshot chassis fabric modules to leaf switches in a leaf–spine topology. The module’s multi-port QSFP+ capability simplifies aggregation of multiple chassis to a single leaf switch and enables predictable east-west traffic patterns across the spine fabric.

Edge and micro data centers

In space-constrained edge sites, the compact Moonshot platform plus the quad uplink module provides an ideal balance of compute density and high-speed connectivity. Connect to aggregation switches or carrier edge routers using short-reach QSFP+ DACs or fiber transceivers optimized for the required distance.

High-performance parallel computing

For HPC or clustered workloads that demand low latency, aggregate multiple Moonshot chassis using low-latency QSFP+ links and ensure the switch fabric supports features like RDMA over Converged Ethernet (RoCE) if required by the application stack.

Cabling, transceivers, and breakout options

Selecting the correct cabling and optics is critical to achieving the expected throughput and reach.

Direct Attach Copper (DAC)

For short-distance connections inside racks or between adjacent racks (typically under 7 meters), passive or active QSFP+ DAC cables provide a cost-effective low-latency solution. DACs are plug-and-play but pay attention to power budget and heat dissipation when used in high-density arrangements.

Fiber transceivers and breakout cables

When longer reach is needed, move to QSFP+ optical transceivers (e.g., SR, LR variants) with appropriate single-mode or multi-mode fiber. Additionally, QSFP+ to 4× SFP+ breakout cables or fanouts allow you to connect to multiple 10 Gbps SFP+ ports on legacy switches while maintaining a single QSFP+ uplink on the Moonshot chassis.

Performance considerations

Real-world performance depends not only on the module’s raw port speed but also on system configuration, firmware, cabling, and the characteristics of attached switches. Consider these performance factors:

• Latency: QSFP+ passive copper provides the lowest latency but limited to short distances; optics add a few microseconds depending on the transceiver type.
• Throughput: Achieving near line-rate requires proper link aggregation (LACP) or multi-pathing (e.g., ECMP) on the network layer to distribute flows across multiple ports.
• Traffic patterns: East–west traffic (server-to-server inside the data center) benefits most from high aggregate uplink capacity; north–south (client to server) might be constrained by single uplink capacity if oversubscription is present.
• Oversubscription ratio: Design your uplink strategy based on expected compute-to-network ratios—avoid high oversubscription for latency-sensitive applications.

Security and compliance

Network hardware security is critical. The uplink module category includes features and practices to maintain a secure infrastructure posture:

• Access control: restrict physical and management plane access to prevent unauthorized configuration changes.
• Firmware integrity: validate firmware images using vendor-supplied cryptographic checksums when available.
• Network segmentation: place management traffic on isolated VLANs and enforce strict ACLs.
• Logging and audit trails: forward logs to secure SIEM systems for long-term retention and analysis.

Comparisons and alternatives

When evaluating the HPE 704660-001 uplink module family against alternatives, consider the following comparison vectors:

OEM vs. aftermarket options

OEM (HPE) modules and transceivers generally offer guaranteed compatibility, warranty coverage, and vetted firmware. Aftermarket or third-party parts may save cost but can introduce compatibility risk or void support contracts. Carefully balance total cost of ownership (TCO) against risk appetite.

QSFP+ vs SFP+ trade-offs

QSFP+ provides higher aggregated throughput and supports breakout to multiple 10 Gbps links, making it ideal for aggregation. SFP+ is beneficial for direct 10 Gbps connections or when connecting to legacy platforms. Choose based on downstream switch ports, existing cabling plant, and upgrade roadmaps.

Checklist for purchasing and procurement

Use this quick checklist when selecting an uplink module for Moonshot deployments:

• Confirm chassis model and firmware compatibility with the exact 704660-001 part number.
• Verify supported port modes (QSFP+, SFP+, breakout capability) and intended cabling options.
• Determine performance requirements—line-rate per-port and aggregate throughput for your workloads.
• Assess physical constraints—rack space, cable routing, and cooling impacts.
• Decide on optical vs. copper connectivity based on distance and budget.
• Plan for spares, warranty coverage, and RMA logistics.

Optimization tips

Maximize performance and reliability of your uplink module deployments with these best practices:

• Implement link aggregation (LACP) across multiple ports to increase redundancy and utilize full aggregate bandwidth.
• Use breakout cables judiciously to ensure that downstream switch ports are configured for the expected topology and speed.
• Monitor error counters and packet drop statistics to proactively detect failing transceivers or cabling issues.
• Route management traffic through dedicated interfaces to avoid interference with production data plane traffic.
• Document firmware baselines and test new firmware in a staging environment before production rollouts.

Environmental and physical planning

The physical environment impacts hardware longevity and throughput. Account for the following when planning deployments:

Thermal management

High-density Moonshot installations generate concentrated heat. Ensure raised-floor or overhead cooling systems provide sufficient intake and exhaust flow. Avoid running multiple high-power modules adjacent without verifying chassis thermal headroom.

Power considerations

While uplink modules themselves are not major power consumers compared to compute cartridges, the aggregate power profile of a fully-populated Moonshot chassis with active optics or DACs can influence power distribution designs. Plan for redundant power feeds where SLAs require high availability.

Sustainability, recycling, and end-of-life handling

Responsible recycling and disposal of network hardware are part of corporate sustainability programs. When decommissioning uplink modules:

• Follow local regulations for electronic waste disposal and hazardous materials handling.
• Work with certified e-waste recyclers or manufacturer take-back programs when available.
• Wipe or destroy any persistent configuration or logging data that might be stored on management appliances before disposal.