Samsung M391A4G43BB1-CWE 32GB 3200MBPS PC4-25600 DDR4 SDRAM Memory

Samsung M391A4G43BB1-CWE 32GB RAM

The Samsung M391A4G43BB1-CWE is a high-performance 32GB DDR4 SDRAM memory module designed to deliver exceptional speed and reliability for modern computing systems.

General Specifications

• Brand: Samsung
• Part Number: M391A4G43BB1-CWE
• Category: 32GB DDR4 SDRAM Memory Module

Technical Specifications

Core Features

• Storage Capacity: 32GB
• Memory Technology: DDR4 SDRAM
• Module Count: 1 x 32GB
• Bus Speed: 3200Mbps DDR4-3200 / PC4-25600

Performance Enhancements

• Data Integrity: ECC (Error-Correcting Code)
• Signal Processing: Unbuffered
• CAS Latency: CL22
• Rank Configuration: 2Rx8

Physical Characteristics

Form Factor

• Design: 288-pin UDIMM

Dimensions & Weight

Shipping Measurements

• Height: 1.00 inch
• Depth: 6.75 inches

Shipping Weight

• Weight: 0.20 lb

Key Advantages

• Reliable performance for enterprise and personal computing
• High-speed data transfer with 3200Mbps bus speed
• ECC support ensures error-free data integrity
• Durable design with compact UDIMM form factor

Compatibility & Usage

Ideal Applications

• Servers requiring stable memory modules
• Workstations handling heavy workloads
• High-performance desktops

Enterprise-Grade DDR4 ECC UDIMM Memory Category Overview

The Samsung M391A4G43BB1-CWE 32GB DDR4 ECC Unbuffered UDIMM memory module belongs to a professional-grade server and workstation memory category designed for environments where data integrity, electrical stability, and predictable performance are essential. This category focuses on ECC-enabled unbuffered DDR4 SDRAM modules operating at 3200Mbps under the PC4-25600 standard. These memory modules are engineered to support modern Intel Xeon and AMD EPYC platforms that require ECC UDIMM compatibility, offering a balance between enterprise reliability and cost-efficient deployment.

ECC Unbuffered DDR4 memory represents a specialized subcategory within the broader DDR4 memory ecosystem. Unlike standard desktop memory, ECC UDIMM modules integrate error-correcting code logic to detect and correct single-bit memory errors in real time. This functionality is vital for business-critical systems that must maintain uptime and protect data accuracy, especially in server workloads, virtualization platforms, edge computing nodes, and professional workstations.

Samsung Original DDR4 Memory Manufacturing Standards

Samsung is globally recognized as one of the leading manufacturers of DRAM technology, and this category of memory modules benefits directly from Samsung’s vertically integrated semiconductor production. The M391A4G43BB1-CWE is built using original Samsung DRAM chips, firmware, and PCB design, ensuring strict adherence to JEDEC standards. This manufacturing consistency results in superior signal integrity, stable voltage regulation, and long-term reliability across continuous operation cycles.

Memory modules in this category undergo rigorous validation and testing processes to meet enterprise-level expectations. These include thermal stress testing, voltage tolerance checks, and compatibility verification with a wide range of server and workstation motherboards. Such validation ensures that the module performs consistently at its rated 3200Mbps speed while maintaining CL22 latency under sustained workloads.

DDR4 PC4-25600 Detailed Characteristics

The PC4-25600 specification denotes a theoretical maximum bandwidth of 25.6GB/s per module, positioning this memory category among the fastest DDR4 solutions available for ECC UDIMM platforms. Operating at 3200Mbps, this memory enables faster data access, reduced bottlenecks, and improved overall system responsiveness when compared to earlier DDR4 generations such as PC4-21300 or PC4-24000.

High memory bandwidth is particularly beneficial in multi-threaded server environments, data analytics workloads, virtualization hosts, and professional applications such as 3D rendering, simulation, and software development. Systems equipped with DDR4-3200 ECC UDIMM memory can process larger datasets more efficiently while maintaining data accuracy through ECC functionality.

CAS Latency and Timing Optimization

This category of memory operates with a CAS latency rating of CL22, which is optimized for stability and compatibility rather than aggressive overclocking. CL22 timing ensures reliable data access cycles while maintaining compliance with JEDEC specifications. In enterprise environments, consistent timing behavior is preferred over marginal performance gains, as it minimizes the risk of memory-related errors or system instability.

By balancing frequency and latency, DDR4-3200 CL22 ECC UDIMM modules deliver dependable performance across a wide range of workloads. This makes them suitable for always-on systems where reliability and predictability are paramount.

ECC Error Correction Technology

Error-correcting code technology is a defining characteristic of this memory category. ECC functionality enables the detection and correction of single-bit memory errors and the detection of multi-bit errors. This capability significantly reduces the risk of data corruption, system crashes, and silent data errors that can occur during intensive computing tasks.

ECC memory is essential in environments handling financial data, scientific research, healthcare records, and enterprise databases. The Samsung M391A4G43BB1-CWE and similar modules in this category provide peace of mind by ensuring data integrity even under high thermal or electrical stress conditions.

Impact of ECC on System Stability

Systems equipped with ECC UDIMM memory experience improved stability, especially during prolonged uptime. ECC actively monitors memory transactions and corrects errors before they propagate into applications or operating systems. This proactive correction reduces downtime, minimizes troubleshooting efforts, and enhances overall system reliability.

For IT administrators and system integrators, ECC memory simplifies maintenance by reducing the likelihood of memory-related failures. This is particularly valuable in remote deployments, edge servers, and small business servers where physical access may be limited.

Unbuffered UDIMM Architecture

The unbuffered DIMM architecture differentiates this memory category from registered or load-reduced DIMMs. UDIMM modules connect directly to the memory controller without intermediate buffering, resulting in lower latency and reduced complexity. ECC UDIMM memory is commonly supported by entry-level to mid-range servers and professional workstations.

This architecture makes ECC UDIMM modules ideal for systems that require ECC functionality but do not need the higher capacity scaling of RDIMM or LRDIMM solutions. As a result, ECC UDIMM memory offers a cost-effective path to enterprise reliability for smaller server configurations.

2Rx8 Dual-Rank Memory Design

The 2Rx8 configuration indicates a dual-rank memory layout with x8 DRAM chips. Dual-rank designs can improve memory throughput by allowing the memory controller to interleave access between ranks. This results in better utilization of available bandwidth, especially in multi-core processors.

Memory modules with a 2Rx8 layout are widely compatible with server and workstation platforms that support ECC UDIMM memory. This design contributes to stable performance and efficient memory access patterns under concurrent workloads.

Voltage Efficiency and Thermal Characteristics

Operating at a nominal voltage of 1.2V, DDR4 ECC UDIMM memory delivers improved power efficiency compared to older DDR3 technologies. Lower operating voltage reduces overall system power consumption and heat generation, which is critical in dense server environments and compact workstation builds.

Efficient thermal behavior extends the lifespan of memory modules and adjacent components. By maintaining stable operating temperatures, DDR4-3200 ECC UDIMM memory supports continuous operation without performance degradation.

Thermal Reliability in Continuous Workloads

This memory category is engineered to withstand continuous workloads typical of server and workstation usage. Advanced PCB layouts and high-quality DRAM chips contribute to consistent thermal performance. This reliability is essential for systems running virtualization platforms, database servers, or compute-intensive applications around the clock.

288-Pin DDR4 UDIMM Form Factor

The 288-pin UDIMM form factor ensures compatibility with modern DDR4 motherboard slots. This standardized physical interface simplifies installation and replacement, making it easy for system builders and IT professionals to upgrade or maintain memory configurations.

Memory modules in this category are designed to fit standard ATX, micro-ATX, and server-grade motherboard layouts that support ECC UDIMM memory. The physical design ensures secure seating and reliable electrical contact throughout the module’s operational lifespan.

Compatibility with Server and Workstation Platforms

DDR4 ECC UDIMM memory is widely supported by Intel Xeon E-series processors and select AMD Ryzen Pro and EPYC platforms that enable ECC functionality. Compatibility depends on motherboard chipset support, making it essential to verify ECC UDIMM compatibility before deployment.

This category of memory is commonly used in small business servers, departmental servers, network appliances, and professional workstations that prioritize data integrity and stability.

Use Cases and Deployment Scenarios

The Samsung M391A4G43BB1-CWE memory module category is suited for a variety of enterprise and professional applications. These include file servers, application servers, virtualization hosts, and edge computing systems where reliability and performance must coexist.

Professional workstations used for CAD, video editing, scientific modeling, and software development also benefit from ECC UDIMM memory. The ability to correct memory errors ensures accurate computations and reduces the risk of project data corruption.

Virtualization and Cloud Infrastructure

In virtualization environments, memory reliability directly impacts virtual machine stability. ECC UDIMM memory helps prevent crashes and data loss by correcting memory errors that could otherwise disrupt multiple virtual machines simultaneously.

Small-scale cloud infrastructure deployments often rely on ECC UDIMM memory to balance performance, cost, and reliability. This makes the category an attractive choice for managed service providers and private cloud operators.

Scalability and Future-Proofing

While DDR5 is emerging in newer platforms, DDR4 ECC UDIMM memory remains a vital category for existing and newly deployed systems that require proven stability. The 32GB module capacity enables scalable memory configurations, allowing systems to expand as workload demands grow.

By deploying high-capacity ECC UDIMM modules, organizations can maximize memory density within supported limits, extending the usable life of their hardware investments.