PK8072006417800 Intel Xeon 6745P 32 Core 3.1 GHz 336MB Cache FCLGA4710 300w Processor

Intel PK8072006417800 Xeon 6745P Processor

Core Specifications and Performance Metrics

The Intel PK8072006417800 Xeon Platinum 6745P processor leverages the advanced Ice Lake SP microarchitecture, representing a significant leap in data center processing technology. Built on Intel's enhanced 10nm+ SuperFin process technology, this architecture delivers improved performance per watt and enhanced computational density. The 32-core configuration operates at a base frequency of 3.1 GHz, providing substantial processing power for demanding workloads. The architecture features redesigned execution units, improved branch prediction, and enhanced prefetching algorithms that collectively contribute to higher instruction-level parallelism and better overall throughput.

Multi-Level Cache Architecture

The Intel PK8072006417800 Xeon Platinum 6745P implements a sophisticated multi-level cache hierarchy designed to maximize data locality and minimize memory access latency. Each core features 32KB of L1 instruction cache and 48KB of L1 data cache, providing low-latency access to critical instructions and data. The 1.25MB private L2 cache per core aggregates to 40MB of total L2 cache across all 32 cores. The shared 336MB L3 cache operates as an inclusive cache, maintaining coherence across all cores while serving as the primary resource for inter-core data sharing and prefetching operations.

Intel Smart Cache Technology

Intel Smart Cache technology dynamically allocates shared L3 cache resources based on workload demands and core utilization patterns. The cache implements advanced replacement policies and prefetching algorithms that anticipate data access patterns, reducing cache miss rates for sequential and random access patterns. The inclusive nature of the L3 cache simplifies cache coherence protocols while ensuring that frequently accessed data remains available to all cores. The cache subsystem supports multiple voltage and frequency domains, allowing portions of the cache to operate at optimal power-performance points based on active core count and workload characteristics.

Memory Controller and Interconnect Technology

DDR4 Memory

The integrated memory controller in the Xeon Platinum 6745P supports eight channels of DDR4 memory with official support for speeds up to 3200 MT/s. The memory controller implements advanced scheduling algorithms that optimize command sequencing across memory channels, reducing bank conflicts and maximizing memory bandwidth utilization. Each memory channel can support up to two DIMMs, with support for 3DS (3D Stacked) DIMMs that enable higher capacity memory configurations. The memory controller includes sophisticated error correction circuitry that implements single device data correction (SDDC) for x4 and x8 DRAM devices, providing enhanced reliability for mission-critical applications.

Memory Bandwidth and Latency Optimization

With eight memory channels operating at 3200 MT/s, the processor delivers peak memory bandwidth exceeding 204 GB/s. The memory controller implements multiple low-power states that dynamically adjust based on memory traffic patterns, reducing power consumption during periods of low memory utilization. Advanced memory prefetchers monitor access patterns across all cores and proactively move data closer to the requesting cores, effectively hiding memory latency for streaming and random access workloads. The memory controller also supports memory mirroring, sparing, and patrol scrubbing features that enhance system reliability and data integrity.

UPI Interconnect Technology

The Intel PK8072006417800 Xeon Platinum 6745P features three Ultra Path Interconnect (UPI) links operating at 24.0 GT/s, providing high-bandwidth, low-latency communication between processors in multi-socket configurations. Each UPI link provides approximately 16 GB/s of bidirectional bandwidth, with all three links aggregating to 48 GB/s of total interconnect bandwidth. The UPI protocol implements a layered architecture with physical, link, and protocol layers that ensure reliable packet delivery while minimizing protocol overhead. The interconnect supports multiple power management states that dynamically scale link speed and width based on inter-socket communication demands.

Coherence Domain Management

The UPI interconnect maintains cache coherence across all sockets in a multi-processor system using a directory-based coherence protocol. Each processor maintains a distributed directory that tracks the sharing status of cache lines across the entire system. The coherence protocol minimizes inter-socket traffic by employing sophisticated prediction mechanisms that anticipate sharing patterns. The interconnect implements multiple virtual networks that separate coherence, I/O, and non-coherent traffic, preventing protocol deadlocks while ensuring quality of service for different traffic classes. The three UPI links provide redundant paths between sockets, enhancing reliability and enabling load balancing across available links.

FCLGA4710 Socket Interface

The Intel PK8072006417800 Xeon Platinum 6745P processor utilizes the FCLGA4710 socket interface, featuring 4710 lands that provide mechanical attachment and electrical connectivity to the motherboard. The land grid array design ensures reliable electrical contact through controlled compression between the processor lands and socket contacts. The socket mechanism incorporates a independent loading mechanism (ILM) that applies uniform pressure across the processor package, maintaining reliable electrical connections under varying thermal and mechanical stress conditions. The socket supports processors with thermal design power (TDP) up to 300W, with robust power delivery capabilities to support peak current demands during turbo frequency operation.

Power Delivery Infrastructure

The FCLGA4710 socket interfaces with the motherboard's voltage regulation module (VRM) through dedicated power, ground, and sense lands. The processor requires multiple voltage domains including VCC (core voltage), VCCIN (input voltage), VCCIO (I/O voltage), and VDDQ (memory interface voltage). The socket provides 187 VCC lands and 187 VSS lands to support the processor's 300W TDP, with additional lands dedicated to memory and UPI interfaces. The power delivery infrastructure must support rapid voltage transitions to facilitate frequency scaling during turbo boost operations, requiring high-quality power delivery components on compatible motherboards.

Power Management Features

The processor implements sophisticated power management capabilities including multiple package power states (PC-states), core power states (C-states), and performance states (P-states). The hardware-controlled power management (HWPM) feature autonomously transitions cores and uncore components between power states based on workload demands, optimizing power consumption without OS intervention. The running average power limit (RAPL) interface allows software to enforce power caps at the package, power plane, and domain levels, enabling data center operators to manage power consumption within rack-level and data center-level power budgets. These features work collectively to maintain performance while adhering to the 300W TDP envelope.

Performance Features and Acceleration Technologies

Intel Advanced Vector Extensions

The Intel PK8072006417800 Xeon Platinum 6745P features comprehensive AVX-512 support, including Foundation, Conflict Detection, Exponential and Reciprocal, and Byte and Word Instructions extensions. Each core contains two 512-bit FMA (fused multiply-add) units capable of executing 32 double-precision or 64 single-precision floating-point operations per clock cycle. The AVX-512 implementation includes register banking and instruction masking features that enhance performance for conditional operations and data-dependent computations. The vector processing units operate at a separate voltage and frequency domain from the scalar cores, allowing sustained AVX-512 performance without compromising scalar workload performance.

Workload Optimization

AVX-512 acceleration provides significant performance benefits for scientific simulations, financial analytics, artificial intelligence inference, and media processing workloads. The extended vector registers and sophisticated masking capabilities enable more efficient implementation of complex algorithms including matrix multiplication, convolution operations, and cryptographic functions. The processor includes dedicated hardware for AVX-512 frequency management that monitors thermal and power conditions to determine optimal operating frequency for vector workloads. This ensures consistent performance delivery while maintaining operation within the processor's thermal and electrical specifications.

Cryptographic Acceleration

Integrated cryptographic acceleration features include Intel AES-NI (Advanced Encryption Standard New Instructions), providing hardware acceleration for AES encryption and decryption operations. The processor also includes carry-less multiplication instructions (PCLMULQDQ) that accelerate Galois Field arithmetic used in cryptographic hash functions. For public-key cryptography, the processor implements Intel AVX-512 IFMA (Integer Fused Multiply-Add) instructions that accelerate large integer arithmetic operations common in RSA and ECC cryptographic algorithms. These hardware accelerators provide significant performance improvements for TLS/SSL termination, database encryption, and blockchain applications while reducing vulnerability to side-channel attacks.

Platform RAS Features

The processor supports extensive Reliability, Availability, and Serviceability (RAS) features including memory mirroring, memory sparing, and PCI Express hot-plug capabilities. Memory mirroring maintains duplicate copies of data in separate memory channels, providing continuous operation in the event of single-channel failures. Memory sparing reserves memory capacity that can be activated automatically when faulty memory regions are detected. The system address decoder includes remapping capabilities that can isolate faulty memory pages while maintaining system operation. These features collectively maximize system uptime and data integrity in mission-critical deployment scenarios.

PCI Express Controller

The integrated PCI Express 4.0 controller provides 64 lanes of high-speed I/O connectivity with raw data rate of 16.0 GT/s per lane. The PCIe controller supports x16, x8, x4, and x1 lane configurations, enabling flexible connection to various peripheral devices including GPUs, network adapters, and storage controllers. The controller implements separate voltage and clock domains for each PCIe port, allowing independent power management and link state transitions. The physical layer incorporates sophisticated equalization techniques including continuous time linear equalization (CTLE), decision feedback equalization (DFE), and transmitter pre-emphasis that maintain signal integrity at PCIe 4.0 data rates across typical server board routing.

Enterprise I/O Expansion

The processor interfaces with the Intel C620 series platform controller hub (PCH) through Direct Media Interface (DMI) 3.0, providing four lanes of PCIe 3.0 equivalent bandwidth for chipset connectivity. The PCH provides additional I/O capabilities including SATA 3.0 ports, USB 3.0 controllers, integrated LAN, and legacy device support. The chipset includes integrated manageability features through Intel Active Management Technology (AMT) that enable out-of-band management regardless of operating system state. The platform supports firmware resilience features including redundant BIOS and firmware rollback capabilities that enhance system availability and simplify maintenance operations.