Intel SRV5R Xeon 6730p 32-Core 2.50GHz 288MB Cache 24Gt/s Upi Speed Socket Fclga4710 250W Processor.

Product Overview Of Intel Xeon 6730p Processor

General Information :

Key Features of the Intel 6730p CPU

• Advanced Processing Architecture: 32-core design for superior multitasking and workload handling
• Exceptional Speed: Base clock of 2.50GHz with a turbo boost up to 3.80GHz
• Cutting-Edge Lithography: Built on Intel 3 technology for enhanced efficiency

Technical Specifications

Performance & Efficiency

• Ultra-Path Interconnect (UPI): 24GT/s transfer rate with 4 high-speed links
• Thermal Design Power (TDP): Optimized at 250W for balanced power consumption
• Socket Compatibility: Designed for FCLGA4710 motherboards

Instruction Set & Extensions

• 64-bit instruction set for modern computing demands
• Supports Intel AMX, SSE4.2, AVX, AVX2, and AVX-512 for accelerated workloads

Memory & Cache Details

Cache Configuration

• L3 Smart Cache: Massive 288MB for reduced latency and faster data access

Memory Capabilities

• Maximum Capacity: Supports up to 4TB of DDR5 RAM
• High-Speed DDR5: Runs at 6400MT/s for rapid data processing
• Multi-Channel Support: 8 memory channels for increased bandwidth
• ECC Support: Error-correcting code memory for enhanced reliability

Optimized for Data-Intensive Workloads

• Ideal for cloud computing, AI, and enterprise server applications
• Designed for scalability in high-demand environments

Core Microarchitecture Overview

The Intel SRV5R Xeon 6730P 32‑Core 2.50 GHz processor belongs to Intel’s breakthrough Sapphire Rapids portfolio, engineered on the refined Intel 7 process technology to deliver massive instruction‑per‑clock throughput, ultra‑low latency cache access, and a balanced pipeline that keeps all execution units saturated even under relentless mixed workloads. Thirty‑two high‑performance cores—each equipped with dual 512‑bit vector units—operate in symmetrical, non‑clustered mode, allowing every core to leverage full‑speed access to the expansive 288 MB smart cache without NUMA penalties. By leveraging an all‑new mesh interconnect and deeper branch prediction buffers, the SRV5R maintains a stable 2.50 GHz base frequency while opportunistically boosting under Intel® Turbo Boost Max 3.0 when thermal headroom permits, sustaining bursts well above base for latency‑sensitive operations. The result is deterministic quality of service for real‑time analytics, high‑frequency trading, and software‑defined networking deployments where microsecond jitter directly affects revenue.

Sapphire Rapids Compute Tile Design

The processor’s compute substrate is divided into four closely coupled tiles, each with eight Golden Cove performance cores that share a segment of the 288 MB LLC but maintain private L2 slices of 2 MB per core. This design minimizes cross‑tile traffic while preserving system‑wide coherence through Intel® UPI 2.0 links operating at 24 GT/s for two‑socket topologies. Compared with Cascade Lake, latency to the furthest cache segment is reduced by up to 30 percent, according to Intel’s internal telemetry, ensuring that large in‑memory databases like SAP HANA or Oracle In‑Memory experience fewer last‑level cache misses even in worst‑case scan scenarios. Enhanced prefetch algorithms intelligently promote hot lines, further slimming DRAM calls and saving overall platform power—all critical when operating at a 250 W TDP envelope inside 1U or 2U chassis.

Intel® Hyper‑Threading & Asymmetric Boost

Every physical core presents two logical threads through Hyper‑Threading, enabling the Xeon 6730P CPU to host up to sixty‑four concurrent software threads. Unlike prior asymmetric boost designs that penalized sibling threads, Sapphire Rapids includes a refined priority scheduler that allows one thread to opportunistically claim larger slices of key execution resources during single‑thread peaks while preventing starvation of its sibling during I/O waits. For cloud service providers consolidating containerized microservices, this translates into higher per‑vCPU sustained throughput with improved tail latency, meaning more paying tenants per node without expensive over‑provisioning.

Branch Predictor Enhancements

A triple‑layer branch prediction stack—featuring a micro‑BTB, a 4 K‑entry mid‑level BTB, and a 64 K‑entry last‑level BTB—mitigates pipeline flushes even in complex if‑then‑else logic and looped cryptographic operations. For AI inference workloads compiled with Intel® oneAPI, the predictor feeds AVX‑512 and AMX tensor paths at near‑perfect accuracy, ensuring convolution layers remain saturated and maximizing TOPS/Watt.

Cache Hierarchy & Memory Architecture

At the heart of the SRV5R Xeon 6730P lies its 288 MB of smart cache—massive by any metric in 2025. Comprised of up to 112.5 MB shared LLC, 64 MB on‑package eDRAM acting as L4, and 112 MB aggregate L2, this structure drastically shrinks average memory access latency. Server‑class data marts running click‑house engines see 2× faster group‑by operations compared with earlier Ice Lake SP models because hot columns are entirely resident on‑package. Complementing the cache is an eight‑channel DDR5‑4800/5600 ECC memory interface boasting more than 460 GB/s theoretical bandwidth in one‑DIMM‑per‑channel mode, ensuring streaming analytics pipelines never starve the vector engines. Proprietary double‑clutch write buffers minimise row‑hammer risk, maintaining enterprise‑grade data integrity.

Intel® Optane™ Persistent Memory 300‑series Support

Although many Sapphire Rapids SKUs focus solely on traditional DRAM, the 6730P introduces native support for Intel® Optane™ PMem 300 via Memory Controller 2, enabling tiered memory pools where cold datasets live in byte‑addressable persistent modules. Database administrators can mount terabytes of PMem in App Direct mode, mapping frequently updated rows to DRAM while large read‑mostly fact tables occupy the persistent tier, thereby cutting licensing costs on per‑GB RAM metrics and shrinking snapshot backup windows dramatically.

Memory Encryption & Integrity

Intel® TME‑Multi‑Key (Total Memory Encryption) encrypts each DIMM channel with individual AES‑XTS 128‑bit keys, nullifying cold boot attacks or malicious DIMM swaps. Combined with Intel® Platform Firmware Resilience (PFR) 3.0, the entire firmware chain—including M‑Code and CSME—enjoys hardware‑rooted attestation, a fundamental requirement for Government Cloud and PCI DSS 4.0 compliance.

Channel Calibration & Extended RAS

Adaptive voltage training calibrates signal integrity across the full 0–85 °C operational envelope, auto‑tuning on every warm boot. Should channel degradation be detected (e.g., due to oxidized DIMM pads), sparing logic automatically maps out failing nibble lanes and alerts ITSM dashboards via PECI, all without halting service. Such fine‑grained RAS features underpin “five nines” SLAs demanded by Tier‑1 telecom operators.

Advanced Acceleration Technologies

Where previous generations provided optional acceleration, the SRV5R Xeon 6730P bakes specialized engines directly onto the die, eliminating PCIe latency overhead. Intel® AMX (Advanced Matrix Extensions) integrates 2048‑bit tile registers accelerating INT8, BF16, and FP16 GEMM operations with superior sparsity support, thrusting in‑socket AI inference to 2.5× the performance of the Ice Lake‑based 8380 at comparable power. Complementing AMX, Intel® DSA (Acceleration Engines for Data Streaming) offloads memory copy, scatter‑gather, and cryptographic hash tasks, freeing CPU cycles for higher‑value application execution. Intel® QAT 1.7 hardware accelerates TLS 1.3 and IPSec, delivering up to 400 Gb/s line‑rate encryption—vital for 5G Core user‑plane function (UPF) deployments.

PCIe 5.0 & CXL 2.0 Connectivity

Forty‑eight lanes of PCIe 5.0—from the CPU package itself—provide almost 256 GB/s aggregate duplex bandwidth, lowering latency to NVMe Gen5 SSD arrays and RDMA‑capable 400 GbE NICs. Support for CXL 2.0 Type‑3 devices empowers architects to attach pooled memory expanders, GPU‑class accelerators, or EDSFF E3.S computational storage with coherency at the host’s native cacheline granularity, enabling dynamic composable infrastructure in hyperscale data centers. In practice, a dual‑6730P node can orchestrate petabytes of tier‑2 memory behind fabric‑attached CXL switches, drastically improving peak ML training throughput without inflating host DRAM budgets.

Intel® IAA & IAX Details

Integrated Analytics Accelerator (IAA) and In‑Memory Analytics Accelerator (IAX) each furnish dedicated pipelines for Huffman‑based compression, decompression, and JSON vector transformations, accelerating Apache Parquet decode and ClickHouse group aggregation by up to 4× in Intel‑optimized benchmarks. Because these engines present as MMIO‑mapped queues rather than discrete PCIe BDF devices, the SRV5R Xeon 6730P avoids typical NUMA mapping headaches, ensuring predictably low p99 latency.

Software Ecosystem & oneAPI Libraries

Intel invests heavily in open‑source frameworks: the latest oneAPI DPC++/C++ compiler, Intel® AMX‑enabled oneDNN, and the Vtune Profiler provide turnkey optimization pathways. Pre‑tuned Docker images for TensorFlow, PyTorch, and Apache Spark 3.x leverage AMX kernels automatically when the host exposes CPUID. This synergy between hardware and software slashes time‑to‑deployment, letting DevOps grip‑and‑run AI pipelines without recompiling the whole stack.

Virtualization & Cloud‑Native Scalability

With sixty‑four logical processors and 4 MB of L2 cache per two hThreads, the SRV5R Xeon 6730P effortlessly hosts sprawling Kubernetes clusters atop KVM or VMware® ESXi 8.x. Intel® VT‑d (Second‑Generation SR‑IOV) offers single‑root functionality per PCIe 5.0 device, slicing high‑bandwidth adapters into dozens of secure virtual functions. Live migration times are trimmed by Intel® Flex Migration, which harnesses UPI bandwidth to copy memory pages in parallel across multiple links, completing workload relocations in seconds, not minutes.

Cloud‑Optimized Power Governance

Intel® Software Defined Power Management (SDPM) for Xeon 6730P exposes RESTful APIs that allow orchestration layers to fine‑tune per‑core P‑states and C‑states based on real‑time telemetry. A typical autoscaling algorithm can now throttle underutilized cores down to 800 MHz sub‑5 W draw, reserving thermal budget for bursty microservices while keeping the overall 250 W TDP in check. For hosting providers subject to carbon‑aware scheduling, energy‑proportional compute becomes a reality.

Nested Virtualization & Confidential VMs

In a multi‑tenant environment, nested virtualization is commonplace. The SRV5R Xeon 6730P implements VMCS shadowing and EPT PML optimizations that slash nested VM exit overhead. Coupled with Intel® SGX 2.0 and Intel® TDX, service providers can offer confidential computing enclaves where guest memory is cryptographically isolated from the hypervisor, satisfying sovereign cloud mandates and broadening addressable market segments.

Edge Cloud Use‑Case Spotlight

Deploying private 5G MEC nodes at the network edge demands a tight footprint and high packet processing throughput. A single Xeon 6730P with Intel® FlexRAN software stack and integrated vRAN accelerators achieves greater than 20 Gb/s Layer‑1 performance within 1U, enabling cost‑effective cell site densification. Field trials show 30 percent improved spectral efficiency when scheduling algorithms run directly on the CPU, eliminating roundtrips to discrete accelerators.

Security, RAS & Compliance Features

Security is woven into every layer of the SRV5R Xeon 6730P. Intel® Control‑flow Enforcement Technology (CET) thwarts ROP/JOP attacks via indirect branch tracking. Intel® Key Locker abstracts AES keys away from software, storing them inside unique micro‑fused registers unobservable by DMA snooping. Built‑in Intel® Boot Guard and Intel® PFR 3.0 enforce cryptographic signatures on firmware, blocking malicious firmware flashes. Even in the unlikely event of degradation, Intel® Machine Check Architecture Recovery (MCA R) identifies uncorrectable errors and intelligently freezes only the affected core domain, keeping the rest of the system online while IT operators hot‑patch or migrate workloads.

PCI‑SIG Compliance & FIPS Validation

The 6730P’s integrated root complex passes PCI‑SIG 6.0 electrical compliance, ensuring stable signal integrity at 32 GT/s per lane even on long x16 traces. Intel’s QAT crypto accelerators have been validated under FIPS 140‑3 Level 1, simplifying audit preparation for FedRAMP, CJIS, and HIPAA hosting environments.

Secure Attestation & Zero‑Trust Readiness

Each CPU includes a unique Intel® Secure Device Identifier (SDI) burned at manufacturing. When combined with Intel® Trust Authority services, enterprises can programmatically attest that a given virtual machine is running on genuine Xeon 6730P silicon with the expected microcode—forming the cornerstone of zero‑trust computing and preventing supply‑chain implants.

Data‑in‑Use Protection with SGX 2.0

SGX 2.0 extends enclave page cache to 1 TB, paving the way for confidential data lakes hosted entirely in‑enclave. For example, a global bank can index PII‑rich transaction data inside SGX enclaves and run machine learning risk models without exposing raw data to infrastructure administrators, meeting stringent GDPR Article 32 requirements without resorting to homomorphic encryption overhead.

Energy Efficiency & Thermal Management

Operating at 250 W, the SRV5R Xeon 6730P may appear power‑hungry, yet its performance‑per‑watt eclipses earlier generations due to a raft of efficiency features. Intel® Hardware‑Controlled P‑states (HWP) dynamically adapts frequency voltage curves per core according to silicon LOT characterization, maintaining optimal V‑f margins. Enhanced C1E states kick in during micro‑idle windows, trimming idle package power under 24 W, essential for achieving Power Usage Effectiveness (PUE) targets in hyperscale facilities. The CPU’s thermal monitoring diode aligns with motherboard VRM telemetry via PECI 4.0, enabling fan curves that reduce acoustic footprint by up to 7 dBA in dense racks.

Cooling Solutions & Best Practices

To extract maximum sustained turbo from the 250 W envelope, Intel recommends high‑density fin heat sinks with vapor chamber bases, paired with dual counter‑rotating 60 mm fans or liquid‑cool plates rated for 350 W. Proper TIM application—particularly the must‑use Intel® Indium solder for socket FCLGA4710—lowers ΔT junction‑ambient, maintaining boost clocks for longer. System integrators adopting direct‑to‑chip liquid cooling should integrate leak detection sensors connected to the BMC and leverage the Xeon’s thermal trip throttling to avoid catastrophic shutdowns.

Power Management APIs for DevOps

Through Intel® Node Manager 4.0, the CPU exposes real‑time power draw, P‑state bins, and package C‑state residency via Redfish APIs, letting orchestration software schedule high‑power AI pipelines to nodes with headroom while shifting low‑priority batch jobs to less‑loaded servers. This granular telemetry is indispensable for datacenters participating in demand‑response grid programs or receiving carbon credit incentives for load shaping.

Environmental Sustainability Considerations

With sustainability now a core procurement KPI, the Xeon 6730P’s right‑sized BOM—free of cobalt in the substrate and using halogen‑free FR4 laminates—reduces hazardous waste. End‑of‑life recycling programs support responsible disposal, and firmware features such as Intel® Efficient LLM allow administrators to audit idle power consumption, contributing to corporate ESG reporting frameworks like CDP Climate and GRI 306.

Platform Compatibility & Ecosystem

The SRV5R Xeon 6730P installs into the LGA4710 socket using Intel’s standard independent‑loading mechanism. OEM boards based on the Intel® C741 or W790P chipset unlock advanced features such as additional PCIe 5.0 bifurcation slots, up to 16 SATA 3.x ports, and multi‑Gbit out‑of‑band management via AST2600 BMCs. Firmware flashing through Intel® F‑Tool ensures microcode and ME firmware align with Debian, Ubuntu LTS, Red Hat Enterprise Linux 9, VMware ESXi 8.0 U3, and Windows Server 2025, guaranteeing out‑of‑box support for all mainstream hypervisors and bare‑metal workloads.

Upgrade Path & Cross‑Gen Interoperability

While the physical socket changed from LGA4189 to LGA4710 between Ice Lake and Sapphire Rapids, many cooling solutions remain compatible via adapter frames. DDR5 replaces DDR4, yet C741 motherboards often ship with DIMM slot color coding to prevent insertion errors. Intel’s UPI link operates at 24 GT/s on the 6730P but gracefully downshifts to 16 GT/s if paired with entry‑level 64‑lane Q‑series Xeons in mixed configurations, facilitating phased upgrade rollouts without forklift replacements.

Operating System Optimization Guides

Intel publishes per‑OS performance tuning guides—covering tuned‑adm profiles on RHEL, numactl binding examples on Debian, and sysfs frequency governor adjustments on Ubuntu—that empower sysadmins to capture near‑silicon‑limit performance with minimal effort. BIOS settings such as Sub‑Numa Clustering (SNC) and One Tile per Cluster are documented with workload matrices, steering admins toward the optimal topology for database sharding versus HPC MPI jobs.

Certification & Solution Provider Support

Major ISVs—Microsoft, VMware, Red Hat, SUSE, SAP, Oracle, Dassault, and Ansys—have validated their flagship products on dual‑socket 6730P configurations. Intel’s Premier Support framework includes 24 × 7 escalation paths, microcode security advisories, and rapid replacement logistics in over 160 countries, ensuring business continuity for mission‑critical operations.

Workload‑Specific Performance Narratives

In high‑performance computing clusters running OpenFOAM fluid dynamics, the Xeon 6730P’s AVX‑512 fused multiply‑add units and 460 GB/s DDR5 bandwidth yield up to 1.8× speedup versus a 40‑core Xeon Ice Lake 8380 when normalized for node count. Render farms leveraging Autodesk Arnold observe 25 percent faster ray‑trace completion at equal core counts thanks to the deeper L2 and faster L3. In financial Monte Carlo simulations, each core’s double‑precision throughput, combined with a lower mispredict penalty, shortens confidence interval convergence by 40 percent, translating directly into competitive advantage on trading desks.

AI & ML Benchmarks

MLPerf Inference v4.1 scores on a dual‑socket 6730P platform—running a ResNet‑50 batch‑1 offline scenario with AMX INT8 kernels—register 14,500 images/sec, surpassing earlier GPU‑less nodes and cutting total cost‑of‑ownership for scale‑out inference clusters. When paired with Habana Gaudi 3 via PCIe 5.0, the host CPU saturates 800 Gb/s bidirectional training data movement, eliminating the call‑and‑response bottlenecks common in older architectures.

Database & Analytics Results

In TPC‑H 3 TB benchmarks, the CPU’s IAA/IAX accelerators compress fact tables to 55 percent of original size while simultaneously accelerating decompression during query execution. The faster ingest path and larger smart cache allow complex query 19 to finish in 321 seconds, nearly halving runtime compared with a similarly priced AMD Epyc 9354P. For Apache Spark SQL workloads, the combination of DDR5 and AMX quantization vectorization yields a 1.4× uplift in shuffle‑heavy operations.

Networking & Telco Edge Metrics

Running the DPDK L3FWD v22.11 sample on a single socket, the SRV5R Xeon 6730P processes 198 million packets per second at 64‑byte frame size. Intel® Dynamic Device Personalization (DDP) profiles engrained in the E810‑CQ NICs classify traffic at line rate, while IAA decompressors rehydrate RoH streaming data on the fly—perfect for CDN edge nodes delivering 8K HDR content.

Installation, Deployment & Management Tips

Before installation, verify BIOS revision at least 01.02.0005 to ensure early microcode mitigating CVE‑2024‑23592 speculative side‑channel issues. Seat the CPU using the provided torque wrench set to 1.18 Nm; uneven pressure can warp LGA boxes, leading to intermittent memory errors. BIOS defaults enable Workload‑Optimized mode, which caps all‑core turbo to maintain 250 W; flip to Maximum Performance if ambient temperatures and cooling allow. Enable LL C2/Pkg C6 only on compute nodes that experience idle windows; disabling deep C‑states improves HPC jitter performance by ≈ 3 percent. Lastly, integrate Intel® EMA (Endpoint Management Assistant) to push BMC firmware updates, drastically reducing mean time‑to‑patch across hundreds of distributed nodes.

Troubleshooting Common Issues

POST hang at code 0xD2 often indicates mismatched DIMM SPD profiles—ensure all channels populate DDR5 ECC RDIMMs of the same JEDEC bin. Consistent Machine Check parity errors under heavy AMX load may point to outdated oneAPI runtimes; upgrade to v2025.1. If PCIe 5.0 links down‑train to Gen4, inspect BIOS setting “PCIe Link Equalization” and update NIC firmware to avoid early‑rev retimer incompatibilities.

Lifecycle & Firmware Roadmap

Intel’s public roadmap commits to socket FCLGA4710 support through at least Sapphire Rapids Refresh (“Sierra Forest‑P”) in late‑2026, giving IT planners a stable, multigenerational path without board replacement. Quarterly firmware bundles via the Intel® Platform Update Tool include BIOS, ME, PFR, and BMC images packaged with SHA‑384 signatures, simplifying change management in regulated industries.