M321R4GA3EB2-CCPWF Samsung PC5-51200 DDR5-6400MHz 32GB ECC Memory Module

Samsung M321R4GA3EB2-CCPWF DDR5-6400MHz 32GB ECC RDIMM Overview

The Samsung M321R4GA3EB2-CCPWF PC5-51200 DDR5-6400MHz 32GB ECC Registered DIMM (RDIMM) memory module is engineered to meet the growing demands of next-generation computing. Designed with advanced DDR5 technology, this 288-pin module provides a breakthrough in memory speed, capacity, reliability, and power efficiency for enterprise and high-performance computing environments.

Understanding DDR5 RDIMM Technology

DDR5 (Double Data Rate 5) SDRAM represents a significant leap from its predecessor, DDR4, offering higher bandwidth and improved efficiency. The Samsung M321R4GA3EB2-CCPWF leverages DDR5 architecture to support faster data transfer rates, crucial for high-performance computing tasks in data centers, AI inference engines, and cloud computing workloads.

Registered DIMM Explained

Registered DIMMs, also known as buffered memory, include a register between the memory controller and DRAM modules to stabilize the electrical load. This ensures enhanced reliability, scalability, and stability for enterprise-class systems that utilize large memory arrays. The M321R4GA3EB2-CCPWF DDR5 RDIMM is designed specifically for server applications requiring dependable 24/7 performance.

ECC for Data Integrity

ECC (Error-Correcting Code) functionality in this Samsung memory module ensures automatic correction of single-bit errors, preventing data corruption. ECC is vital for mission-critical operations like databases, cloud environments, and financial systems where accuracy is non-negotiable.

Bandwidth and Latency Optimization

Operating at 6400MT/s, the Samsung M321R4GA3EB2-CCPWF DDR5 module significantly increases memory bandwidth compared to previous generations. With optimized memory channels and on-die ECC, it provides lower latency access to data, improving performance for workloads such as virtualization, AI/ML training, and scientific simulations.

PC5-51200 Speed Rating

The PC5-51200 specification indicates a peak bandwidth of 51.2 GB/s, making it one of the fastest DDR5 memory standards available. This allows for improved throughput in applications involving real-time analytics, video processing, and big data workloads.

Compatibility with Enterprise Systems

The M321R4GA3EB2-CCPWF DDR5 RDIMM is fully compliant with JEDEC standards, ensuring broad compatibility with leading server platforms including those based on Intel Xeon Scalable and AMD EPYC processors supporting DDR5 memory. It integrates seamlessly with motherboards featuring 288-pin DDR5 RDIMM slots.

Platform Compatibility

• Intel Xeon Scalable "Sapphire Rapids" platforms
• Compatible with AMD EPYC "Genoa" processors
• Tested for enterprise-grade servers from HPE, Dell EMC, Lenovo, and Supermicro

Thermal Management and Power Efficiency

The Samsung DDR5 RDIMM is designed with advanced power management circuitry, including onboard PMIC (Power Management Integrated Circuit). This enables fine-grained control over power delivery, reducing energy consumption and improving thermal performance in dense data center environments.

PMIC Advantages

The onboard PMIC allows the module to locally regulate voltage, improving overall power distribution across the module. This results in reduced system-level power loss and ensures efficient operation under intensive workloads.

Lower Operating Voltage

DDR5 modules operate at a lower voltage than DDR4 (1.1V vs. 1.2V), which contributes to reduced power consumption, an essential factor for power-sensitive infrastructure and green data centers.

Scalability and Multi-Channel Architecture

DDR5 technology introduces dual-channel DIMM (two independent channels per DIMM) for improved parallelism and data access. This increases throughput and enables better memory utilization across high-core-count processors.

High-Density Memory Deployment

Each 32GB Samsung RDIMM can be deployed in multi-module configurations to scale server memory capacities well into the terabyte range. This makes it suitable for AI clusters and HPC (high-performance computing) setups requiring massive data throughput.

Channel Efficiency in DDR5

DDR5's two-channel architecture allows simultaneous independent access to each channel, enhancing effective bandwidth. This helps reduce bottlenecks and latency when multiple applications or VMs require concurrent memory access.

Reliability in 24/7 Environments

With ECC and thermal stability, Samsung's DDR5 RDIMM is built for non-stop uptime. Server-grade memory like the M321R4GA3EB2-CCPWF is thoroughly validated for durability, data accuracy, and fault tolerance over long periods of operation.

JEDEC Compliance and Rigorous Testing

Samsung adheres to JEDEC industry standards for all DDR5 modules, ensuring consistent quality and cross-platform functionality. Rigorous testing for heat, vibration, and signal integrity guarantees performance even under adverse conditions.

Long-Term Investment Protection

The M321R4GA3EB2-CCPWF represents a future-proof investment for IT infrastructure, as DDR5 adoption becomes increasingly widespread across enterprise ecosystems. Its modular design and standardized form factor make upgrades simple and cost-effective.

Samsung's Leadership in Memory Innovation

As the world’s largest DRAM supplier, Samsung leads the memory industry with cutting-edge manufacturing and quality control. Their DDR5 modules, including the M321R4GA3EB2-CCPWF, are built using advanced fabrication processes that ensure better thermal characteristics and signal fidelity. This module continues Samsung’s tradition of delivering enterprise-class memory solutions that meet the toughest requirements for uptime, speed, and accuracy.

Trusted by Major OEMs

Samsung RDIMMs are trusted and validated by major OEMs and system integrators. Their consistent compatibility with top-tier platforms ensures plug-and-play simplicity, reducing deployment complexity across large-scale infrastructure builds.

Advanced Material Engineering

Samsung’s use of high-quality PCB materials and ICs reduces crosstalk and interference, allowing the memory to operate at higher frequencies with minimal signal degradation. This results in longer component lifespan and lower failure rates.

Deployment in Data Center and Cloud Environments

Designed for high-density environments, the M321R4GA3EB2-CCPWF is ideal for use in scalable data centers. Whether used in private cloud clusters or edge computing installations, it delivers the reliability and speed needed for latency-sensitive applications and high IOPS workloads.

Virtualization Benefits

Higher bandwidth and ECC functionality make this module optimal for virtualized environments with many virtual machines per physical server. It helps maintain memory isolation between VMs while maximizing system responsiveness.

Containerized Workloads and AI/ML

Container orchestration platforms like Kubernetes benefit from the fast memory access and high concurrency of DDR5. AI and ML inference tasks, which require large datasets to be loaded and accessed in memory, see substantial improvements in performance and reliability.