MT36JSF2G72PZ-1G9E1 Micron 16GB PC3-14900 DDR3 ECC Memory Module
Brief Overview of MT36JSF2G72PZ-1G9E1
Micron MT36JSF2G72PZ-1G9E1 16GB PC3-14900 1866MHZ DDR3 SDRAM 2RX4 240-Pin ECC Registered Memory Module For Poweredge And Precision Systems. New (System) Pull with 1 year replacement warranty
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Overview of the Micron 16GB DDR3 Memory
The MT36JSF2G72PZ-1G9E1 Micron 16GB PC3-14900 DDR3 ECC Memory Module represents a class of enterprise-grade system memory engineered for stability, data integrity, and sustained performance in professional computing environments. This category encompasses high-capacity DDR3 ECC modules designed for servers, workstations, and mission-critical systems where reliability and predictable behavior are essential. Modules within this category are widely deployed in data centers, virtualization platforms, database servers, and enterprise applications that demand consistent uptime and protection against memory-related errors.
Product Information
- Manufacturer: Micron
- Product Type: RAM Module
- Part Number: MT36JSF2G72PZ-1G9E1
Key Features
- Memory Size: 16GB
- Memory Technology: DDR3 SDRAM
- Form Factor: DIMM
- Pin Count: 240 Pins
- Voltage: 1.5V
- Signal Processing: Registered
- Error Checking: ECC (Error Correction Code)
Enterprise DDR3 ECC Memory Module
DDR3 ECC memory modules such as this Micron offering are purpose-built to operate continuously under heavy workloads. They integrate advanced error detection and correction logic that mitigates the risk of data corruption, making them a foundational component in enterprise IT infrastructure. The category emphasizes long-term availability, stringent manufacturing standards, and compatibility with a broad range of server-class motherboards and chipsets.
DDR3 Technology and PC3-14900 Performance
DDR3 memory technology introduced significant advancements over previous generations by increasing data transfer rates while maintaining efficient power usage. PC3-14900 modules operate at an effective data rate of up to 1866 MT/s, delivering substantial memory bandwidth for compute-intensive workloads. This performance tier within the DDR3 category is optimized for balanced throughput, latency, and thermal characteristics, enabling systems to handle multitasking, virtualization, and high-volume transaction processing with confidence.
The PC3-14900 specification identifies a theoretical peak bandwidth of approximately 14.9 GB/s per module, making this class of memory well-suited for multi-socket server architectures and memory-intensive applications. The MT36JSF2G72PZ-1G9E1 falls into this high-performance DDR3 segment, offering dependable speed while remaining compatible with enterprise platforms designed around DDR3 memory controllers.
Memory Speed, Latency, and Signal Integrity
Within the DDR3 ECC category, memory speed and latency are carefully balanced to ensure system stability. Modules like the Micron 16GB PC3-14900 are designed to meet JEDEC standards for timing accuracy and signal integrity. This ensures consistent data transfers across extended operating periods, even in densely populated memory configurations.
Signal integrity is particularly important in server environments, where multiple memory channels and large module counts can introduce electrical noise. Enterprise DDR3 ECC modules are engineered with high-quality PCB layouts and rigorous validation processes to maintain reliable communication between the memory controller and the DIMM.
Error-Correcting Code (ECC) Memory Functionality
A defining feature of this category is ECC functionality, which provides automatic detection and correction of single-bit memory errors. The MT36JSF2G72PZ-1G9E1 Micron module incorporates ECC logic that enhances data integrity, reducing the likelihood of system crashes, corrupted files, or inaccurate computational results caused by transient memory faults.
ECC memory modules are especially critical in applications such as financial modeling, scientific computing, healthcare systems, and enterprise databases. By correcting errors transparently during operation, ECC memory helps maintain system reliability without impacting performance or requiring user intervention.
16GB Capacity and High-Density Memory
The 16GB capacity of the MT36JSF2G72PZ-1G9E1 places it in a high-density segment of the DDR3 ECC memory category. This capacity is ideal for systems that need to maximize memory resources without consuming excessive DIMM slots. High-density modules enable more efficient system designs by allowing greater total memory capacity within a limited physical footprint.
In enterprise servers and workstations, 16GB DDR3 ECC modules are commonly used to support virtualization platforms, in-memory databases, and complex analytics workloads. The ability to deploy fewer modules while achieving higher total capacity can also contribute to improved airflow and thermal management within the chassis.
Scalability and Upgrade Flexibility
This category of memory modules supports scalable system configurations, enabling IT administrators to expand memory capacity as workload demands grow. The Micron 16GB PC3-14900 DDR3 ECC module is well-suited for incremental upgrades, allowing organizations to extend the useful life of existing hardware investments.
Compatibility with standard 240-pin DDR3 DIMM slots ensures that these modules can be integrated into a wide range of server and workstation platforms that support ECC memory, providing flexibility in deployment and maintenance strategies.
Micron Manufacturing Quality and Reliability Standards
Micron is recognized globally for its expertise in memory and storage technologies. Modules in this category are manufactured under strict quality control processes to meet the demands of enterprise computing. The MT36JSF2G72PZ-1G9E1 reflects Micron’s commitment to consistency, durability, and long-term reliability.
Each module undergoes extensive testing to validate performance across operating temperatures and voltage ranges. This ensures dependable operation in data center environments where systems may run continuously for years without interruption.
Enterprise Validation
DDR3 ECC memory modules from Micron are typically validated against major server platforms and chipsets to ensure compatibility and stable operation. This category emphasizes long product lifecycles, making it easier for organizations to source replacement modules and maintain standardized configurations over time.
Compatibility with Server and Workstation Platforms
The MT36JSF2G72PZ-1G9E1 Micron 16GB PC3-14900 DDR3 ECC Memory Module is designed for compatibility with a wide range of enterprise-grade motherboards and processors that support DDR3 ECC memory. This includes many server platforms from established OEMs as well as custom-built workstations configured for professional use.
Systems utilizing Intel or AMD processors with integrated DDR3 memory controllers can benefit from the stability and performance characteristics of this memory category. Proper compatibility depends on motherboard support for ECC memory and the appropriate DIMM type, which is commonly documented by system manufacturers.
Registered and Buffered Memory Considerations
Many enterprise DDR3 ECC modules in this category are designed to support registered or buffered configurations, which help reduce electrical load on the memory controller when multiple modules are installed. This enables higher total memory capacities and improved signal stability in multi-DIMM configurations.
Understanding the system’s memory architecture is essential when selecting modules from this category, as registered and unbuffered ECC memory are not interchangeable in most platforms.
Power Efficiency and Thermal Characteristics
DDR3 memory technology offers a balance between performance and power consumption, making it suitable for energy-conscious data centers. Modules like the Micron 16GB PC3-14900 are engineered to operate within standard voltage ranges while maintaining stable performance under load.
Efficient power usage contributes to lower heat output, which in turn supports better thermal management and reduced cooling requirements. This is particularly valuable in high-density server deployments where thermal constraints can impact overall system reliability.
Thermal Design and Continuous Operation
Enterprise memory modules are designed to withstand continuous operation in elevated ambient temperatures. High-quality components and PCB materials help ensure consistent performance even under sustained workloads, making this category suitable for 24/7 operation in demanding environments.
Use Cases Across Enterprise and Professional Computing
The category of Micron 16GB PC3-14900 DDR3 ECC memory modules supports a wide range of enterprise and professional applications. These modules are commonly deployed in virtualization hosts, application servers, and database systems where memory reliability directly impacts service quality.
Professional workstations used for engineering, media production, and scientific research also benefit from ECC memory, as it helps ensure accurate results and reduces the risk of data corruption during complex computations.
Virtualization and Cloud Infrastructure
Virtualized environments place significant demands on system memory, as multiple virtual machines share physical resources. High-capacity DDR3 ECC modules enable higher virtual machine density while maintaining stability and performance. Error correction capabilities are especially valuable in these environments, where memory errors could affect multiple workloads simultaneously.
Replacement, and Long-Term Value
Memory modules in this category are designed for ease of maintenance and replacement, supporting standardized enterprise hardware practices. The availability of consistent part numbers such as MT36JSF2G72PZ-1G9E1 simplifies inventory management and reduces downtime during upgrades or repairs.
Long-term value is a key consideration in enterprise memory selection. High-quality DDR3 ECC modules provide dependable service over extended periods, helping organizations maximize return on investment while maintaining system performance and reliability.
Standardization and Infrastructure Consistency
By standardizing on a specific category of memory modules, organizations can streamline deployment, troubleshooting, and capacity planning. The Micron 16GB PC3-14900 DDR3 ECC Memory Module aligns with these goals by offering consistent specifications and predictable behavior across supported platforms.
