MTA18ADF2G72AZ-3G2R Micron PC4-25600 16GB RAM 3200Mhz Cl22 Ecc Unbuffered DDR4 SDRAM

Decoding the Part Number: MTA18ADF2G72AZ-3G2R

Understanding Micron's part number nomenclature provides immediate insight into the module's key attributes. The string "MTA18ADF2G72AZ-3G2R" can be broken down as follows: "MT" denotes Micron Technology. "A" indicates a DDR4 product. "18" represents the component density and configuration (in this case, leading to a 16GB module). "AD" specifies an unbuffered (UDIMM), ECC-enabled module. "F2" relates to the component revision and organization. "G72" indicates a 72-bit wide data bus (64 data bits + 8 ECC bits). "AZ" points to the commercial temperature range (0°C to 95°C) and a 1.2V operating voltage. "3G2" signifies a speed grade of DDR4-3200 with CL22 latency. Finally, "R" confirms the module is dual rank. This detailed naming convention allows system integrators to precisely identify compatibility and capability.

Core DDR4-3200 Performance Metrics

Error Correction: ECC Unbuffered (UDIMM) Operation

This is one of the module's most critical features. ECC (Error-Correcting Code) memory includes additional bits (typically 8 bits for every 64-bit word) to detect and correct single-bit errors in real-time. This prevents data corruption, silent data errors, and system crashes, which is non-negotiable for servers, NAS devices, critical workstations, and financial or scientific computing. Being "Unbuffered" (UDIMM) means it does not contain a register or buffer on the module to reduce electrical load on the memory controller. ECC UDIMMs are commonly used in entry-level servers, high-end desktop platforms that support ECC (like certain AMD Ryzen and Intel Xeon W-series CPUs), and embedded systems.

Comparing ECC UDIMM, ECC RDIMM, and Non-ECC UDIMM

Understanding where this module fits requires distinguishing it from other DDR4 types. Non-ECC UDIMMs, common in desktops, lack error correction. ECC RDIMMs (Registered DIMMs) include a register to buffer command/address signals, allowing for much higher memory capacities per channel (supporting more DIMMs) but at the cost of slightly increased latency. The Micron MTA18ADF2G72AZ-3G2R sits between them: offering vital ECC protection for systems that do not require the massive scalability of RDIMMs but demand higher reliability than consumer memory.

Data Rate and Bandwidth

Operating at a base data rate of 3200 Megatransfers per second (MT/s), classified as PC4-25600, this module offers significant bandwidth improvements over previous DDR4 speeds like 2666MT/s or 2400MT/s. The "PC4" designation denotes a DDR4 module, while the number "25600" refers to the peak theoretical bandwidth in megabytes per second (MB/s). This is calculated as (3200 MT/s * 8 bytes per transfer) = 25,600 MB/s. In a dual-channel system, this bandwidth doubles to 51.2 GB/s, and in quad-channel server platforms, it can reach up to 102.4 GB/s, dramatically reducing data transfer bottlenecks for CPU-intensive tasks.

CAS Latency and Timing Parameters

The module operates at a CAS Latency (CL) of 22 clocks at its rated 3200MT/s speed. While this number is higher than typical desktop DDR4 modules (which may be CL16 or CL18), it is a standard JEDEC timing for DDR4-3200 ECC memory in server environments, emphasizing stability and compatibility across a wide range of server and workstation motherboards. The timing parameters are part of a broader set (often listed as 22-22-22 or similar) that ensure reliable communication between the memory controller and the DRAM chips at the specified high frequency.

Critical ECC Unbuffered (UDIMM) Technology

This module employs Error-Correcting Code (ECC) in an unbuffered (UDIMM) form factor, a defining characteristic for its target applications.

In-Depth Look at ECC Functionality

ECC is a non-negotiable feature for systems where data corruption is unacceptable. It works by adding extra bits (8 bits for every 64 data bits, creating a 72-bit bus) to store an encrypted code. As data is written to memory, the code is calculated and stored. Upon readout, the code is recalculated and compared. Single-bit errors (the most common type of soft error caused by cosmic rays or electrical noise) are detected and corrected instantly and transparently to the system. Multi-bit errors are detected and reported, allowing the system to halt to prevent corrupted data propagation. This greatly enhances system reliability and uptime, which is crucial for file servers, NAS devices, scientific workstations, and financial databases.

Unbuffered vs. Registered (RDIMM) Design

As an Unbuffered DIMM (UDIMM), the memory controller's electrical load is directly connected to the DRAM chips on the module. This offers lower latency compared to Registered DIMMs (RDIMMs) because there is no intermediate register chip delaying signals. However, it also places a greater electrical load on the controller, which limits the total number of modules that can be populated per channel (typically 1-2 UDIMMs vs. 2-4 RDIMMs). This makes the MTA18ADF2G72AZ-3G2R ideal for entry-level servers, high-end workstations, and embedded systems that prioritize low latency and support ECC UDIMMs, rather than massive, scale-out server racks that require maximum total capacity via RDIMMs.

Form Factor and Mechanical Design: Low Profile (VLP)

The Low Profile, specifically Very Low Profile (VLP), design is a major differentiator for this memory module. Standard DDR4 DIMMs are approximately 31.25mm (1.25 inches) in height. VLP modules, like this Micron model, are typically around 18.75mm to 20mm in height.

Applications Enabled by VLP Design

The reduced height is not merely a convenience; it enables deployment in space-constrained environments. This is critical in 1U and dense 2U rackmount servers where airflow is restricted and large CPU heatsinks are used—the clearance between the top of the DIMM and the underside of a heatsink or the server lid can be minimal. VLP memory ensures compatibility and maintains crucial airflow channels for cooling. Furthermore, it is essential in blade servers, microservers, and various embedded and networking appliances where chassis real estate is extremely limited. The 288-pin edge connector remains standard, ensuring physical compatibility with standard DDR4 DIMM slots, provided the vertical space is available.

Dual Rank Architecture Explained

The module is configured as a dual-rank (2R) module. A "rank" is an independent set of DRAM chips that is accessed simultaneously by the memory controller. A dual-rank module essentially presents two logical banks of memory on a single physical stick. This architecture allows the memory controller to interleave operations between the two ranks, improving performance and efficiency by hiding precharge and activation delays. Compared to a single-rank module of the same capacity, a dual-rank module can offer better performance under many server workloads. It represents a balance between the high performance of dual-rank and the lower electrical load of single-rank, making it a common and optimized configuration for 16GB DDR4 modules.

Power Efficiency

Operating at the JEDEC-standard 1.2V, this DDR4 module provides a significant reduction in power consumption compared to DDR3's 1.5V or 1.35V standards. The power savings, calculated as proportional to the square of the voltage, are substantial in large-scale deployments where dozens or hundreds of modules are in operation, leading to lower operational costs and reduced heat output.

On-Die ECC

While the module itself does not feature an integrated heat spreader (typical for VLP server modules to maintain the low profile), its thermal profile is managed through system airflow. The 1.2V operation inherently reduces thermal load. Furthermore, Micron's advanced DRAM manufacturing includes inherent reliability features. It's important to note that the ECC discussed here is module-level ECC, managed by the system's memory controller. This is distinct from on-die ECC, a feature within the individual DRAM chips (which Micron also employs in its newer generations) that corrects internal bit errors, further enhancing the overall robustness of the memory subsystem before data even reaches the module-level ECC circuit.

Use Case Scenarios

The Micron MTA18ADF2G72AZ-3G2R is not a general-purpose desktop memory module. Its compatibility is targeted at specific platforms.

High-Performance Workstations and NAS

Workstations built around AMD Ryzen Pro, AMD Threadripper Pro, or Intel Xeon W-series processors natively support ECC UDIMMs. For professionals in CAD, 3D rendering, video editing, and scientific analysis, ECC memory safeguards against calculation errors and system instability during long, critical compute jobs. Furthermore, high-end Network-Attached Storage (NAS) units from companies like QNAP and Synology often require or recommend ECC UDIMMs, especially VLP variants, to protect stored data integrity and ensure reliable operation in always-on scenarios.

Supported Platforms and Systems

This module is designed for server motherboards and workstation platforms that explicitly support DDR4-3200 ECC Unbuffered (UDIMM) memory. This includes many platforms based on Intel Xeon E-series processors (e.g., those for the LGA 1200, LGA 4189, and other sockets with UDIMM support), AMD EPYC 8004/4004 series "Siena" and "Bergamo" platforms designed for edge and telecom, and certain AMD Ryzen PRO and Threadripper PRO workstations when configured for ECC UDIMM support. It is also prevalent in OEM servers from vendors like Supermicro, Dell, and HPE in their tower and specific rackmount models, as well as in storage appliance units from companies like QNAP and Synology for their high-end NAS systems. Always verification of the system or motherboard's Qualified Vendor List (QVL) is essential before integration.

Ideal Deployment Environments

This memory excels in several key environments: 1) **High-Density, Scale-Out Edge Servers:** Where low profile is needed for thermal management in shallow racks. 2) **Network Attached Storage (NAS) Appliances:** Where ECC is critical for data integrity on stored files and the VLP design fits compact enclosures. 3) **Financial and Scientific Workstations:** Where computational accuracy is paramount and unbuffered ECC offers the best low-latency protection. 4) **Telecommunications and Networking Gear:** For routers, firewalls, and SD-WAN appliances requiring reliable, high-throughput memory in a compact, often fanless, form factor. 5) **Embedded Industrial Systems:** In manufacturing, medical imaging, and defense, where extreme reliability and long-term part availability are required.