MTC10C1084S1BC64BD1R Micron 16GB DDR5 6400MT/s PC5-51200 288-Pin CUDIMM Memory Kit

Comprehensive Product Overview

The Micron MTC10C1084S1BC64BD1R represents a significant leap forward in server memory technology, embodying the cutting-edge capabilities of DDR5 with a focus on reliability, performance, and data integrity. This 16GB module, operating at a blistering 6400MT/s, is engineered for next-generation data centers, high-performance computing (HPC) clusters, and enterprise servers where uptime and accuracy are non-negotiable.

General Information

• Manufacturer: Micron
• Part Number: MTC10C1084S1BC64BD1R
• Product Type: 16GB DDR5 SDRAM Memory Module

Technical Specifications

• Capacity: 16GB high-performance memory
• Technology Type: DDR5 SDRAM architecture
• Standard Compliance: PC5‑51200
• Data Transfer Rate: 6400 MT/s optimized throughput
• Latency: CL52 for efficient response
• Voltage Requirement: 1.1V low‑power design

Structural Composition

• Form Factor: 288‑pin DIMM layout
• Rank: Single‑rank (1R) configuration
• Chip Organization: x8 structure
• DRAM Density: 16Gbit per chip

Reliability Features

• Error Detection: ECC (unbuffered) support
• Stability: Designed for consistent operation in enterprise workloads

Compatibility Highlights

• Optimized for modern server platforms
• Supports advanced data‑intensive applications
• Engineered for seamless integration with Micron’s enterprise ecosystem

Key Advantages

• High‑speed bandwidth for demanding tasks
• Energy‑efficient voltage profile
• ECC functionality for improved data integrity

Key Specifications at a Glance

This module is defined by a precise set of industry-standard and manufacturer-specific parameters that dictate its compatibility and performance profile. The following breakdown details the essential technical specifications that define the module's capabilities.

Capacity and Primary Speed Ratings

The module offers a capacity of 16 Gigabytes (GB). This capacity is engineered to provide an optimal balance for workloads ranging from virtualization and in-memory databases to AI inference and cloud infrastructure. The primary speed rating is 6400 Megatransfers per second (MT/s), which refers to the number of data transfer operations the module can perform per second per pin. This translates to a peak data transfer rate of 51.2 GB/s (Gigabytes per second), derived from the calculation: (6400 MT/s * 64-bit data bus) / 8 bits per byte. The module is classified under the PC5-51200 designation, which is the industry standard (JEDEC) module type name that confirms this 51.2 GB/s bandwidth.

Understanding Data Rate vs. Bandwidth

It is crucial to distinguish between MT/s and effective bandwidth. The 6400 MT/s is the operating data rate of the module's interface. The PC5-51200 label explicitly defines the module's theoretical peak bandwidth. For the MTC10C1084S1BC64BD1R, the 64-bit wide channel enables the movement of 51200 Megabytes of data per second under ideal conditions, making it a high-bandwidth solution for data-intensive applications.

Latency and Timing Parameters

Memory latency, the delay before a data transfer can begin, is a key performance factor. This module operates at a CAS Latency (CL) of 52. This timing, expressed in clock cycles, is typical for high-speed DDR5 ECC modules and reflects the increased clock speeds and architectural changes of DDR5. While the CL number is higher than that of slower DDR4 modules, the actual time in nanoseconds is often comparable or better due to the much faster cycle time at 6400 MT/s. The module adheres to a complete set of JEDEC-standard timings (tCL, tRCD, tRP, tRAS) that ensure stable operation at its rated speed.

Form Factor and Physical Design

The physical construction of the MTC10C1084S1BC64BD1R is tailored for enterprise and data center environments, prioritizing signal integrity, thermal management, and compatibility.

288-Pin CUDIMM Configuration

The module utilizes a 288-pin arrangement, which is the standard for DDR5. However, the key differentiator is its form factor: CUDIMM (Custom DIMM). Unlike common UDIMMs (Unbuffered DIMMs) or RDIMMs (Registered DIMMs), a CUDIMM is a Micron-specific design. It is a custom, often bufferless module that is typically qualified for use in specific OEM server platforms, such as those from Dell, HPE, or Lenovo. It is not a standard off-the-shelf component for generic motherboards. This design allows OEMs and Micron to optimize electrical characteristics for particular system architectures, ensuring maximum reliability and performance in targeted servers.

Importance of Mechanical Compatibility

The 288-pin edge connector has a unique notch key position specific to DDR5, preventing accidental insertion into incompatible DDR4 slots. The CUDIMM's physical dimensions (height, component placement) are designed to fit within the strict spatial and cooling constraints of modern 1U and 2U server chassis. Users must verify exact compatibility with their system's hardware compatibility list (HCL) before procurement, as a CUDIMM is not universally interchangeable with other DDR5 DIMM types.

Power Efficiency

DDR5 modules incorporate a Power Management IC (PMIC) on the module itself, a feature that distinguishes them from DDR4. This onboard PMIC provides more stable power delivery and cleaner signals to the DRAM components, improving overall signal integrity and reliability at high speeds. The MTC10C1084S1BC64BD1R operates at a standard DDR5 voltage of 1.1V, which is lower than DDR4's typical 1.2V, contributing to improved power efficiency—a critical factor in large-scale server deployments where power consumption and heat generation are major operational concerns.

Advanced DDR5 Architecture and Enterprise Features

Beyond basic specifications, the Micron MTC10C1084S1BC64BD1R leverages the foundational architectural advancements of DDR5 to deliver enterprise-grade performance and resilience.

ECC Technology: On-Die Error Correction

This module is equipped with Error-Correcting Code (ECC) capabilities. In the context of DDR5, this often refers to on-die ECC. This means each DRAM chip on the module has internal logic that can detect and correct bit errors within that chip before the data is sent to the memory controller. This is a first line of defense against data corruption caused by alpha particles or electrical noise. It is important to note that this on-die ECC is separate from traditional sideband ECC (often referred to as ECC in DDR4 RDIMMs/LRDIMMs) which protects data on the bus. Some systems may leverage both forms for maximum data integrity.

Impact on System Reliability

The inclusion of ECC is non-negotiable for enterprise and mission-critical applications. It prevents silent data corruption, which can lead to application crashes, corrupted databases, or scientific calculation errors. By automatically correcting single-bit errors and detecting multi-bit errors, ECC memory, such as this Micron module, significantly increases system uptime and data reliability, a cornerstone for server and data center stability.

Channel Architecture and Burst Length

DDR5 introduces a revolutionary change in channel architecture. A standard DDR5 module like the MTC10C1084S1BC64BD1R is organized as two independent, 32-bit wide sub-channels. This is a departure from DDR4's single 64-bit channel. Each sub-channel can handle memory accesses independently, improving concurrency and efficiency for the memory controller. This results in lower latency for concurrent accesses and better overall utilization of the memory bandwidth.

Signal Integrity and Data Integrity Features

Operating at 6400 MT/s demands robust engineering to ensure data is transmitted accurately. This module incorporates several DDR5-standard features to this end.

Application and Deployment Scenarios

The technical attributes of the Micron MTC10C1084S1BC64BD1R make it suitable for a well-defined set of computing environments where its specific combination of speed, capacity, error correction, and form factor are required.

Targeted System Platforms

This CUDIMM is designed for integration into specific enterprise server platforms from major OEMs. It is not intended for desktop PCs, gaming systems, or generic workstation builds.

Cloud Data Center Infrastructure

For public and private cloud infrastructure, this module provides the density, performance, and reliability needed for hypervisor hosts, virtual machine nodes, and containerized application platforms. The 16GB capacity per module allows for high total memory configurations, supporting dense virtual machine deployments.

Ideal Workloads and Use Cases

The performance profile of this DDR5 module aligns with workloads that are sensitive to memory bandwidth, latency, and data integrity.

In-Memory Databases and Caching

Technologies like SAP HANA, Redis, and Apache Ignite thrive on fast, abundant, and reliable memory. The 51.2 GB/s bandwidth and low latency of this module accelerate data access times dramatically compared to DDR4, reducing query times and improving transaction throughput.

High-Performance Computing (HPC)

Applications in computational fluid dynamics, financial modeling, and genomic sequencing perform vast numbers of calculations on large datasets held in RAM. The combination of ECC data integrity and high bandwidth provided by modules like the MTC10C1084S1BC64BD1R ensures both accurate results and faster time-to-solution.

Enterprise Applications and Virtualization

Large-scale ERP, CRM, and collaboration platforms running on virtualized or bare-metal servers require consistent memory performance. The module's reliability features minimize the risk of crashes or data corruption in these business-critical environments, while the increased bandwidth supports a higher number of concurrent users and transactions.

Consulting Hardware Compatibility

The primary resource is the specific server OEM's hardware compatibility list or memory configuration guide. One must search for the exact module part number (MTC10C1084S1BC64BD1R) or its specific OEM equivalent part number on the support website for the exact server model (e.g., Dell PowerEdge R760, HPE ProLiant DL380 Gen11). Using a module not on the HCL can result in failure to boot, system instability, or degraded performance.

Understanding Memory Channel

Modern servers have precise rules for populating memory slots to achieve optimal performance (usually to enable memory channel interleaving). Guides will specify the recommended slots to populate first (often starting with slots for Channel A). Mixing this module with modules of different speeds, capacities, or timings can cause the entire system to run at the slowest common denominator or may be unsupported.