Micron MTC40F2046S1HC88XD1 64GB DDR5 8800Mt/s ECC 287-pin Mrdimm Memory Module.

Micron MTC40F2046S1HC88XD1 64GB DDR5-8800 MRDIMM Server Memory

The Micron MTC40F2046S1HC88XD1 is a high-capacity, enterprise-grade server memory module engineered for next-generation data centers. With a massive 64GB density, blazing DDR5-8800 speed, and advanced ECC error correction, this MRDIMM ensures top-tier reliability, efficiency, and scalability for demanding workloads in artificial intelligence, virtualization, cloud computing, and database applications.

Generel Information:

Manufacturer: Micron Technology Inc. 

Part Number: MTC40F2046S1HC88XD1

Product Name: Micron 64GB DDR5-8800 MRDIMM CL36 PC5-70400 Server Memory

Key Technical Highlights

• Capacity: 64GB of DDR5 SDRAM
• Standard: DDR5-8800 / PC5-70400
• Speed: 8800 MT/s transfer rate
• Rank: Dual-rank 2Rx4 configuration
• Latency: CAS Latency CL36
• Error Management: Advanced ECC (Error-Correcting Code)
• Operating Voltage: 1.10V low power requirement
• Form Factor: MRDIMM with 287-pin design

Technical specifications

Below are the essential specs system architects and procurement teams will look for when placing this module on a catalog or comparing parts:

• Capacity: 64GB per module (1 × 64GB).
• Memory standard / bandwidth: DDR5-8800 (8800 MT/s), PC5-70400 class.
• Module type: MRDIMM (Memory Registered DIMM), ECC capable.
• Organization: Dual-rank (2Rx4) using x4 device organization.
• CAS Latency: CL36 (typical for this speed grade).
• Operating voltage: Nominal 1.10 V (DDR5 standard low-voltage).
• Pin count: 287-pin MRDIMM form factor.
• Target markets: Enterprise servers, HPC nodes, cloud infrastructure, and validated OEM systems.

These attributes are pulled directly from Micron’s MRDIMM part catalog and validated distributor listings for the MTC40F2046S1HC88XD1.

Advanced Reliability Features

Error Correction and Data Protection

This memory integrates ECC technology, safeguarding mission-critical systems against data corruption. Error detection and correction help prevent downtime, ensuring enterprise-grade stability even under the most intensive workloads.

Consistent Uptime

With ECC and robust build quality, the module delivers continuous performance. This is particularly essential for 24/7 operations, cloud services, and HPC infrastructures that cannot afford interruptions.

Physical Specifications

• Form Factor: MRDIMM
• Connector: 287 pins
• Dimensions: 5.2 inches length × 1.2 inches width × 200 mil thickness
• Weight: Approximately 0.99 ounces

Designed for server compatibility, the 287-pin MRDIMM form factor ensures seamless integration into modern enterprise motherboards. The slim and lightweight profile also facilitates efficient airflow and thermal management inside high-density server racks.

Power and Efficiency

Operating at just 1.10V, this module provides exceptional energy efficiency. Lower power consumption translates to reduced operating costs and lower thermal output, critical factors for large-scale data centers focused on sustainability and performance-per-watt.

Thermal Stability

Its efficient power draw reduces excess heat, enabling servers to operate at optimal temperatures without stressing cooling systems. This efficiency supports both performance stability and long-term reliability.

Compliance and Sustainability

Micron ensures this product meets strict environmental standards:

• REACH compliant (Registration, Evaluation, Authorization, and Restriction of Chemicals)
• RoHS certified (Restriction of Hazardous Substances)

These certifications confirm that the Micron MTC40F2046S1HC88XD1 memory module is environmentally safe and manufactured with reduced environmental impact.

Summary of Key Attributes

• 64GB DDR5 MRDIMM server-grade memory
• DDR5-8800 / PC5-70400 standard for cutting-edge bandwidth
• 2Rx4 dual-rank configuration with CL36 latency
• ECC technology for reliable, error-free operation
• 1.10V operating voltage for efficiency
• 287-pin MRDIMM form factor for modern server compatibility
• RoHS and REACH environmental compliance

Architecture and module design

Dual-rank (2Rx4) x4 organization explained

The "2Rx4" designation indicates the module contains two logical ranks and uses x4-bit DRAM devices internally. Dual-rank modules present two separate ranks of memory to the controller, which can increase effective per-channel capacity and — depending on platform interleaving and access patterns — can also offer throughput advantages over single-rank modules for many server workloads. The x4 device organization (rather than x8) affects how the module handles data lanes and ECC lanes, and it typically results in different density and error-handling characteristics favored by many server OEMs for high-capacity designs.

Registered memory and ECC: stability at scale

As an MRDIMM, the MTC40F2046S1HC88XD1 includes register circuitry that buffers address/command signals and reduces electrical loading on the memory controller. This is critical when populating many modules per channel or per socket in large-scale server deployments. Combined with on-module ECC, the module detects and corrects single-bit errors and detects multi-bit errors, significantly lowering the chance of silent data corruption — a must for databases, virtualization hosts, and storage controllers.

Form factor and pinout: 287-pin MRDIMM specifics

The module uses a 287-pin MRDIMM mechanical layout commonly used in certain server form factors. This is slightly different from the more widely-known 288-pin JEDEC RDIMM outline used across other DDR5 server modules; always verify your server vendor’s DIMM slot pinout and compatibility notes to ensure mechanical and electrical match. Micron’s MRDIMM part-detail pages provide the definitive mechanical drawings and JEDEC compliance notes for integrators.

Performance characteristics and tradeoffs

Bandwidth focus: what DDR5-8800 delivers

DDR5-8800 represents one of the higher-end speed bins in the DDR5 ecosystem. This module’s raw bandwidth (PC5-70400) is particularly advantageous for memory bandwidth–bound workloads: large in-memory databases, analytics engines, high-concurrency virtualization hosts, and certain HPC applications. For designs that stream large datasets or perform vectorized numeric operations, the extra throughput often yields measurable application-level gains compared with lower-speed DDR5 modules.

Note: higher MT/s rates generally come with increased absolute CAS latency numbers (e.g., CL36 here). The effective impact on application performance depends on workload sensitivity to latency vs throughput — for many server and parallel workloads, higher bandwidth outweighs slightly higher latency. Validate with representative benchmarks when migrating to faster DIMMs. 

Power and thermal considerations for high-speed DDR5

Although DDR5 moves to a 1.1 V nominal supply and introduces per-module power management (PMICs on some modules), modules running at DDR5-8800 have higher switching activity and can produce more heat than slower modules. In dense server configurations — multi-DIMM per channel, multi-socket — plan airflow, thermal dissipation, and DIMM spacing carefully. Many server vendors publish validated cooling profiles and maximum recommended DIMM population densities for high-speed modules; follow those recommendations to avoid thermal throttling or increased error rates. 

Practical note on DIMM mixing and speed negotiation

If a system contains DIMMs of different speed grades, the memory controller will typically train to the speed of the slowest installed module. For predictable performance, populate matched modules (same Micron part number / speed bin) across channels and sockets. For staged rollouts, retest application performance after upgrades to confirm expected gains. 

Compatibility and platform support

Server OEM validation and hardware compatibility lists (HCL)

Enterprise server vendors (e.g., Dell, HPE, Lenovo, Supermicro) publish Qualified Vendor Lists (QVLs) and HCLs that specify validated DIMM part numbers, supported speeds, and population rules. The Micron MTC40F2046S1HC88XD1 appears in Micron’s MRDIMM catalog and in numerous OEM-validated SKU listings, but because platform memory training, BIOS firmware, and board routing affect compatibility, always confirm the OEM’s HCL for the exact chassis and BIOS version you are deploying. 

Population rules: channels, ranks, and best practice

Different server platforms support different numbers of DIMMs per channel and per socket. Using MRDIMMs with register buffering helps achieve higher module counts, but performance characteristics will vary with population (e.g., one DIMM per channel vs two DIMMs per channel). Follow your server manual’s recommended population order to maintain channel symmetry and to allow the memory controller to utilize interleaving and maximize throughput.

BIOS/firmware, SPD programming and memory training

DDR5 introduces advanced memory training features that determine operating speed, timing, and voltage during POST. When introducing high-speed modules such as DDR5-8800, verify that the server firmware includes updated memory training microcode for high-density and high-speed DIMMs. Firmware updates often resolve training regressions and can unlock higher stable speeds. If you encounter POST failures or the system locks at lower speeds, check for BIOS updates and platform notes before suspecting the module as defective. 

Reliability, ECC, and monitoring

How ECC protects server workloads

This Micron MRDIMM includes ECC logic to perform single-bit error correction and multi-bit error detection at the module level. In combination with system-level error reporting (BMC, IPMI, or vendor-specific telemetry), ECC enables early detection and logging of memory events, increasing uptime and protecting against silent data corruption that could otherwise compromise databases, filesystems, or in-memory computations.

Monitoring and proactive maintenance

Enable server telemetry to capture ECC correction counts and uncorrectable error events. A rising trend of corrected errors is a common early indicator of marginal conditions — thermal issues, seating problems, or failing components — and should prompt inspection and extended validation testing. Many OEMs expose DIMM health through BMC dashboards or vendor management suites. 

Use cases and workload alignment

High-density virtualization and cloud hosts

64GB DDR5-8800 MRDIMMs support high VM consolidation ratios in hypervisor hosts, where large memory footprints and sustained throughput are required. The combination of higher per-module capacity and DDR5-8800 bandwidth helps maintain performance under heavy multi-tenant workloads and memory migration events. For cloud operators, these modules reduce the number of DIMMs required per host to reach target memory capacities, simplifying management and potentially lowering DIMM slot exhaustion risk.

Databases, in-memory analytics and caching

In database servers, large memory caches and in-memory tables benefit from increased bandwidth since DDR5-8800 allows faster traversals of large working sets. ECC MRDIMMs also protect transactional integrity. When architecting nodes for in-memory databases, pair these modules with CPUs and storage subsystems that remove other bottlenecks so memory bandwidth has a clear path to improve application latency and throughput.

High-performance computing (HPC) and compute nodes

Certain HPC workloads that process large datasets or perform memory-intensive calculations will see benefits from DDR5-8800 bandwidth. Use these MRDIMMs where memory subsystem throughput is a primary limiter of job time-to-solution, while ensuring that power, thermal, and interconnect layers are sized accordingly.

Benchmarking and validation guidance

Recommended tests before rollout

• Memory bandwidth microbenchmarks (STREAM or equivalent) to validate throughput at PC5-70400 levels.
• Extended memory stress tests (memtest variants or vendor memory validation suites) to detect early hardware defects.
• Application-level benchmarks (database transaction tests, VM density tests) to quantify end-user impact.

Keep baseline measurements from the original configuration so improvements or regressions after installing MRDIMMs can be quantified. If an installed module fails validation, cross-test in an alternate validated platform to isolate module vs platform issues. 

Troubleshooting common deployment issues

System fails to POST or boots at lower speed

If the server does not POST or the memory trains at a lower-than-expected speed after installation, follow this sequence:

1. Install a single DIMM into the primary recommended slot and attempt boot.
2. Update platform BIOS/UEFI to the latest memory training firmware from the OEM.
3. Check the SPD / firmware-reported timing and voltage against Micron’s specification for the part.
4. Test the module in another validated platform to determine whether the issue is module- or board-related.

These steps resolve most compatibility and training issues; if the problem persists, open an RMA with your authorized reseller. 

Rising corrected ECC events or intermittent errors

A limited number of corrected ECC events is normal; however, a growing or clustered error count may indicate signal integrity problems, thermal stress, or imminent module failure. Investigate airflow, DIMM seating, and conduit routing of power rails; swap suspected modules and run extended tests to isolate the failing component. Use BMC telemetry to capture ECC trend data for vendor diagnostics.