Micron MTC40F2046S1RC64BD1 64GB DDR5 6400 Mhz PC5-51200 ECC Cl52 288-pin Rdimm Memory Module.

Product Overview of MICRON MTC40F2046S1RC64B 64GB DDR5 Memory

The MICRON MTC40F2046S1RC64B is a high-performance 64GB DDR5 SDRAM Registered DIMM designed to deliver exceptional speed, reliability, and scalability for enterprise-grade applications. Built with advanced ECC (Error-Correcting Code) technology and optimized for data-intensive environments, this memory module ensures stability and consistent performance for demanding workloads.

Key Features and Advantages

• Massive 64GB capacity supporting heavy multitasking and virtualization.
• DDR5 SDRAM architecture for improved bandwidth efficiency.
• Operates at an impressive 6400 MHz (PC5-51200) speed.
• Equipped with ECC error correction for secure and reliable data handling.
• Dual Rank, Registered design ensuring stability in multi-channel systems.
• Energy-efficient with 1.1V operating voltage.
• Compatible with servers and high-performance computing environments.

General Information

This Micron memory module is designed for enterprise and professional setups where reliability, compatibility, and speed are critical. The part number MTC40F2046S1RC64B identifies this module as part of Micron’s advanced DDR5 line.

• Product Name: 64GB DDR5 SDRAM Registered Module
• Manufacturer: Micron
• Type: RAM Module
• Part Number: MTC40F2046S1RC64B

Technical Specifications

Memory Details

• Total Capacity: 64GB
• Memory Standard: DDR5-6400 / PC5-51200
• Technology: DDR5 SDRAM
• Form Factor: RDIMM (Registered DIMM)
• Configuration: 1 x 64GB module

Performance Characteristics

• Speed: 6400 MHz
• Signal Processing: Registered
• Rank: Dual Rank
• Latency: CL52
• Voltage: 1.1V

Reliability and Stability

Error-Correcting Code (ECC)

The built-in ECC functionality actively detects and corrects common types of memory errors, reducing downtime and ensuring data accuracy. This makes the module suitable for mission-critical operations, data centers, and professional servers.

Registered DIMM Architecture

The registered design improves signal integrity, enhances scalability, and supports stable performance in systems requiring large memory capacities.

Physical Characteristics

• Dimensions: 5.2 x 1.2 x 0.2 inches
• Pin Count: 288-pin
• Shipping Weight: 0.20 lbs

Application Scenarios

Data Centers

Ideal for large-scale storage and compute clusters requiring fast data throughput.

High-Performance Servers

Enhances performance for virtualization, AI-driven workloads, and cloud services.

Professional Workstations

Provides the reliability and speed creative professionals and engineers need for demanding applications.

Summary of Benefits

• 64GB capacity supports modern enterprise environments.
• High-speed 6400 MHz bandwidth ensures efficient processing.
• ECC error correction guarantees stability.
• Registered dual-rank design offers scalability.
• Compact 288-pin RDIMM form factor for seamless installation.

Key Technical Specifications

Core Electrical and Timing Characteristics

• Capacity: 64GB per module
• Memory Type: DDR5 SDRAM, Registered (RDIMM)
• Speed Rating: DDR5-6400 / PC5-51200
• CAS Latency: CL52
• Error Correction: ECC (Error-Correcting Code)
• Operating Voltage: 1.1V nominal
• Pin Count: 288-pin DIMM
• Module Organization: Optimized for server densities and multi-channel architectures

Physical and Mechanical Properties

• Registered DIMM module length, height and thickness conforming to industry RDIMM mechanical standards
• High-quality PCB and component selection for long MTBF (Mean Time Between Failures)
• Heat-spreader/thermal profile compatible with dense server chassis cooling
• Precision keyed notch and pin layout for reliable insertion and removal in 288-pin sockets

Performance Characteristics and Architectural Advantages

High Bandwidth for Data-Intensive Workloads

At DDR5-6400, the Micron 64GB RDIMM delivers substantial memory bandwidth improvements over prior DDR generations. Higher throughput enables faster movement of large datasets between memory and processors, reducing time spent waiting on memory during heavy I/O operations. This increased data availability is critical for database query acceleration, large-scale in-memory analytics, and feeding data to accelerators (GPUs, NPUs) where memory bandwidth often becomes the bottleneck.

Latency and Timing Considerations

CAS latency CL52 is a design choice that balances raw frequency and stable timing. While absolute latency numbers may appear higher than lower-frequency DIMMs, the effective latency in real workloads frequently improves because more data is transferred per clock cycle at 6400 MT/s. For many server applications, bandwidth and total data moved per second are more impactful than single-cycle latency.

ECC and Data Integrity

ECC protects against single-bit errors and improves system resilience by detecting and correcting data corruption events before they propagate. In enterprise contexts—where a single bit flip can impact database consistency, scientific computation, or virtual machine state—ECC RDIMMs like the MTC40F2046S1RC64BD1 are often a requirement. Micron’s implementation adheres to rigorous ECC protocols, providing both on-die and module-level error detection mechanisms to keep systems running reliably under continuous loads.

DDR5 Innovations Utilized by This Module

On-Die ECC and Enhanced Error Handling

DDR5 introduces on-die ECC that corrects internal DRAM cell errors. Combined with module-level ECC and server platform ECC, this multi-tier error strategy significantly reduces uncorrectable errors and enhances overall system robustness—especially in long-running, mission-critical deployments like financial trading engines or healthcare systems.

Power Efficiency and PMIC Integration

DDR5 modules often incorporate power management integrated circuits (PMICs) on the module, offloading some voltage regulation tasks from the motherboard. The Micron RDIMM enjoys more stable power delivery, lower jitter, and reduced motherboard complexity, while the 1.1V nominal voltage decreases thermal dissipation versus older high-voltage designs, helping datacenter power budgets and cooling strategies.

Improved Channel Architecture and Banking

DDR5’s architectural upgrades—such as doubled burst lengths and improved internal bank structures—allow the module to sustain high utilization across multiple cores and threads concurrently. This is particularly helpful on servers running large numbers of virtual machines or containerized workloads that compete for memory resources.

Ideal Use Cases and Deployment Scenarios

Virtualized Environments and Cloud Infrastructure

Large-capacity RDIMMs allow hypervisors to host more VMs per server while maintaining performance isolation. The 64GB capacity and ECC support make the Micron RDIMM well suited for cloud hosts, virtualization clusters, and multi-tenant environments where both density and data integrity are required.

Databases, Caches, and In-Memory Systems

Memory-intensive systems such as in-memory databases (Redis, Memcached), column-store analytics, and large OLTP/OLAP databases benefit from the sustained bandwidth and capacity that DDR5-6400 RDIMMs provide. Faster data movement reduces query latency and improves transaction throughput under heavy concurrency.

AI Preprocessing and HPC Workflows

While GPUs handle model training, CPU-side preprocessing, feature engineering, and data staging often depend on memory capacity and throughput. High-speed RDIMMs enable accelerated preprocessing pipelines and help ensure that accelerators are kept fed with data, improving end-to-end throughput in machine learning operations.

High-Performance Workstations

Workstations used for 3D rendering, scientific simulation, CAD/CAE, and media production can take advantage of 64GB module configurations to run larger scenes or simulations without swapping to disk, reducing render times and interactive delays for professionals.

Compatibility, Integration and Upgrade Path

Platform Compatibility

The 288-pin RDIMM form factor and JEDEC DDR5 standardization ensure compatibility with modern server platforms that officially support DDR5 RDIMMs. Users should consult motherboard and server vendor compatibility lists to confirm support for specific module densities and speed grades, especially when mixing modules of different ranks or speeds.

Memory Population Guidelines

When populating servers with RDIMMs, follow the vendor’s recommended channel population rules (single-rank vs. dual-rank behavior, population per channel, and population order) to maximize throughput and stability. The Micron module is optimized for multi-channel architectures but will perform best when installed evenly across memory channels to allow symmetric bandwidth distribution.

Upgrading from DDR4 to DDR5

Transitioning to DDR5 is a platform-level change: CPU sockets, memory controllers, and motherboard firmware must support DDR5. The MTC40F2046S1RC64BD1 provides a clear upgrade path for data centers upgrading servers to new CPU generations, offering immediate benefits in bandwidth, density, and energy efficiency.

Thermal Considerations and System Cooling

Thermal Profile and Server Rack Strategies

Although DDR5 operates at a lower voltage, high-density configurations can still generate significant heat. Ensure proper airflow within server chassis—use front-to-back cooling patterns, maintain unobstructed intake/exhaust paths, and adhere to rack manufacturer's maximum intake temperature recommendations. Micron’s module is designed for passive cooling; however, some high-density deployments may benefit from chassis with dedicated airflow channels or memory-specific heat spreaders.

Monitoring and Thermal Management

Modern server platforms include telemetry to monitor DIMM temperatures and health metrics. Integrate those telemetry readings into your DCIM (Data Center Infrastructure Management) tools to proactively detect hot spots and prevent thermal throttling. Firmware that supports DIMM thermal reporting allows automated fan speed control and targeted remediation before performance degradation occurs.

Reliability, Validation and Quality Assurance

Micron’s Manufacturing and Testing Standards

Micron follows stringent manufacturing processes, including component screening, burn-in testing, and JEDEC compliance validation. Each RDIMM undergoes electrical and functional validation across a range of temperatures and voltages to ensure consistent behavior in enterprise deployments. The module’s long life cycle and low failure rates are critical for mission-critical installations.

Field Validation and Interoperability

Micron collaborates with server OEMs and platform providers to validate memory compatibility across BIOS versions, chipset revisions, and CPU steppings. Before wide deployment, it is best practice to validate memory behavior within the specific server model and firmware revision your organization uses, especially when employing large numbers of modules per system.

Maintenance, Troubleshooting and Best Practices

Installation Best Practices

• Handle modules by the edges and observe ESD (electrostatic discharge) precautions.
• Install DIMMs in the order recommended by the server vendor to ensure correct channel balancing.
• Do not force modules into sockets; ensure the latches fully engage to avoid intermittent contacts.
• Apply anti-static wrist straps or mats during installation in sensitive environments.

Troubleshooting Common Issues

• POST failures: Verify DIMM seating, module compatibility, and BIOS/firmware settings. Clear CMOS if needed and try different population combinations.
• Intermittent errors: Check for thermal issues, voltage irregularities, and update platform firmware. Run vendor memory diagnostics to identify failing modules.
• Performance anomalies: Ensure memory speed settings are correct in firmware and that channel population is balanced. Confirm XMP/JEDEC profiles and platform support for DDR5-6400 operation.

Environmental and Regulatory Compliance

The MTC40F2046S1RC64BD1 complies with major global environmental and safety regulations, reflecting Micron’s commitment to sustainable manufacturing. These modules are typically RoHS compliant and conform to REACH regulations, minimizing the presence of hazardous substances and ensuring safer disposal and recycling practices at end of life. Energy-efficient operation at 1.1V helps reduce overall datacenter power consumption and carbon footprint when deployed at scale.

Comparisons and Competitive Positioning

Compared to Other DDR5 RDIMMs

Within the DDR5 RDIMM market, the Micron 64GB-6400 module strikes a balance between top-end speed and wide compatibility. Some modules may offer higher frequency grades (e.g., DDR5-7200 or DDR5-8000) or different CAS timings; however, higher speeds often require tighter platform validation and special BIOS support. The Micron PC5-51200 grade is a practical choice for many enterprises—providing a high throughput point with relatively broad platform support.

Compared to DDR4 Solutions

Compared to legacy DDR4 RDIMMs, DDR5-6400 modules deliver substantially more bandwidth and room for growth in memory density. The migration to DDR5 is driven by multi-core CPUs and memory-hungry workloads; organizations looking to future-proof infrastructure will find DDR5 modules like the MTC40F2046S1RC64BD1 essential for next-generation server deployments.

Glossary of Important Terms

ECC (Error-Correcting Code)

A method for detecting and correcting single-bit errors to improve data integrity in memory systems.

RDIMM (Registered DIMM)

A memory module that includes a register between the memory controller and DRAM devices, improving signal integrity and enabling higher memory densities in servers.

JEDEC

The global standardization body for semiconductor engineering, which specifies memory standards including DDR5 timing, voltages, and module form factors.