Micron MTC40F204WS1RC64BB2R 96GB 6400mhz Pc5-51200 DDR5 288-pin Memory.

Micron MTC40F204WS1RC64BB2R 96GB Memory

The Micron MTC40F204WS1RC64BB2R 96GB (1x96GB) 6400MHz PC5-51200 ECC Registered memory module is a high-density DDR5 RDIMM designed for server-class reliability, data center scalability, and high-throughput computing environments. This module features ECC (Error Correcting Code) and Registered (buffered) functionality, Dual Rank organization, x8 die configuration, CL52 latency, and operates at a nominal 1.1V. Built on Micron’s DDR5 SDRAM architecture with a 288-pin RDIMM form factor, this module targets enterprise servers, virtualization hosts, database clusters, and memory-intensive workloads that demand both capacity and consistent performance.

Technical architecture and how it affects performance

DDR5 fundamentals and PC5-51200 throughput

DDR5 represents the next generation of synchronous DRAM, offering higher data rates, improved channel efficiency, and on-die features that accelerate server workloads. The PC5-51200 rating corresponds to a theoretical peak bandwidth of 51,200 MB/s per module at DDR5-6400 signaling (in single-channel terms). In multi-channel server platforms, combining multiple RDIMMs multiplies available memory bandwidth for parallel data streams—critical for database caching, large in-memory datasets, and high-throughput packet processing.

Dual Rank x8 organization explained

Dual Rank (2R) modules are organized with two sets (ranks) of memory that the memory controller can access independently. Each DRAM device is an x8 chip, meaning eight data bits per chip. Dual Rank modules generally offer higher effective density and can sometimes deliver improved throughput in real-world workloads due to internal bank interleaving—though they may increase trace complexity and slightly affect memory controller timing/compatibility on some platforms.

Latency vs. bandwidth tradeoffs

This Micron module lists CL52 timing at DDR5-6400. In DDR memory, higher frequency improves raw bandwidth but can increase CAS latency value; the tradeoff is lower access latency in clock cycles but greater absolute latency in nanoseconds might occur if the frequency rise doesn’t offset the higher CAS. For throughput-bound workloads (large sequential reads/writes, caching), bandwidth wins; for latency-sensitive workloads (high-frequency trading, some HPC kernels), absolute latency numbers matter. The Micron DDR5-6400 offering sits in the high-bandwidth tier appropriate for modern server workloads that prioritize sustained data transfer.

Use cases and target workloads

Data center and cloud infrastructure

Cloud providers and hyperscalers are continually pushing for higher memory capacities per socket. A single 96GB DDR5 RDIMM reduces the number of modules necessary to reach target memory footprints, simplifying inventory and board routing in dense deployments. This module is ideal for virtualization hosts running many VMs, containerized services with large memory footprints, and multi-tenant environments where memory isolation and error correction are critical.

High-performance computing (HPC) and analytics

HPC clusters running scientific simulations, in-memory analytics, or graph processing benefit from DDR5’s increased bandwidth. The Micron 96GB RDIMM can serve as a building block for nodes that require large working sets in RAM—reducing the need for slower storage-tier accesses and improving job completion times for memory-limited tasks.

Databases, caching layers, and in-memory stores

Databases such as in-memory OLTP systems, large NoSQL caches, and distributed caching layers (e.g., Redis, Memcached) see direct performance gains from increased RAM capacity and bandwidth. The availability of large single-module capacities simplifies capacity planning and can enable larger cache sizes per node without consuming all DIMM slots.

Enterprise virtualization and VDI

For organizations with dense VDI deployments or heavy virtualization consolidation ratios, larger RDIMM capacities allow administrators to allocate more RAM per VM while keeping the number of installed DIMMs manageable. This module is a fit where both capacity and stability (ECC) are required.

Compatibility, platform considerations, and server support

Form factor and mechanical fit

The module adheres to the standard 288-pin RDIMM mechanical specification for DDR5 ECC Registered memory. It fits server motherboards that accept DDR5 RDIMMs. Administrators must confirm that their motherboard and BIOS explicitly support DDR5 RDIMM modules and the targeted capacity (96GB per slot) and rank configuration.

BIOS/firmware and memory population rules

Server platforms often enforce memory population rules—slot order, symmetric channel population, and supported rank per channel limitations. Because the Micron module is Dual Rank, some platforms may change supported DIMM-per-channel configurations or maximum achievable speeds when dual-rank RDIMMs are populated densely. Always consult the server vendor’s memory interoperability list and apply the latest BIOS/firmware to ensure optimized timing, voltage, and training sequences for DDR5 operation.

Interoperability checklist

• Confirm motherboard supports DDR5 RDIMM (288-pin) modules.
• Verify support for 96GB module capacity and Dual Rank DIMMs in the server vendor’s QVL (Qualified Vendor List).
• Check BIOS release notes for DDR5 speed support at PC5-51200 / 6400MT/s and any required platform-specific settings.
• Ensure system memory population follows channel-symmetry rules to maintain optimal channel interleaving.
• Update server firmware and BMC firmware before large memory upgrades to handle new DIMM training routines.

Thermal behavior, power, and physical considerations

Power consumption and voltage characteristics

DDR5 modules typically operate at a lower voltage envelope than earlier generations, with this Micron module rated at 1.1V nominal. Lower voltage contributes to improved power efficiency per bit transferred, which is important in large data center deployments where cumulative power draw across thousands of DIMMs can be significant. However, higher frequency operation and denser capacities can increase power dissipation, so thermal management is still essential.

Cooling and airflow recommendations

Maintain adequate server chassis airflow and follow vendor guidelines for maximum ambient temperatures. Where possible, use server configurations with front-to-back airflow, maintain unobstructed pathways, and consider memory heatsinks if supported by the platform. System integrators should avoid overpopulating DIMM slots without ensuring sufficient airflow, particularly in dense rack deployments.

Density and board routing impacts

High-capacity, dual rank DIMMs increase the complexity of signal routing on server motherboards. Server vendors design trace lengths and termination schemes to handle specific rank and speed profiles; mixing unsupported densities or ranks can reduce achievable maximum speeds. Always rely on the platform vendor’s validated configurations when planning large-scale upgrades.

Performance tuning and configuration strategies

Memory channel balancing and interleaving

For best performance, populate DIMMs symmetrically across memory channels. Balanced channel population enables optimal channel interleaving, increasing effective memory parallelism and reducing contention. Dual Rank modules often allow better bank-level parallelism, but the platform may limit maximum DIMM-per-channel frequency—tradeoffs should be assessed via vendor documentation and benchmarks.

BIOS settings to consider

• Memory speed profile: Leave on Automatic or set JEDEC/XMP/Platform-validated profile as per vendor recommendations.
• ECC mode: Ensure ECC is enabled for the module to provide error correction.
• Memory training and command rate: Let the firmware handle training; advanced users can adjust secondary timings only when guided by vendor support.
• Power management: Consider platform power profiles if workload prioritizes performance or power savings.

Benchmarking tips

Use real-world application benchmarks in addition to synthetic memory tests. Synthetic tools measure theoretical bandwidth and latency, but application-level benchmarks (e.g., database throughput, VM boot times, large file transcodes) reveal how memory upgrades influence end-user performance. When comparing configurations, test under representative loads and document the impact of rank, capacity, and population on throughput and latency.

Comparison and buying guide

How to compare with alternative DDR5 RDIMMs

When evaluating memory upgrades, consider capacity-per-module, frequency (MT/s), latency (CAS), ECC/Registered vs. LRDIMM options, and vendor ecosystem support. The Micron 96GB DDR5-6400 module balances high capacity with high bandwidth and ECC Registered reliability. Compared to lower-frequency modules, it offers higher sustained throughput; compared to LRDIMM (Load-Reduced DIMM) options, RDIMMs maintain traditional buffering and may be preferred on platforms validated for RDIMM topologies.

Capacity vs. module count

Larger single-module capacities (such as 96GB) reduce the number of modules required to reach target memory per node—beneficial for servers with limited DIMM slots or when reserving slots for future expansion. Conversely, smaller modules spread across multiple channels can sometimes yield better raw parallelism—so the choice depends on platform slot counts and workload parallelism characteristics.

Value considerations and total cost of ownership

Enterprise memory procurement must consider more than price per GB. Factor in validation time, compatibility testing, expected lifespan, energy costs (power per module at scale), support and warranty, and how memory density affects server consolidation ratios. Micron’s reputation as a major DRAM manufacturer may provide assurances about supply continuity and long-term firmware compatibility—important for large-scale deployments.

Reliability, warranty, and vendor support

Micron’s enterprise grade support and warranty expectations

Micron typically offers enterprise warranties and support channels for registered ECC memory, including replacement policies and technical assistance for integration into validated platforms. Confirm warranty terms at point-of-sale and whether the part is covered under Micron’s enterprise warranty or through an authorized reseller for additional service-level commitments.

Testing and validation services

For critical deployments, consider requesting vendor or third-party validation testing. Some integrators offer memory validation suites that stress-test DIMMs under target workloads to ensure long-term reliability. When deploying at scale, include a memory validation phase in your rollout plan to detect marginal modules prior to production use.

Environmental and regulatory considerations

RoHS, WEEE, and eco-compliance

Confirm that the memory modules meet environmental regulatory requirements for your region (such as RoHS) and that disposal or recycling follows local e-waste laws. Large data center operators often require supplier attestations regarding materials and end-of-life handling.

Operating temperature and altitude

Server-grade DDR5 modules typically support a wide operating temperature range suitable for data center environments. Check Micron’s datasheet for specific temperature and humidity tolerances. For edge deployments in harsh or high-altitude environments, validate that operating conditions fall within specified limits to maintain module longevity.

Security features and firmware

On-module features that matter for enterprise security

While memory modules themselves do not usually contain complex firmware, features such as on-die ECC, internal redundancies, and the vendor’s supply-chain assurances (anti-tampering, traceability) can contribute to overall platform security. For security-sensitive deployments, validate the supply chain and confirm serial-number tracking and documentation.

Firmware interactions and platform security

Memory modules are configured and trained by platform firmware during boot. Ensure your server firmware and BMC implementations are patched to prevent potential side-channel vulnerabilities or training failure modes; always apply vendor security advisories and coordinate memory upgrades with firmware update windows.