Micron MTC40F204WS1RC64BC1R 96GB 6400mhz Pc5-51200 ECC Registered Memory.

Micron MTC40F204WS1RC64BC1R

Micron's MTC40F204WS1RC64BC1R 96GB 6400MHz PC5-51200 ECC Registered Dual Rank 288-pin RDIMM is engineered for high-density, mission-critical server environments where performance, reliability, and error-correcting capability are foundational requirements. This category of memory modules addresses modern data center demands — from virtualization and large-scale databases to memory-intensive AI inference and analytics workloads — by combining high bandwidth, robust error correction (ECC), and server-grade register-based design (Registered or RDIMM) to maximize throughput and system stability.

Key Attributes and Technical Overview

The MTC40F204WS1RC64BC1R series belongs to Micron’s line of advanced DDR5 RDIMMs optimized for enterprise servers and workstations. At a native frequency of 6400MHz and a raw bandwidth rating of PC5-51200, these modules provide substantial improvements in memory transfer rates compared with previous-generation DDR4 parts. They are offered in a 96GB capacity per module, implemented as a dual-rank configuration that balances density and latency. The modules adhere to a 288-pin RDIMM form factor, compatible with a wide range of server motherboards and platforms designed for registered memory.

Performance Characteristics

High-frequency operation at 6400MT/s (megatransfers per second) dramatically increases sustained memory throughput for parallel and sequential workloads, which translates to lower memory bottlenecks in compute clusters, database servers, and virtualization hosts. Dual rank organization enables the memory controller to interleave accesses across ranks, improving effective throughput for multi-threaded and multi-core server CPUs. In real-world scenarios, the improved channel utilization can deliver measurable gains in data-intensive tasks such as in-memory caching, large-scale simulations, and high-performance computing (HPC).

Reliability: ECC & Registered Buffering

ECC (Error-Correcting Code) is a non-negotiable feature for enterprise deployments where silent data corruption must be prevented. The MTC40F204WS1RC64BC1R supports ECC, enabling detection and correction of single-bit errors and detection of multi-bit errors, which reduces the risk of application-level corruption and system crashes. Combined with the RDIMM (registered) design — which inserts a register between the memory controller and the DRAM devices — these modules reduce electrical loading on the memory bus and improve signal integrity. The result is more stable operation across higher memory counts and populated channels, a must for servers running high-memory configurations.

Compatibility and Use Cases

These RDIMMs are designed for compatibility with server platforms that support DDR5 RDIMM, 288-pin memory modules, and registered ECC memory. Typical compatible environments include 2nd- and 3rd-generation server CPU platforms that accept DDR5 registered memory (always check motherboard and vendor compatibility lists). Primary use cases include:

• Virtualization hosts and hyperconverged infrastructure (HCI) where multiple VMs require large memory pools.
• Large in-memory databases and caching layers (e.g., Redis, Memcached) where low-latency, high-throughput memory reduces query times.
• High-performance computing (HPC) clusters and technical computing appliances performing simulations and data analysis.
• Machine learning inference servers that require consistent, fast access to model parameters and feature stores.
• Enterprise-grade storage appliances and SAN/NAS controllers that require memory resiliency and predictable throughput.

Form Factor & Physical Specifications

The 288-pin RDIMM form factor is the standard for DDR5 registered modules. Physically, these modules fit into ECC RDIMM sockets on compatible server motherboards. When planning large deployments, note the thermal profile and the importance of proper airflow: high-density racks populated with multiple 96GB modules should maintain adequate cooling to prevent thermal throttling and ensure long-term reliability.

Density, Scaling and Memory Topology

At 96GB per module, these RDIMMs help system architects reduce the number of modules needed to reach desired memory capacities. For instance, populated across eight memory slots, a single server might achieve 768GB using eight 96GB modules, or scale to multiple terabytes when supported by the platform. The dual rank layout supports efficient channel interleaving, but system-level performance depends on motherboard population rules, CPU memory channel count, and interleaving strategy implemented by the memory controller.

Population Guidance

Proper population order and balance across memory channels are crucial. Many server vendors publish specific guidelines about which slots should be populated first and how ranks interact with channel architecture. For optimal performance with these 96GB dual-rank modules, follow OEM recommendations for channel balancing, and verify BIOS/firmware settings for memory frequency and timing profiles to ensure the modules run at their rated 6400MT/s speeds under supported conditions.

Power Efficiency & Thermal Management

DDR5 introduced architectural efficiencies vs DDR4, such as on-die ECC, power management improvements, and improved bank group/scheme optimizations that can reduce idle power draw while allowing higher peak throughput. These RDIMMs are designed to operate within standard RDIMM voltage envelopes, but since they deliver higher speed and density, careful rack-level thermal planning is needed. Implement airflow management (front-to-back cabling, blanking panels, baffles) and monitor ambient vs inlet temperatures; this preserves module longevity and prevents reduced performance due to overheating.

Latency, Timings and Real-World Throughput

While raw frequency (6400MT/s) is an essential indicator of memory bandwidth, true system performance also depends on CAS latency and command timing parameters. Dual rank modules may introduce slightly different latency behavior compared to single rank parts; however, higher clock rates and improved interleaving often offset those differences in bandwidth-sensitive workloads. When tuning systems for maximum throughput, professionals typically test a matrix of frequency and timing settings under representative workloads to find the best balance between latency sensitivity and sustained bandwidth.

Tuning Tips for Administrators

• Use vendor-supplied validation tools to verify SPD (Serial Presence Detect) information and ensure modules are recognized correctly by the BIOS/UEFI.
• Enable performance-enhancing BIOS options such as memory interleaving if supported by your platform.
• Test different DIMM population densities (e.g., single-socket vs dual-socket configurations) to measure the real-world impact of ranks and channels on your specific workloads.
• Consider firmware updates for both BIOS and BMC to ensure latest memory compatibility improvements are applied.

Quality, Testing and Micron’s Manufacturing Standards

Micron is a recognized leader in DRAM manufacturing with rigorous in-line testing and post-production validation. Enterprise RDIMMs are typically tested across voltage ranges, temperature cycles, and stress patterns to ensure reliability under server workloads. Quality control measures include burn-in testing, thermal cycling, and electrical validation to reduce early-life failures and maintain strict failure-in-time (FIT) targets for data center deployments.

Warranty & Support Considerations

Enterprise modules often come with manufacturer warranties and support channels that include RMA processes for failed modules under warranty. When procuring Micron RDIMMs, verify warranty terms, support SLAs, and whether your vendor offers advance replacement services for critical environments. Keep module part numbers, serials, and purchase records accessible to speed case resolution when needed.

Security and Data Integrity Features

ECC is a primary contributor to data integrity, but modern server memory solutions may include additional safeguards like on-die ECC for DRAM arrays, CRC checks on command/address buses, and platform-level telemetry to detect anomalous behavior. These features help prevent silent corruption and support forensic analysis when errors occur. For systems handling regulated data or high-value transactions, these layers of protection are essential to maintaining compliance and trust.

Telemetry & Monitoring

Many modern server platforms provide event logging, machine check architecture (MCA) reporting, and hardware error records. Integrating these logs with centralized monitoring systems (e.g., Prometheus, ELK, or vendor-specific tools) enables proactive detection of memory-related issues, trend analysis, and capacity planning. Administrators should enable and review ECC error logs, thermal warnings, and DIMM presence/status reports as part of routine infrastructure health checks.

Procurement and Total Cost of Ownership (TCO)

While enterprise RDIMMs like the Micron MTC40F204WS1RC64BC1R may carry a higher per-module cost than consumer memory, the TCO for data centers depends on more than initial price. Savings accrue through fewer required modules to reach target capacity, reduced risk of downtime due to robust ECC and registered buffering, and improved performance per rack unit. Long-term benefits include simplified maintenance, predictable performance scaling, and lower operational risk — factors that often justify the premium for mission-critical deployments.

Comparing DDR5 RDIMM Variants and Alternatives

Within the DDR5 RDIMM ecosystem, you’ll find variations in capacity, rank organization (single, dual, quad rank), and speed bins (e.g., 4800, 5200, 5600, 6400 MT/s). The 96GB dual rank, 6400MT/s SKU represents a middle-to-high tier in terms of both density and performance. When comparing alternatives, consider the trade-offs:

• Single Rank vs Dual Rank: Single rank DIMMs may offer slightly lower latency, but dual rank often improves throughput via interleaving.
• Speed Bins: Faster bins increase bandwidth but may require more stringent platform validation and BIOS tuning.
• Capacity vs Slot Count: Higher-capacity modules reduce the number of populated slots and can lower power consumption and cabling complexity per GB.

Environmental and Regulatory Considerations

Memory modules themselves have relatively modest environmental footprints compared to other IT equipment, but organizations should still consider proper e-waste disposal and recycling of modules when they reach end of life. Ensure procurement and disposal follow local regulations for electronics recycling and any corporate sustainability policies. 

Related Categories and Subcategories

This category often sits alongside related memory product groups and server hardware segments, such as:

• Other DDR5 RDIMM capacities (32GB, 48GB, 64GB, 128GB) and rank variants.
• LRDIMM (Load-Reduced DIMM) alternatives for ultra-high-density systems where maximum capacity with reduced electrical load is required.
• Server-class NVMe storage solutions and persistent memory modules that complement DRAM for tiered-memory architectures.
• Memory kits validated for multi-socket configurations and OEM-ready memory sets with matched binning and firmware.