MTA72ASS8G72LZ-2G9J2 Micron 64GB Pc4-23400 DDR4 SDRAM 2933MHz Memory
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Micron 64GB DDR4-2933MHz memory
Discover the Micron MTA72ASS8G72LZ-2G9J2—an enterprise-grade 64GB DDR4 module engineered for high-performance servers and workstations. This registered ECC LRDIMM delivers reliable throughput, low latency, and robust data integrity for demanding workloads.
Manufacturer and part details
- Brand: Micron
- Part number: MTA72ASS8G72LZ-2G9J2
- Product name: 64GB memory module
Technical specifications
Performance and technology
- Storage capacity: 64GB
- Memory technology: DDR4 SDRAM
- Module count: 1 × 64GB
- Bus speed: 2933MHz / PC4-23400
- CAS latency: CL21
- Rank configuration: 4Rx4
Reliability and data protection
- Data integrity: ECC (Error-Correcting Code) for fault detection and correction.
- Signal processing: Registered (buffered) for improved electrical stability.
Compatibility and use cases
- Server platforms: Ideal for enterprise servers and data center deployments.
- Workloads: Virtualization, databases, analytics, and high-throughput applications.
- Scalability: Suitable for multi-channel memory configurations.
Physical characteristics
- Form factor: 288-pin LRDIMM
- Shipping dimensions: 1.00 (height) × 6.75 (depth)
- Shipping weight: 0.20 lb
MTA72ASS8G72LZ-2G9J2 DDR4 ECC Memory Category Overview
The Micron MTA72ASS8G72LZ-2G9J1 64GB 4Rx4 PC4-23400 DDR4-2933MHz ECC Memory resides within a specialized enterprise memory category designed to support mission-critical computing environments that demand stability, scalability, and data integrity. This category encompasses high-capacity DDR4 ECC registered memory modules engineered for server platforms, workstation-class systems, and data center infrastructures where reliability and sustained performance are paramount. Memory solutions in this category are manufactured under stringent quality controls, validated against enterprise workloads, and optimized for continuous operation under heavy computational loads.
Within modern IT architectures, this class of DDR4 ECC memory forms a foundational component of scalable computing, enabling dense memory configurations while maintaining signal integrity across multi-DIMM installations. The category is characterized by high module capacities such as 64GB, advanced error detection and correction capabilities, and compatibility with server-grade chipsets that support registered DIMMs. These characteristics collectively define a memory ecosystem that prioritizes uptime, predictable behavior, and protection against data corruption.
Micron Engineering and Manufacturing Standards
Micron is globally recognized for its semiconductor engineering expertise and vertically integrated manufacturing model, which plays a critical role in the consistency and longevity of products within this memory category. The MTA72ASS8G72LZ-2G9J1 module benefits from Micron’s in-house DRAM fabrication, component-level validation, and lifecycle management practices. This approach ensures that each memory module aligns with JEDEC specifications while also meeting Micron’s internal benchmarks for endurance and electrical performance.
Enterprise memory modules from Micron undergo extensive testing across temperature ranges, voltage tolerances, and workload simulations to ensure dependable operation in real-world deployments. This rigorous validation process supports long-term availability and minimizes the risk of unexpected incompatibilities during system upgrades or maintenance cycles. As a result, this category is often selected by system integrators and IT professionals seeking predictable behavior across large-scale deployments.
DDR4 Architecture and Performance Characteristics
DDR4 technology represents a significant advancement over previous memory generations, offering increased bandwidth, improved power efficiency, and enhanced reliability features. The PC4-23400 classification corresponds to a data transfer rate of 2933 megatransfers per second, enabling rapid access to large datasets and efficient handling of parallel workloads. Memory modules within this category are optimized for balanced performance, ensuring that latency, throughput, and stability coexist harmoniously in enterprise environments.
The DDR4 architecture utilized by this category supports higher memory densities per module, allowing servers to scale memory capacity without excessive slot consumption. This is particularly beneficial for virtualization platforms, database servers, and in-memory analytics applications where memory availability directly impacts performance. The 2933MHz operating frequency delivers substantial bandwidth improvements while maintaining compatibility with supported server platforms.
Registered DIMM Design and Signal Integrity
This category of memory modules employs a registered DIMM design, commonly referred to as RDIMM, which incorporates a register between the memory controller and the DRAM chips. The register buffers command and address signals, reducing electrical load on the memory controller and improving signal integrity across multiple DIMMs. This design enables servers to populate more memory modules per channel while maintaining stable operation.
Registered memory is essential for high-capacity configurations, as it mitigates signal degradation that can occur when numerous unbuffered DIMMs are installed. The 4Rx4 organization of the Micron module reflects a quad-rank configuration optimized for enterprise platforms that support high memory density. This design choice enhances scalability and supports complex workloads that benefit from large contiguous memory pools.
4Rx4 Memory Organization Explained
The 4Rx4 configuration indicates that the module contains four ranks of memory, each composed of x4 DRAM devices. This organization allows for increased capacity while maintaining manageable signal paths. In enterprise servers, quad-rank modules are often used to maximize memory per slot, reducing the total number of DIMMs required to achieve target capacities.
This memory organization is particularly advantageous in systems that support advanced memory interleaving and channel balancing. By distributing memory access across multiple ranks, the system can achieve improved throughput and more efficient utilization of the memory bus. The category’s emphasis on 4Rx4 configurations reflects its suitability for high-density, performance-oriented deployments.
Compatibility with Server Platforms
The Micron MTA72ASS8G72LZ-2G9J1 and similar modules within this category are designed for compatibility with a wide range of enterprise server platforms that support DDR4 ECC registered memory. These platforms typically include systems based on Intel Xeon and AMD EPYC processors, which are engineered to leverage the benefits of ECC and registered DIMM architectures.
Compatibility extends beyond basic electrical support to include firmware-level validation and BIOS recognition. Memory modules in this category are often listed on server vendor qualification lists, ensuring seamless integration and reliable operation. This level of compatibility reduces deployment risks and simplifies maintenance in multi-vendor environments.
Data Integrity and System Stability
Data integrity is a core concern in enterprise computing, and memory plays a central role in maintaining system stability. ECC functionality, combined with Micron’s manufacturing quality, provides a robust defense against transient errors caused by electrical interference or component aging. This proactive error management contributes to higher system uptime and reduced troubleshooting overhead.
System stability is further reinforced by the predictable behavior of registered memory under heavy loads. By buffering signals and reducing electrical stress on the memory controller, RDIMM designs minimize the likelihood of timing-related issues that could otherwise lead to crashes or data loss. This reliability makes the category suitable for always-on environments.
Quality Assurance and Validation Processes
Memory modules within this category are subject to comprehensive quality assurance processes that encompass component screening, assembly inspection, and functional testing. Micron employs advanced testing methodologies to verify performance under various operating conditions, ensuring that each module meets or exceeds enterprise reliability standards.
Validation extends to interoperability testing with major server platforms and operating systems. This ensures that the memory behaves as expected in real-world environments, reducing the likelihood of unexpected issues during deployment. The emphasis on quality assurance reinforces the category’s reputation for dependable performance.
