Micron MTC20F2085S1RC64B 32GB 6400MHz PC5-51200 DDR5 SDRAM Memory Module.

Micron 32 GB DDR5 Server Memory Modules

Discover the high‑capacity, high‑bandwidth world of Micron server‑grade DDR5 memory modules. Within this category, the MTC20F2085S1RC64B exemplifies the cutting‑edge in enterprise memory: a 32 GB, dual‑rank, RDIMM DDR5 module operating at a blistering 6400 MT/s (PC5‑51200). Designed for demanding server environments where both performance and reliability are indispensable, these modules occupy a critical niche in data center, virtualization, and high‑throughput computing deployments.

Core Attributes of the Micron MTC20F2085S1RC64B Series

• 32 GB Capacity – Substantial memory footprint per module, allowing high density per DIMM slot for scalable server deployments.
• DDR5 SDRAM Technology – Next‑generation memory architecture delivering greater speed, efficiency, and bandwidth than its DDR4 predecessors.
• Data Rate: 6400 MT/s (PC5‑51200) – Ultra‑fast throughput for latency‑sensitive workloads and real‑time processing.
• Dual‑Rank (2R x8) Organization – Balanced rank‑based memory structure to optimize signal timing and enable higher module density.
• Error‑Correcting Code (ECC) – Ensures data integrity by detecting and correcting memory errors for uninterrupted server operations.
• Registered (Buffered) Design – Stabilizes electrical load on memory buses, enhancing reliability in multi‑DIMM server systems.
• CAS Latency: CL52 – Strikes a balance between speed and responsiveness suitable for enterprise workloads.
• Operating Voltage: 1.1V – Low‑voltage DDR5 operation that reduces power consumption and thermal output compared to DDR4 modules.
• 288‑Pin RDIMM Form Factor – Industry‑standard server DIMM interface with broad compatibility across modern server platforms.

Advantages of DDR5 over DDR4 in Server

Substantially Increased Bandwidth

DDR5 memory modules such as this series deliver significantly higher data throughput compared to DDR4. With the 6400 MT/s clock rate, these modules enable rapid data movement between CPU and memory—this translates to improved application responsiveness, faster computation in virtualization and real‑time analytics, and reduced bottlenecks in multi‑threaded environments.

Better Energy Efficiency

Operating at a lower voltage of 1.1 volts, the Micron DDR5 modules help reduce system‑wide power draw. In large server racks, incremental power savings per module can scale to large efficiencies, reducing cooling requirements and contributing to lower TCO (Total Cost of Ownership).

Enhanced Reliability via ECC and Registered Features

Combining ECC with registered buffering makes these modules particularly resilient. ECC ensures single‑bit errors are corrected on the fly, safeguarding mission‑critical data. The registered architecture alleviates electrical stress on the memory controller when multiple DIMMs are installed, enabling stable multi‑DIMM and high‑memory‑density configurations without compromising signal integrity.

Use Cases Scenarios

Virtualized Environments and Hypervisors

Virtualized server farms, running platforms such as VMware vSphere, Microsoft Hyper‑V, or KVM/QEMU, demand both large memory capacity and low‑latency performance. The MTC20F2085S1RC64B, with its 32 GB size and 6400 MT/s speed, supports high VM density, efficient memory overcommit, and rapid guest OS switching—keys to maximizing utilization in virtual clusters.

In‑Memory Databases and Real‑Time Analytics

Data‑intensive workloads like in‑memory databases (e.g. SAP HANA, Redis, VoltDB) or live analytics frameworks require extremely fast data access and predictable latency. The high‑speed DDR5 bus and ECC robustness of these Micron modules ensure the integrity and quick delivery of memory‑resident datasets.

Cloud‑Native Architectures and Containerized Workloads

In microservices or container‑based infrastructures (e.g. Kubernetes, Docker Swarm), system memory is often shared intensively across dynamic workloads. The resilience of ECC and the capacity per DIMM make these modules ideal for sustaining container density while preserving isolation and uptime.

High‑Performance Computing (HPC) Clusters

HPC environments—spanning scientific computing, simulation, AI/ML model training—benefit from DDR5's high bandwidth and dual‑rank architecture, which optimizes access patterns. The precise timing (CL52) and memory prefetch designs of DDR5 also help maximize throughput in parallel compute nodes.

Data Center Servers and Cloud Hosting Infrastructure

In large‑scale data centers, racks packed with servers must deliver both capacity and uptime. The MTC20F2085S1RC64B fits well into such systems, offering density per slot, error correction for uptime, and voltage efficiency to reduce overall cooling and power draw.

Technical Breakdown and Supplier Information

• Vendor: Micron Technology – globally recognized memory manufacturer with rigorous testing and enterprise‑grade quality assurance.
• Part Number: MTC20F2085S1RC64B – specific identifier enabling accurate selection for system compatibility and procurement processes.
• Module Count: 1 × 32 GB – single‑channel module, scalable in channels and bank arrays across configurations.
• Physical Layout: 288‑pin RDIMM – industry conformity ensures interoperable use in mainstream server motherboards and prebuilt systems.
• Latency Profile: CL52 – optimized balance between throughput and responsiveness for enterprise workloads.
• Voltage Consumption: 1.1 V – energy‑efficient design for large scale deployments.

Ranking Advantages in Memory

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Comparing Dual‑Rank (2R x8) to Single‑Rank (1R x8/x16) in Enterprise Context

• Memory Density – Dual‑rank modules pack more memory per module, reducing total module count needed for capacity targets.
• Signal Timing – DDR5 dual‑rank layout helps maintain stability across multiple DIMMs and channels, especially important in multi‑bank servers.
• Performance Trade‑Offs – While dual‑rank designs may introduce negligible additional access latency compared to single‑rank, the greater capacity and parallelism typically outweigh such effects in server workloads.

Server Architecture Impacts

Most modern server boards feature multi‑channel memory architectures, where each channel supports multiple DIMMs. Using dual‑rank Micron modules across channels helps maximize throughput, ensuring full utilization of the memory bus. Proper channel balancing—installing identical modules across all channels—also ensures peak pairing and avoids performance penalties.

Motherboard and CPU

Before deploying, verify that your server platform supports DDR5 RDIMM at 6400 MT/s. Many latest‑generation server CPUs and chipsets (e.g. Intel Xeon 5XXX/P-series, AMD EPYC 9004-series) enable these speeds with appropriate BIOS configurations. Confirm channel population rules (e.g. populating all slots in multiples of two or four) to avoid suboptimal clocking.

Firmware and BIOS Tuning

While modern systems auto‑negotiate memory timing and voltage, some boards may require manual enabling of XMP/EXPO profiles or vendor‑specific BIOS tweaks to unlock the full 6400 MT/s speed. Ensure firmware is updated to the recommended level for DDR5 stability.

Thermal and Power Planning

Although these modules operate at a modest 1.1 V, high‑density arrays can still generate measurable heat. Ensure adequate case airflow, heat sinks, or chassis cooling may be necessary in dense blade servers or rack deployments to maintain reliability under load.

Return on Investment (ROI)

With high capacity per slot and superior performance, fewer modules are required for a given memory size, reducing per‑module licensing and management overhead. Coupled with energy savings and reduced maintenance (thanks to ECC reliability), total cost of ownership improves over time.

Expansion and Scalability Insights

Scaling Memory in Multi‑Socket Systems

In dual‑ or quad‑socket servers, memory upgrades often involve pairing identical modules across multiple memory channels and sockets. The compact 32 GB RDIMM format allows administrators to precisely scale capacity—512 GB or more per system—while keeping slot usage efficient.

Modular Upgrade Strategy

For phased memory upgrades, combining this DDR5 module with other capacities (e.g. future 64 GB or 128 GB DDR5) is possible, provided ranks and speed align. Always consult memory population guidelines to maintain channel symmetry and stable performance.This detailed specification list not only aids buyers in comparing similar modules, but also enhances search engine understanding of the product’s distinct features—driving organic traffic among IT procurement professionals and technical decision‑makers.

Best Practices for Integration and Deployment

• Always match module rank and speed across installed DIMMs to maximize multi‑channel performance.
• Update BIOS/firmware to the latest vendor release to ensure full 6400 MT/s support and timing stability.
• Populate memory in accordance with channel configurations—e.g., one module per channel for single‑socket boards, or matched per socket in multi‑socket servers.
• Monitor operating temperatures under load; consider heatsinks or increased airflow in densely packed environments.
• Run memory diagnostics or burn‑in tests post‑deployment to catch potential issues early in enterprise systems.

City‑Use and Market Positioning

Micron's MTC20F2085S1RC64B module fits the urgent needs of markets including cloud services, fintech, health‑tech, and edge AI—where large datasets and high transaction rates demand fast, reliable server memory. By positioning this category with both detailed technical content and user benefit narratives, the page is primed for strong relevance in enterprise search queries and superior ranking in related SERPs.