P06774-001 HPE High Performance Heatsink For ProLiant DL325 Gen10.

Product Overview of HPE ProLiant DL325 G10

The HPE ProLiant DL325 G10 High Performance Heatsink Kit offers a reliable thermal management solution designed specifically for enterprise-grade server systems. Engineered to maintain system integrity, this kit ensures optimal heat dissipation in high-demand environments.

General Information

• Manufacturer: Hewlett Packard Enterprise (HPE)
• Part Number: P06774-001
• Component Category: HPE ProLiant Server Accessories
• Sub-Group: Precision Engineered Heatsinks
• Target Server Model: DL325 Gen10 Platform
• Form Factor: 1U (one rack unit) high performance heatsink
• Compatible Platform: ProLiant DL325 Gen10 server family

Core Features of the DL325 Gen10 Heatsink Kit

Thermal Optimization and Performance

• Improves heat conduction and dispersion within rack-mount configurations
• Supports sustained CPU performance under continuous load
• Reduces thermal throttling for mission-critical tasks

Tailored Compatibility

• Purpose-built for the HPE ProLiant DL325 G10 server architecture
• Compatible with select AMD EPYC processor configurations
• Meets OEM specifications for fit and airflow

Enterprise-Grade Reliability

• Manufactured by Hewlett Packard Enterprise for consistency and durability
• Trusted for data center deployments and 24/7 operational uptime
• Robust aluminum construction with precision fins for maximum airflow

Engineered for the G10 Series

• Exact match for DL325 Gen10 – ensures seamless installation
• Supports dual-socket configurations with balanced thermal load
• Validated by HPE for high-efficiency performance cooling

Advanced Airflow Dynamics

Designed to complement internal chassis airflow, this heatsink efficiently channels heat away from processors using a dense fin array, minimizing hotspots and enhancing longevity of sensitive server components.

Precision Manufacturing Standards

Every unit of the P06774-001 undergoes rigorous quality testing to meet HPE’s stringent hardware standards, ensuring consistent thermal performance and compatibility in enterprise environments.

Additional Technical Attributes

• Product Type: High-Performance Server Cooling Component
• Material: Industrial-grade aluminum alloy
• Cooling Type: Passive Heatsink with optimized thermal footprint
• Installation: Tool-less integration with Gen10 motherboard layouts

Inventory and Availability

• Readily available through authorized resellers and IT hardware suppliers
• Suitable for new server builds or as a replacement for existing DL325 G10 units
• Listed under SKU: 745034 with multiple sourcing options

Use Cases and Deployment Scenarios

Ideal for data-intensive workloads such as virtualization, database management, and private cloud hosting. Ensures processors operate within safe thermal margins even under intensive usage patterns.

Upgrade or Replacement Solution

Whether upgrading your thermal solution or replacing a failed component, the P06774-001 delivers exceptional cooling performance for maintaining server efficiency and prolonging hardware lifespan.

P06774-001 High Performance 1U Heatsink for HPE ProLiant DL325 G10

The P06774-001 is a high performance thermal module designed specifically for the HPE ProLiant DL325 Gen10 (G10) server. It serves as an essential cooling component in one‑rack‑unit (1U) configurations, delivering superior heat dissipation and enabling the system to maintain optimal processor performance under heavy workloads.

Core Functionality & Thermal Performance

High‑Efficiency Heat Dissipation

The P06774-001 employs refined fin geometry and thermal conduction materials to absorb CPU heat rapidly. By maximizing surface area and optimizing the airflow path, this heatsink helps the processor stay cooler, reducing the risk of thermal throttling under sustained or burst workloads. :contentReference[oaicite:3]{index=3}

Material & Construction Quality

• Typically constructed from high thermal conductivity metals—such as aluminium or aluminium alloy—chosen for durability and consistent heat transfer. :contentReference[oaicite:4]{index=4}
• Precision machined base plate ensuring proper contact with CPU heat spreader; ensures minimal thermal interface resistance. (Note: users must ensure correct mounting and use of thermal compound.)
• Rigorous quality testing in many listings (even for refurb units) to confirm structural integrity and fit accuracy. :contentReference[oaicite:5]{index=5}

Compatibility & Fitment within DL325 Gen10 Ecosystem

Server Chassis

Designed to integrate seamlessly with the HPE ProLiant DL325 Gen10 server, the P06774-001 accommodates the thermal envelope of compatible CPUs (e.g. AMD EPYC variants) in the 1U rack configuration. It aligns with the internal mechanical layout, allowing airflow from front intake fans through the heatsink fins and out the rear exhaust without impeding adjacent components. Ensuring that other cooling components—fans, air shrouds—are intact and correctly installed is crucial. :contentReference[oaicite:6]{index=6}

Interoperability and Related Parts

• Works in concert with the server’s fan array; high performance heatsink often used when higher wattage processors are installed, demanding more efficient heat removal. :contentReference[oaicite:7]{index=7}
• Mounting mechanism matches DL325 Gen10’s CPU retention bracket/design, ensuring stability and correct seating. Mis‑alignment or loose mounting can degrade thermal performance significantly.
• Often compared to or offered alongside other heatsink variants (standard vs high‑performance) depending on power draw, ambient temperature, and use case. Users selecting CPUs with higher TDP may require high‑performance heatsinks like P06344‑001. :contentReference[oaicite:8]{index=8}

Benefits & Advantages

Improved Operational Stability

By maintaining lower CPU temperatures, the P06774-001 aids in preventing unexpected shutdowns, system crashes, or performance throttling. Servers under heavy utilization—virtualization, large‑scale databases, compute‑intensive applications—benefit significantly from a robust heatsink capable of dissipating peak thermal loads.

Extended Service Life of Components

• Reduced thermal stress on key components such as CPUs, VRMs (voltage regulator modules), memory DIMMs adjacent to the CPU socket.
• Lower operating temperatures mean less expansion/contraction cycles; helps in prolonging solder/joint integrity and avoiding thermal fatigue.
• Minimizes risk of heat‑related degradation over time (e.g. oxidation, capacitors deterioration) thereby potentially lowering maintenance costs.

Energy Efficiency & Noise Reduction

Efficient passive thermal transfer from the P06774-001 allows the server’s cooling fans to operate at lower RPM under moderate loads. This can reduce power consumption and diminish ambient noise. In data centers or server rooms where many units are running, even modest gains per server translate into meaningful cost savings and improved cooling infrastructure efficiency.

Thermal Headroom for Upgrades

Users planning to upgrade CPU to higher wattage models or adopting workloads that generate more heat (e.g. ML/AI, encryption, high frequency network traffic) will appreciate that this heatsink gives extra margin. It allows deployment of more demanding processors without immediately hitting thermal limits or forcing aggressive fan curves.

Proper Mounting & Thermal Interface Material (TIM)

Ensuring correct installation is indispensable. Mount the heatsink securely using the proper brackets or screws, apply a high‑quality thermal paste or pad, ensure flat and clean surfaces. Poor contact or misalignment can dramatically degrade cooling efficacy.

Ambient Temperature & Airflow

• Ensure that server rack environment is within recommended operating temperature ranges (e.g. ~10‑35°C / 50‑95°F depending on spec) and that cold air intake is unobstructed. DL325 Gen10 specifications frequently indicate similar ambient ranges. :contentReference[oaicite:9]{index=9}
• Maintain clean, dust‑free air filters and fan trays; dust buildup reduces airflow and increases heat resistance across the heatsink fins.
• Check that adjacent components (memory, expansion cards) do not block airflow channels; maintain cable management practice for optimal flow.

Alternate High‑Perf Heatsink Kits for DL325 G10

• HPE P06774-001 1U High Performance Heatsink Kit — alternative air‑cool option for DL325 G10 with similar goals for heat management. :contentReference[oaicite:10]{index=10}
• Other part numbers such as P13751‑001 (Gen10 Plus) for upgraded or more current server variants. :contentReference[oaicite:11]{index=11}

Use Cases & Ideal Scenarios

Virtualization & Multi‑Tenant Environments

When hosting many virtual machines, containerized workloads, or partitioned environments, CPU utilization tends to be high and variable. The P06774-001 helps prevent heat spikes and keeps CPU temperatures within safe limits, thereby avoiding performance degradation over time in multi‑tenant or cloud‑style deployments.

High‑Performance Computing & Batch Processing

In scenarios involving ML/AI model training, data analytics, scientific computations, rendering, or large data set operations, processors often operate at near full load for extended periods. A heatsink that efficiently disperses heat becomes critical; without it, CPUs can throttle, which slows job completion time, or even shut down under thermal protection mechanisms.

Data Center & Rack Density Considerations

• In high rack density environments, cumulative heat from multiple units adds up; efficient heatsinks like P06774-001 reduce the cooling burden on the data center’s HVAC system.
• Better passive heatsink performance can reduce reliance on high‑rpm fans or additional air conditioning, lowering operational expenses.
• Improved thermal margin can enable more aggressive consolidation of workloads, enabling more throughput per rack with lower failure risks.

Operating Environment Constraints

• If ambient temperatures are high (>35‑40°C), even high performance heatsinks can struggle without sufficient airflow.
• Restricted airflow inside rack due to obstructed vents, cable clutter, blocked fan trays, or poor rack layout will reduce effectiveness significantly.
• Noise trade‑offs: while the component itself is passive in many respects, to get full benefit one often lets fans run at higher speed or uses supporting airflow, which may raise acoustic levels.

Optimization Tips for Best Thermal Outcome

Cleanliness & Regular Service

Dust accumulation on fins or base surfaces degrades thermal conductivity; schedule periodic cleaning to remove dust or debris. Check for oxidization or discoloration on mating surfaces. Reapply thermal interface material if old, degraded, or improperly applied.

Ensure Airflow Paths Remain Unobstructed

• Use proper front‑to‑rear airflow configuration in rack setup, ensuring cold air enters from front and warm air exits rear.
• Avoid placing equipment that generates heat directly adjacent without spacing; leave space between units if airflow is impeded.
• Use appropriate cable management; tuck cabling to sides so that airflow is not blocked.

Monitor Thermal Performance & Sensor Readings

Use server management tools (like HPE iLO) or operating system sensors to keep an eye on CPU temperature, fan speed, and internal ambient temperature. If you observe frequent high temperatures, throttling, or fan speed spikes, check heatsink seating, verify no damage, and confirm your cooling policy settings.

Keywords & Phrases to Look For

• “HPE 1U high performance heatsink”
• “DL325 Gen10 heatsink P06774-001”
• “High wattage CPU cooling for DL325 G10”
• “Server heatsink upgrade for Gen10 EPYC processors”
• “Thermal module 1U DL325”