HPE P11444-Z91 32GB DDR4 3200MHz PC4-25600 Dual Rank Memory Module.

Superior Memory Performance with P11444-Z91 32GB DDR4 3200 MT/s RDIMM

The P11444‑Z91 HPE 32 GB DDR4 3200 MHz (PC4‑25600) Dual Rank Smart Memory Module is engineered for enterprise-grade performance with uncompromising reliability. Tailored to enhance data center workloads, virtualization environments, and mission-critical applications, this RDIMM combines high-speed throughput, advanced error correction, and cross‑platform compatibility to deliver the bandwidth, integrity, and scalability modern business demands.

Core Specifications and Technical Highlights

• Capacity per module: 32 gigabytes (GB) single-component design for high‑density memory configurations.
• Memory generation: DDR4 SDRAM technology providing enhanced performance and efficiency over previous DDR3 generation.
• Transfer rate: 3200 MT/s (megatransfers per second), also annotated as DDR4‑3200 or PC4‑25600, ensuring rapid data access and sustained throughput.
• Form factor: Registered Dual In-line Memory Module (RDIMM) with 288 pins, facilitating electrical buffering and improved signal stability.
• Error correction: ECC (Error‑Correcting Code), providing continuous single‑bit error detection and correction for unmatched system resilience.
• Rank configuration: Dual Rank x4 (2Rx4), offering optimized channel utilization, higher overall capacity, and balanced memory access performance.
• CAS latency: CL22, indicating the number of clock cycles between command and data availability; offering a balanced trade‑off between speed and system timing.

Architectural Advantages of Dual Rank x4 Registered Modules

Dual Rank memory modules split memory chips into two separately accessible banks (“ranks”). Coupled with x4 data width per chip and registered (buffered) design, this architecture allows:

• Expanded capacity: By grouping multiple memory chips into two ranks, each module delivers 32 GB without sacrificing performance.
• Improved memory bus integrity: Registration mitigates electrical loading, especially in multi-module setups, resulting in greater compatibility and stability.
• Enhanced multi-threaded performance: Dual rank can enable higher data throughput on certain server platforms, especially when memory interleaving is supported.
• Scalability: Facilitates high-capacity memory builds—critical for virtualization, large databases, and in‑memory computing.

High Throughput at 3200 MT/s: Matching Speed with Precision

Operating at 3200 MT/s, this module achieves a theoretical peak transfer rate of 25.6 GB/s per module. Benefits include:

• Sustained multi-core performance: Ideal for CPU-intensive applications such as virtualization, large-scale databases, and in‑memory analytics.
• Faster application loading: Reduces time-to-data and accelerates application responsiveness under heavy concurrent usage.
• Optimized data throughput: Ensures that downstream components like CPUs and storage systems remain fed with data efficiently.

Platform Compatibility: Designed for HPE Gen10 Plus Servers

The P11444‑Z91 module is specifically validated for seamless integration with HPE ProLiant Gen10 Plus and Synergy servers. Supported systems include:

• HPE ProLiant DL360 Gen10 Plus – rack-optimized 1U server ideal for virtualization, cloud services, and compute-dense applications.
• HPE ProLiant DL380 Gen10 Plus – 2U dual‑socket server with balance across compute, memory, and I/O capabilities.
• HPE Synergy 480 Gen10 Plus – composable infrastructure module supporting agile resource deployment in software-defined environments.
• HPE DL110 Gen10 Plus (Telco) – tailored for communication service provider workloads with enhanced performance and reliability.

Full platform validation ensures compatibility with server firmware, support for advanced diagnostics, and optimal operation within HPE’s ecosystem.

Smart Memory Features & Enhanced Diagnostics

HPE Smart Memory delivers features that go beyond standard memory modules:

• Firmware-level integration: The module interacts with server BIOS and management tools for real-time health monitoring.
• Predictive failure analysis: SMART and server management utilities can detect degradation trends and warn of potential memory issues.
• Automatic tuning: Memory speed and timings are auto-configured to match server performance profiles for stability.
• Warranty coverage: As a genuine HPE component, it comes with full manufacturer support and servicing options, unlike third-party or “generic” memory.

High‑Density, High‑Speed Memory

With 32 GB modules and the ability to populate multiple sockets per server, this memory category supports:

• Virtualization consolidation: Run more VMs per host with ample memory reserves for OS and application layers.
• In‑memory data processing: Databases like SAP HANA, in-memory caches, and analytics platforms benefit from large contiguous memory pools.
• High‑performance compute (HPC): Memory-intensive scientific computing and simulation workloads can run close to peak throughput.
• Cloud and hybrid‑cloud services: Efficient memory allocation supports dynamic scaling of cloud VMs and containerized workloads.

Memory Configuration Best Practices

To ensure optimal operation in your HPE server, follow these configuration guidelines:

• Populate channels uniformly: For maximum bandwidth, distribute identical modules across all memory channels.
• Match speeds and timings: Use P11444‑Z91 modules consistently; mixing memory types or speeds can degrade performance or stability.
• Check firmware compatibility: Update server chips, BIOS, and iLO to recommended revisions to maintain Smart Memory support.
• Review capacity limits: Confirm your server’s maximum supported memory per module and total population to stay within warranty and performance specs.

Troubleshooting Memory‑Related Issues

• Use iLO or system boot tools to verify detected memory size and health diagnostics.
• Look for ECC error logs in system event records – ECC memory automatically corrects, but persistent “corrected errors” may indicate module degradation.
• Test suspected modules one at a time to isolate problems in multi-module setups.
• Ensure cooling within the chassis is adequate – overheated memory may produce timing errors or data faults.

Keyword Strategy

To boost visibility in search engine results for this category, it’s vital to embed key phrases naturally throughout your page:

• Primary keywords: “P11444‑Z91,” “HPE 32GB DDR4 3200 MT/s,” “PC4‑25600 RDIMM,” “Dual Rank Smart Memory Module,” “Gen10 Plus ProLiant memory.”
• Secondary variants: “HPE Smart Memory,” “ECC Registered memory,” “HPE ProLiant memory module,” “3200 MHz RDIMM,” “Server memory for Gen10 Plus.”
• Incorporate long‑tail queries such as “32 GB DDR4 registered memory for DL360 Gen10 Plus” or “Smart Memory 3200 MT/s for ProLiant servers.”
• Use synonyms and related terms: e.g. “high‑capacity RDIMM,” “error‑correcting memory,” “enterprise DDR4 server memory,” “high‑density server RAM.”
• Integrate bullet points and headings containing keywords to facilitate both scannability and search‑engine crawling.

Furthermore, internal linking to related categories (e.g. “HPE 16 GB DDR4 RDIMM,” “HPE 64 GB DDR4 memory,” “Gen10 Plus Server accessories”) and external linking to QuickSpecs or official HPE memory compatibility matrices can further reinforce topic relevance (use with appropriate markup outside this snippet).

Upgrade Scenarios and Use Cases

• Memory‑heavy virtualization hosts: Migrating from 16 GB to 32 GB DIMMs doubles per-module capacity—enabling more virtual machines without increasing slot count.
• Database acceleration: For in-memory databases like SAP HANA or large cache layers (Redis, Memcached), 32 GB per slot allows larger working sets in RAM before hitting slower disk storage.
• High‑performance computing clusters: Consolidate memory capacity in fewer slots—simplifies scaling and reduces the potential for signaling issues in densely populated memory configurations.
• Composable infrastructure deployments (Synergy): RAM pools can be allocated dynamically; high‑capacity modules like P11444‑Z91 maximize pooled memory availability for various compute workloads.

Quality Assurance & Manufacturing Standards

• Manufactured under strict quality control protocols, including post‑assembly testing and screening for electrical and timing performance.
• Compliant with industrial standards (JEDEC DDR4, RoHS, and HPE internal validation criteria).
• Each module assigned a unique serial/part number (P11444‑Z91) for traceability and support reference.

Environmental Profile and Power Optimization

• DDR4 technology consumes less voltage (1.2 V nominal) compared to earlier DDR3 (1.35 V) generations, improving energy efficiency per GB.
• Smart memory auto-tunes power during low-demand periods, reducing idle wattage.
• HPE servers with dynamic power management optimize module voltage and refresh rates for overall data center efficiency.

Potential Internal and External Linking Opportunities

• Internal links:
  • “HPE Memory Categories” – linking to broader memory category.
  • “ProLiant Gen10 Plus QuickSpecs” – specifications reference.
  • “HPE Synergy Composable Infrastructure” – architectural context.
  • “RDIMM vs LRDIMM comparison” – educational content for buyers.
• External links (where allowed):
  • Official HPE product documentation pages (QuickSpecs or support portals).
  • JEDEC DDR4 specifications (for deeper background reference).
  • Enterprise computing blogs or hardware review sites that discuss DDR4 innovations and server memory trends.

Key Benefits by Audience

• IT administrators: Simplified memory refresh with high-capacity DIMMs, lowering slot count and easing inventory complexity.
• Data center planners: High-density, power-efficient RAM modules help reduce rack power draw and maximize compute per watt.
• Enterprise operations teams: Smart Memory diagnostics and warranty ease maintenance and proactive failure avoidance.
• Purchasing/procurement: Genuine HPE components reduce risks associated with compatibility, support costs, and service agreements.