M393A4K40EB3-CWE Samsung 32GB PC4-25600 Ddr4-3200Mhz Ecc Memory

Samsung 32GB DDR4 Memory Module

General Information

• Brand: Samsung
• Part Code: M393A4K40EB3-CWE
• Item Name: 32GB DDR4 SDRAM Module

Technical Specifications

Capacity and Technology

• Storage Size: 32GB
• Memory Type: DDR4 SDRAM
• Module Count: 1 x 32GB

Performance Details

• Transfer Rate: 3200 Mbps DDR4-3200 / PC4-25600
• Error Correction: ECC (Error-Correcting Code)
• Signal Handling: Registered DIMM
• Latency Timing: CL22
• Rank Structure: Dual Rank x4

Physical Attributes

Form Factor

• 288-pin RDIMM design

Dimensions

• Height: 1.00 inch
• Depth: 6.75 inches

Weight

• Approximate Shipping Weight: 0.20 lb

M393A4K40EB3-CWE 32GB DDR4 ECC Memory Overview

The Samsung M393A4K40EB3-CWE 32GB PC4-25600 DDR4-3200MHz ECC memory module represents a specialized category of enterprise-grade server memory engineered for sustained performance, reliability, and scalability in professional computing environments. This category focuses on high-density registered dual in-line memory modules designed to meet the rigorous demands of data centers, virtualization platforms, cloud infrastructure, and mission-critical server workloads. By leveraging DDR4 technology operating at 3200MHz, this memory classification delivers higher bandwidth and improved energy efficiency compared to earlier generations, ensuring stable operation in environments that require continuous uptime.

Within the broader memory market, this category distinguishes itself through the integration of error-correcting code functionality and registered buffering. These features are not optional enhancements but core requirements for enterprise deployments where data integrity, signal stability, and predictable performance are paramount. The Samsung M393A4K40EB3-CWE aligns with industry standards for server memory, making it suitable for multi-socket server architectures that rely on consistent memory timing and electrical stability across populated memory channels.

DDR4-3200 Performance Characteristics

Memory modules classified under DDR4-3200, also identified as PC4-25600, operate at a theoretical maximum bandwidth of 25.6GB per second per module. This performance tier is essential for modern processors that feature high core counts and advanced memory controllers. The Samsung M393A4K40EB3-CWE belongs to this category, enabling processors to access data rapidly and efficiently, reducing latency bottlenecks in compute-intensive applications.

The DDR4 architecture introduces architectural enhancements such as increased bank groups and improved prefetch mechanisms, which collectively enhance parallelism in memory access. These improvements are particularly beneficial in enterprise workloads involving virtualization, database transactions, and in-memory analytics. As part of the DDR4-3200 category, this module supports the balance between raw throughput and stability that enterprise IT environments require.

PC4-25600 Bandwidth Optimization

The PC4-25600 designation reflects the optimized bandwidth capabilities inherent in this category of memory. When deployed in matched configurations across multiple memory channels, modules like the Samsung M393A4K40EB3-CWE allow server platforms to achieve near-linear scaling in memory throughput. This characteristic is critical for applications that depend on high-speed data movement, including real-time data processing and high-performance computing workloads.

Bandwidth optimization within this category is also supported by adherence to JEDEC specifications, ensuring consistent interoperability with compatible server motherboards and chipsets. This compliance reduces compatibility risks and supports predictable system behavior under sustained loads.

32GB High-Density Module Classification

The 32GB capacity places this memory module within a high-density classification designed for systems that require substantial memory footprints. Servers and workstations that operate virtual machines, large databases, or memory-resident applications benefit significantly from this capacity tier. The Samsung M393A4K40EB3-CWE exemplifies this category by offering a balance between density and performance without compromising reliability.

High-density memory categories reduce the number of physical modules required to reach target system capacities, which can improve airflow and thermal management within server chassis. This aspect is particularly relevant in rack-mounted environments where space and cooling efficiency are critical considerations.

2Rx4 Dual-Rank Memory Design

The 2Rx4 configuration is a defining characteristic of this category, indicating a dual-rank module constructed with x4 memory chips. Dual-rank designs allow the memory controller to interleave access between ranks, improving overall throughput and efficiency. This architectural choice enhances performance in multi-threaded and multi-user server environments.

x4 memory chips are preferred in enterprise ECC memory categories because they enable more robust error detection and correction mechanisms. The Samsung M393A4K40EB3-CWE leverages this configuration to support advanced reliability features that are essential for mission-critical deployments.

Reliability in Continuous Operation Environments

Memory modules in this category are engineered for continuous operation, often running 24 hours a day in production environments. The combination of ECC and registered buffering minimizes the likelihood of memory-related failures during prolonged use. The Samsung M393A4K40EB3-CWE is aligned with this design philosophy, offering dependable performance under sustained workloads.

This reliability is particularly valuable in sectors such as finance, healthcare, and telecommunications, where system downtime or data corruption can have significant consequences. As part of this category, the module supports the long-term operational stability that enterprise IT infrastructure demands.

Compatibility with Modern 

The Samsung M393A4K40EB3-CWE belongs to a category designed for compatibility with a wide range of modern server and workstation platforms. DDR4-3200 ECC registered memory is commonly supported by contemporary Intel Xeon Scalable and AMD EPYC processors, among others. This broad compatibility ensures that systems can be upgraded or expanded without extensive platform changes.

Memory in this category adheres to standardized voltage requirements, typically operating at 1.2 volts, which contributes to reduced power consumption compared to earlier DDR generations. Lower operating voltage supports energy-efficient data center operations while maintaining performance targets.

Scalability for Growing Infrastructure

Scalability is a defining advantage of this memory category. As organizational requirements evolve, systems can be expanded with additional 32GB modules to increase total memory capacity. The registered ECC design supports this scalability by maintaining signal integrity as memory configurations grow.

The Samsung M393A4K40EB3-CWE exemplifies this scalable approach, allowing IT teams to plan for future growth without replacing existing infrastructure.