M321RBJA0M22-CLP Samsung 256GB Ddr5 6400MBPS Pc5-51200 Memory.

Samsung M321RBJA0M22-CLP 256GB DDR5 Memory

The Samsung M321RBJA0M22-CLP 256GB DDR5 6400MBPS PC5-51200 ECC Registered SDRAM 288-pin RDIMM is a high-capacity, high-performance memory module specifically engineered for next-generation data center servers, enterprise-class workstations, and mission-critical computing environments. As DDR5 technology continues to revolutionize the memory industry, Samsung’s enterprise-grade RDIMM offers superior bandwidth, higher capacities, and robust error correction support, making it ideal for handling modern workloads that demand both performance and reliability.

Manufacturer Information

• Brand: Samsung
• Part Number: M321RBJA0M22-CLP
• Memory Type: DDR5 SDRAM
• Speed: 6400MT/s (PC5-51200)

Technical Specifications

• Storage Capacity: 256GB high-performance memory
• Memory Type: Cutting-edge DDR5 SDRAM technology
• Data Transfer Rate: Blazing-fast 6400 Mbps (PC5-51200)
• Error Correction: Advanced ECC for enhanced reliability
• Module Configuration: Single 256GB module (1 x 256GB)

Performance Attributes

• Bus Speed: DDR5-6400 / PC5-51200 for rapid data handling
• Signal Processing: Registered buffering for stable operation
• CAS Latency: Optimized CL40 timing for efficiency
• Rank Configuration: 4Rx4 design for improved multitasking

Physical Structure

• Module Format: 288-pin RDIMM for broad compatibility
• Compact Dimensions: 1.00" (H) x 6.75" (D) for space efficiency
• Lightweight Build: Weighs just 0.20 lbs for easy installation

Additional Notes

• Ideal for servers, workstations, and high-performance computing
• Engineered for stability under heavy workloads
• Complies with industry-standard DDR5 specifications

Samsung's M321RBJA0M22-CLP 256GB DDR5 6400MT/s PC5-51200 Registered ECC RDIMM represents a new class of high-capacity server memory engineered for data centers, enterprise servers, and high-performance computing platforms. Built to industry specifications with ECC (Error Correcting Code), Registered buffering, and a 288-pin RDIMM form factor, this module balances extreme capacity with reliability and predictable performance under demanding workloads. With a low operating voltage of 1.1V and a CAS latency (CL) of 40, the part is optimized for dense memory configurations and modern CPU architectures that benefit from high-bandwidth DIMMs.

Technical Specification and Memory Architecture

At its core, the M321RBJA0M22-CLP is a DDR5 memory module capable of operating at DDR5-6400 speeds (commonly referred to as 6400MB/s or 6400MT/s), aligning with the PC5-51200 performance class. The module's 256GB capacity is achieved through Samsung's advanced die stacking and high-density memory IC technology. The ECC Registered architecture integrates on-module register and ECC logic that reduce electrical loading on the memory controller while maintaining data integrity by automatically detecting and correcting single-bit errors. The 288-pin RDIMM layout is compatible with server motherboards that support registered DDR5 memory, and the module's 1.1V nominal voltage reflects DDR5's energy-efficient advancements compared to earlier generations.

Scalability and Memory

Scalability is a driver for choosing high-density modules. When designing systems that require terabytes of memory, administrators often choose fewer high-density RDIMMs over many lower-capacity modules to reduce complexity and improve signal integrity. Using the M321RBJA0M22-CLP in multi-channel and multi-socket topologies requires attention to channel population rules and balancing to preserve optimal performance. Properly distributed modules across channels and sockets reduce contention and make the most of a system's memory bandwidth. Samsung's RDIMMs are often incorporated into carefully engineered configurations that maximize theoretical throughput while staying within power and thermal limits.

Thermal and Mechanical Considerations

Physically, M321RBJA0M22-CLP the 288-pin RDIMM conforms to standard server DIMM dimensions but may include heat spreaders or label materials that impact airflow. When deploying in dense rack servers with multiple populated DIMM slots, ensure that chassis airflow and cooling capacity are adequate to dissipate the cumulative heat generated by CPU, storage, and memory. While DDR5's efficiency reduces per-module power in many scenarios, high-density and high-frequency modules still contribute to thermal load. System integrators should verify that airflow paths are unobstructed and that no additional mechanical constraints—such as oversized CPU coolers or cable routing—interfere with DIMM installation or cooling performance.

Bandwidth: PC5-51200 At 6400 MT/s

Operating at 6400 mega-transfers per second, the module’s PC5-51200 rating denotes raw theoretical bandwidth of approximately 51.2 GB/s per module when considering the full 64-bit data path plus ECC overhead. In multi-DIMM configurations, aggregate memory bandwidth scales with the number of populated channels and slots, directly benefiting memory-bound applications such as high-frequency trading engines, real-time analytics, and computational scientific workloads.

ECC and Registered Buffering for Reliability

ECC Registered modules such as the M321RBJA0M22-CLP include on-module buffering and error-correcting logic that protect against single-bit errors and detect multi-bit errors. Registered buffering helps stabilize the electrical interface, enabling higher memory counts and greater overall system reliability. For finance, healthcare, and telecommunication applications where data integrity is non-negotiable, ECC RDIMMs are standard practice and often required by compliance frameworks.

Compatibility is a key consideration for procurement teams and system builders. M321RBJA0M22-CLP the module is intended for server-class motherboards and platforms explicitly supporting DDR5 Registered ECC RDIMMs and PC5-51200 speeds. Compatibility can vary by server vendor and BIOS/firmware revisions; therefore, it is essential to consult motherboard and server vendor memory support lists before purchase. Many OEM platforms require specific SPD (Serial Presence Detect) configuration or may limit maximum supported speed depending on population and CPU memory controller capabilities. Samsung's module adheres to JEDEC standards for DDR5 Registered DIMMs, increasing cross-vendor interoperability when used in supported systems.