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2.2GHz-20GT-UPI

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$11,286.00 $7,344.90
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SKU/MPNSRN54Availability✅ In StockProcessing TimeUsually ships same day ManufacturerIntel Manufacturer WarrantyNone Product/Item ConditionNew Sealed in Box (NIB)
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SKU/MPNPK8072205511700Availability✅ In StockProcessing TimeUsually ships same day ManufacturerIntel Manufacturer WarrantyNone Product/Item ConditionNew Sealed in Box (NIB)

The Intel Xeon 64‑Core 2.2 GHz 20 GT/s UPI processor subcategory defines a robust server-grade compute platform optimized for extreme parallelism, massive virtualization, big data analytics, and large-scale HPC environments. With 64 physical cores (128 threads via Hyper‑Threading), a base clock of 2.2 GHz, and Intel’s 20 GT/s Ultra Path Interconnect (UPI), this CPU class delivers excellent scalability in dual- and quad‑socket configurations. It balances multi-threaded throughput, reliability, and architecture flexibility, targeting enterprises that demand industry-leading multi-node coherence and processing scale.

Understanding the Xeon 64‑Core 2.2 GHz 20 GT/s UPI Architecture

This family sits at the apex of Intel’s scalable Xeon roadmap, built for applications where gain from massive parallel processing outweighs per-core clock speed. The 2.2 GHz base frequency, while modest, provides energy-efficient 24/7 performance under full load, with Turbo Boost frequencies typically in the 3.0–3.4 GHz range (model-dependent).

Primary Technical Specifications

  • 64 physical cores / 128 threads with Hyper‑Threading
  • Base clock: 2.2 GHz, Turbo up to ~3.2 GHz
  • Intel Smart Cache: 60–80 MB shared L3
  • UPI interconnect: 20 GT/s, supporting 2‑socket or 4‑socket coherence
  • Memory subsystem: 8‑channel DDR4/DDR5 ECC, up to 4 TB per socket
  • PCIe lanes: Up to 64 (Gen 4 or Gen 5)
  • TDP: 205–270 W (SKU-dependent)

Core Fabric and UPI Integration

These Xeon processors leverage Intel’s advanced die fabric architecture, utilizing a mesh topology on “Ice Lake Advanced” (10 nm+) or “Sapphire Rapids” (Intel 7) nodes. UPI links at 20 GT/s offer balanced latency and bandwidth across multi-socket servers, making them ideal for shared-memory and NUMA-aware workloads.

Mesh and Memory Interconnect

The mesh network handles L3 cache and DDR channels, enabling efficient intra-socket communication. UPI guarantees cache coherence in 2-4 socket setups, supporting workloads with significant memory and threading demands like SAP HANA, scientific simulations, and web-scale analytics.

Memory Channel Advantages
  • Eight memory channels per CPU—bandwidth of 250–300 GB/s
  • Support for registered and load-reduced DIMMs (RDIMM/LRDIMM)
  • Advanced ECC for high-availability environments
  • NUMA-optimized scheduling for multi-socket performance

Performance Benefits Across Workloads

This Xeon category combines node-level density with energy efficiency, delivering substantial performance across several operational use cases.

High Performance Computing (HPC)

Complex simulations—weather forecasting, structural engineering, molecular dynamics—benefit from high thread parallelism and spatial scaling. With 64 cores per socket and UPI, these processors scale effectively in multi-node, MPI-driven clusters.

Big Data and Enterprise Analytics

Applications like Spark, Flink, and massively parallel databases harness the 128-thread concurrency and memory bandwidth for fast ingestion, transformation, and BI queries, reducing latency at scale.

Cloud & Virtualization Density

Ideal for service provider environments requiring high VM/container density. Intel RDT and hardware resource partitions ensure fairness and service isolation in high-volume cloud setups.

AI Inference & Hybrid ML Pipelines

On-chip AVX‑512 and VNNI support offer efficient AI performance without requiring GPUs, ideal for real-time CPU-based inference in hybrid pipelines or edge aggregation servers.

Security, RAS, and Enterprise Reliability

Enterprise workloads demand both performance and stability; this Xeon class includes comprehensive security and reliability features.

Security Features

  • Intel SGX for protected enclave execution
  • Total Memory Encryption (TME) and Memory Encryption Multi-Key (MKTME)
  • Boot Guard & BIOS Guard for firmware integrity
  • AES‑NI and SHA accelerators for crypto throughput

Reliability, Availability, and Serviceability (RAS)

  • ECC in memory and on-die parity support
  • Machine Check Architecture (MCA) and RAS features
  • RunSure predictive failure analysis
  • Thermal sensors with adaptive frequency control for CHP

Energy Efficiency and Thermal Management

Providing a balance between dense core count and sustainable operation, these CPUs include several power optimizations.

Power and TDP Configurations

  • TDP band of 205–270 W, adjusted per SKU and Turbo configuration
  • Engineered for 2U–4U rackmount systems with air or liquid cooling
  • ASHRAE-compliant airflow solutions preferred

Power Optimizations

  • DVFS and per-core power gating
  • Intel Speed Select Technology for workload-based tuning
  • Efficiency-aware acceleration strategies

Compatibility with Infrastructure & Deployment Roadmaps

This category aligns with enterprise-grade hardware ecosystems and supports future upgrade paths.

Socket and Chipset Compatibility

  • Socket families: LGA 4189 or LGA 4677 depending on generation
  • Chipsets: Whitley-based C621A, C741, or C747
  • Full support for PCIe lanes, UPI links, and memory channels

Storage and Networking Options

  • Up to 64 lanes for Gen4/5 PCIe devices: GPUs, NVMe, NICs
  • Support for high-speed Ethernet, InfiniBand, and NVMe RAID
  • Modular server designs from Supermicro, Dell EMC, HPE, Lenovo, Cisco

Industry Applications and Deployment Scenarios

  • Scientific Research: cluster compute, large simulation farms
  • Financial Computing: Monte Carlo, risk, fraud detection in real time
  • Cloud & Hyperscale: dense VM or container farms
  • Telecommunications: NFV, gateway services, edge consolidation
  • Media & CDN: encode/transcode and content edge caching

Positioning Within Xeon Line-up & SKU Guidance

While higher-clocked Xeons exist, the 64-core 2.2 GHz variant offers superior node-level compute density at reduced per-core frequency—trading single-thread speed for massive concurrency. Recommended SKUs include:

Highlighted SKUs

  • Intel Xeon Platinum 8476H – 64C/128T, full AVX‑512, 270 W TDP
  • Intel Xeon Gold 6454Y – 64C/128T, efficient operation at 205 W
  • Intel Xeon Platinum 8484+ – 64C/128T with enhanced Turbo and throughput
SKU Selection by Deployment Strategy
  • Accelerated HPC: 8476H for AVX‑512-heavy compute tasks
  • General-purpose server farms: 8484+ for balanced scale and cache
  • Cost-optimized cloud nodes: 6454Y for value-per-core efficiency

Procurement Strategy & Value Considerations

New vs Refurbished Options

Refurbished 64‑core Xeon SKUs are often available at significant discounts while maintaining performance standards. Ensure validation and warranty from trusted vendors for mission-critical deployments.

OEM Bundles & Total Cost of Ownership

Major cloud and enterprise vendors—Dell EMC, HPE, Lenovo, Supermicro—offer bundled components optimized for this CPU class, reducing integration effort and optimizing lifecycle cost.

Future Scaling & Lifecycle Roadmap

This Xeon class is engineered for compounding growth. Future CPUs maintain socket standards and UPI links ensuring mixed-generation scalability. Organizations can upgrade core density over time without full system refresh, preserving investment.