878922-001 HPE ProLiant ML110 G10 Standard Screw Down CPU Fan & Heatsink
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HPE 878922-001 ProLiant ML110 G10 CPU Cooling Solution
The HPE 878922-001 CPU fan and heatsink is a high-performance thermal management component specifically designed for HPE ProLiant ML110 Gen10 servers and HPE StoreEasy 1000 Storage systems. Engineered for efficiency and reliability, this standard screw-down heatsink ensures optimal temperature regulation under heavy workloads, protecting your server hardware from overheating.
Key Specifications
- Manufacturer: HPE
- Manufacturer Part Number: 878922-001
- Product Type: Heatsink with integrated fan
- Cooling Mechanism: Radiator
- Radiator Type: Standard screw-down
- Server Compatibility: HPE ProLiant ML110 Gen10, HPE StoreEasy 1000 Storage
Main Features of HPE 878922-001
- Premium cooling solution tailored for HPE ProLiant ML110 Gen10 servers
- Robust screw-down radiator design for secure and stable installation
- High-quality heatsink material ensures efficient heat dissipation
- Compatible with HPE StoreEasy 1000 Storage for versatile server applications
- Enhances system reliability by maintaining optimal CPU temperature
Advantages for Enterprise Systems
- Maintains CPU performance during peak processing tasks
- Reduces server downtime due to overheating
- Enhances energy efficiency by optimizing cooling requirements
- Supports enterprise workloads with minimal noise and vibration
Compatibility Highlights
- Optimized for HPE ProLiant ML110 Gen10 Server models
- Supports HPE StoreEasy 1000 Storage systems
- Interchangeable with other HPE-approved CPU cooling modules
Reasons of Choose the 878922-001 CPU Fan & Heatsink
- Reliable performance for enterprise-grade server operations
- Durable and long-lasting construction minimizes maintenance needs
- Ensures stable CPU temperatures, reducing the risk of thermal throttling
- Easy installation with screw-down mechanism for secure mounting
- Compatible across multiple HPE server and storage platforms
HPE 878922-001 ProLiant ML110 G10 Screw Down CPU Fan & Heatsink — Overview and Purpose
The HPE 878922-001 screw down CPU fan and heatsink assembly is a purpose-built thermal solution designed specifically for the HPE ProLiant ML110 G10 server platform. Engineered to meet server-class thermal demands, this assembly combines a precision-machined aluminum heatsink with a high-performance, screw-down retention mechanism and a matched multi-speed fan to ensure stable, predictable cooling for Xeon-class and HPE-supported processors. Whether you are restoring an offline rack server to service, upgrading a spare part inventory, or performing preventive maintenance, this category focuses on the genuine, replacement, and equivalent cooling units suitable for ML110 G10 systems.
Primary features and functional highlights
The following points capture the core attributes that define the HPE 878922-001 family of CPU cooling assemblies:
- Exact-fit compatibility: Designed to match ProLiant ML110 G10 motherboard mounting patterns and CPU socket clearances.
- Screw-down retention: Robust mechanical fastening that prevents loosening under vibration and repeated thermal cycles.
- Optimized fin geometry: High-surface-area aluminum fins for efficient heat spread and rapid dissipation.
- Server-rated fan motor: Bearings and motor control calibrated for continuous 24/7 operation in data-center environments.
- Thermal interface readiness: Pre-applied or compatible with high-performance thermal paste/pads for minimum thermal resistance.
- OEM and aftermarket availability: Options include HPE-branded OEM parts, refurbished assemblies, and certified third-party equivalents.
Compatibility Matrix and Supported Configurations
Choosing the correct CPU cooling assembly is about confirming mechanical fit, fan header type, airflow direction, and thermal capacity. The 878922-001 has become the de facto choice for the ML110 G10, but variations in server configuration can influence your selection.
Supported server models and CPU families
This part is intended primarily for:
- HPE ProLiant ML110 G10 (single-socket tower and rack-convertible models)
- Intel Xeon Scalable family processors and select Intel Xeon Bronze/Silver/Gold SKUs supported by the ML110 G10 platform
Always confirm your server's exact CPU model and TDP (thermal design power) before purchasing to ensure the heatsink and fan meet cooling requirements.
Motherboard mounting and connector details
Key mechanical and electrical considerations include:
- Mount type: Screw-down (standoffs and screws align with ML110 G10 motherboard holes).
- Fan connector: 4-pin PWM fan header is typical for speed control and hardware monitoring; check your board for 3-pin vs 4-pin compatibility.
- Clearance: Ensure adjacent DIMM modules, VRM heatsinks, and cable routes do not collide with tall fin stacks.
Cross-compatibility notes
Although physically similar coolers may be marketed for other HPE ProLiant models, only the 878922-001 guarantees factory-fit alignment and firmware/BIOS compatibility with the ML110 G10 cooling policy. Using non-compatible assemblies can lead to incorrect fan speeds, warning flags in Integrated Lights-Out (iLO), or ineffective thermal management.
Detailed Technical Specifications
Below is a curated list of the most relevant technical attributes buyers and technicians should verify when sourcing a replacement screw down CPU fan and heatsink for the ML110 G10.
Mechanical and thermal specifications
- Height: Designed to meet chassis clearance for the ML110 G10 tower height and optional rack mounts.
- Base material: Copper or nickel-plated copper base (where specified) for improved heat conduction; many units use aluminum fin stacks combined with a machined copper baseplate for short thermal path.
- Fin stack: High-density aluminum fins with optimized spacing for forced-air server fans.
- Retention method: Screw-down bracket with hardened fasteners for secure installation and repeated serviceability.
- Recommended TIM: High-performance thermal compound or thermal pad (check whether the unit ships with pre-applied thermal interface material).
Fan performance and electrical
- Fan size: Typically a server-specific axial fan matched to the heatsink's airflow requirements.
- RPM range: Multi-speed capable to support idle-to-full-load thermal demands; controlled via PWM in supported boards.
- Airflow: Measured in CFM (cubic feet per minute); select assemblies have specified airflow ratings to match the CPU TDP.
- Noise: Ranges depend on RPM and fan bearing; expect server-grade acoustics optimized for datacenter use rather than consumer silence.
- Power: Standard fan power draw compatible with motherboard fan header current limits; ensure your fan header or fan splitter can supply the necessary amperage.
Performance Benchmarks and Thermal Capacity
For mission-critical environments, data on thermal capacity (illustrated by delta-T at given CPU loads) matters. While vendor datasheets are the authoritative source, here are typical performance expectations and how to interpret them.
How cooling performance is measured
Cooling efficiency is commonly expressed in terms of:
- ΔT (delta-T) at X watts: Temperature difference between CPU Tcase and ambient at specified TDP.
- Steady-state thermal resistance (°C/W): Lower numbers indicate better heat conduction and dissipation.
- Airflow (CFM): Higher airflow generally improves heat transfer across the fin surface but must be matched to chassis ventilation design.
Interpreting real-world data
In practice, the 878922-001 and equivalent OEM assemblies are engineered to maintain safe operating temperatures for the ML110 G10's supported CPU lineup under standard datacenter ventilation and fan policies. If your environment has restricted airflow (closed cabinets, high ambient temps), consider supplemental chassis cooling or higher-capacity assemblies tested for elevated ambient conditions.
Compatibility Cross-Reference & Part Number Variants
Part numbers, manufacturing revisions, and compatible substitute codes can cause confusion. Below is a concise cross-reference approach.
Common cross-reference approach
- Always confirm the HPE part number 878922-001 on the product label or vendor listing.
- Look for manufacturer date codes and revision numbers to ensure the unit matches the ML110 G10 mechanical revisions.
- When substituting with third-party units, match mechanical measurements (height, mounting hole spacing), fan connector type, and rated thermal capacity.
Related HPE part numbers to be aware of
HPE and resellers sometimes list updated or alternate part numbers; verify with HPE parts catalogs or trusted vendor documentation to avoid purchasing an incompatible unit.
Use Cases and Application Scenarios
The HPE 878922-001 and its equivalents serve a variety of operational needs across IT shops, including:
Enterprise server maintenance
Routine replacement for proactive maintenance to avoid unexpected thermal-related outages; stocking genuine spare parts in a spare parts inventory reduces Mean Time To Repair (MTTR).
Data center refresh and repair
Quick swaps during server refresh cycles — technicians benefit from OEM fitment to expedite rollbacks and preserve server warranties.
Lab and staging environments
Engineers testing firmware or performance often swap cooling solutions; having an OEM 878922-001 ensures test conditions match production hardware.
Design and Construction
This HPE CPU fan and heatsink features a standard radiator equipped with a screw-down mechanism. The design allows for precise and stable attachment to the processor, minimizing vibration and maximizing thermal transfer. Its construction uses high-grade materials to ensure durability, longevity, and consistent performance across demanding server environments.
Performance and Efficiency
Efficient cooling is critical for high-performance servers. The 878922-001 unit delivers exceptional thermal management by combining a precision-engineered heatsink with a high-speed fan. This combination ensures continuous airflow over the CPU, reducing heat accumulation and enhancing overall server performance.
Radiator Technology
The standard screw-down radiator design is engineered for consistent heat dissipation and secure attachment. This approach not only simplifies installation but also maximizes contact between the heatsink and CPU, resulting in superior cooling efficiency under continuous heavy-load operations.
